Effects Of Plating Conditions Research Articles

Study on the 12 in. wafer uniformity of high aspect ratio TSV filling by using rotation cathode

In 2.5/3D(2.5/3-dimensional) packages, TSV (Through-Silicon Via) technology is crucial for achieving high performance and low power consumption. However, there are still challenges when it comes to uniformly filling TSVs on 300 mm whole wafers without defects. This study focuses on addressing this issue by designing a rotating cathode carrier with a 300 mm diameter, simulating the plating environment in different areas of a 300 mm wafer. The effects of plating conditions, such as cathode rotational speed and chip mounting position, on the filling of TSV are investigated. The TSV have a hole diameter of 10 μm and a depth of 100 μm.The findings reveal that when the cathode carrier rotates at a speed of 30 rpm, different areas of the analog wafer exhibit complete filling of TSV. Additionally, a surface plating layer with an average thickness of approximately 3 μm is obtained.

Investigation of Effects of Electroplating Conditions on TEMPO-Oxidized Cellulose Nanofiber Composited Nickel Electroplated Films

The effects of plating conditions on nickel (Ni) electroplated films composited with 2,2,6,6-tetramethylpiperidine 1-oxyl (TEMPO)-oxidized CNFs (CNFs) were investigated. Plating experiments were performed by varying the amount of CNFs added to the Watt's bath, the current density, and the stirring speed. The plated film obtained at 3 g/L, 2.5 A/cm2, and 300 rpm of them respectively, reached an average 483 HV of the surface hardness, which was the highest in this study. The surface hardness of the conventional Ni film without CNFs plated under the same conditions was an average of 239 HV, and the hardness improvement effect was more than twice as high. The hardness improvement effect due to dispersion enhancement tended to increase as more CNFs were more finely and densely composited into the Ni film, although different trends were observed when the current density was varied.

무전해 Cu 도금층의 두께와 표면조도에 미치는 도금조건의 영향

무전해 Cu 도금층의 두께와 표면조도에 미치는 도금조건의 영향

Effects of Plating Conditions on Electroless Ni–Co–P Coating Prepared from Lactate-Citrate-Ammonia Solution

An electroless Ni­Co­P plating solution, which composed of lactate-citrate-ammonia as buffering and complexing agents, has been prepared. Various electroless Ni­Co­P coatings were deposited from this solution to investigate the effects of ion concentrations, pH and bath temperatures on the chemical composition of the deposited coating. The results showed that the present electroless Ni­Co­P plating solution has a potential for depositing Ni­Co­P coatings with an average composition of 71mass% Ni, 17mass% Co and 12mass% P. The plating solution showed a good stability to deposit the coatings with a small deviation in compositions over wide ranges of pH values in acid region, bath temperatures, cobalt-ion and hypophosphite-ion concentrations. The nickel content of the Ni­Co­P coating could be tailored by varying nickelion concentrations of plating bath. The Ni content increased with increasing nickel-ion concentration while the opposite trend was observed for Co content. However, plating in the alkaline region showed significant changes in coating composition and plating behavior. Systematic UV­ visible absorption measurement showed the change of complex ions from acid to alkaline regions, which could explain the different plating behavior in those regions. [doi:10.2320/matertrans.M2012292]

Characterization of Cr-Ni Multilayers from Chromium(III)-Nickel(II) Baths Using Pulse-Current Plating

The effects of plating conditions were investigated on the composition of Cr-Ni alloys electrodeposited on brass substrates from a chromium(III)-nickel(II) bath at 30oC. At 10 A/dm2, Ni-rich deposits were obtained, whereas and at 40 A/dm2, Cr-rich deposits were formed. Hence, pulsed-current electroplating was used to develop Cr- and Ni-rich multi- layers with a thickness modulation of tens of nanometers. Microstructures of Cr-Ni multilayers were investigated by transmission electron microscopy (TEM) and electron diffraction.

Effects of Plating Conditions in Preparing Plate-Type Nickel Catalyst by Electroless Plating on the Decomposition Property of Methanol

Preparation of the plate-type catalyst is important in constructing a wall reactor system that has an effective exchange of heat energy and a quick load response. In the preparation of the plate-type catalyst by electroless plating consisting of the displacement of aluminum by zinc and the deposition of nickel by chemical reduction, this study identified the effect of different plating conditions on the catalytic properties of the prepared plate-type catalysts, for preparing a suitable plate-type catalyst for decomposition of methanol. Using an alkaline bath in chemical reduction plating or immersing the prepared catalyst in an alkaline solution after plating improved the activity of decomposing methanol but decreased the selectivity of products. The results show that preparing conditions had significant effects on catalytic properties of plate-type catalyst. Furthermore, in preparing a catalyst with high decomposition performance that was prepared using an alkaline zinc plating bath and a neutral nickel plating bath, an experiment was performed to examine in detail the effect of zinc plating conditions, such as a bath temperature and an added amount of sodium hydroxide, on the decomposition property of the catalyst. The results show that the catalyst had the greatest decomposition performance when it was prepared at a bath temperature of 293 K and with an addition of 90 g·l–1 of sodium hydroxide.

Spin-spray ferrite-plated Co ferrite films with high coercivity for perpendicular magnetic recording media

Effects of plating conditions on Co ferrite-plated films for perpendicular magnetic recording media were investigated to increase coercivity H/sub c/spl perp// and remanence ratio (M/sub r//M/sub s/)/sub /spl perp// in the plane perpendicular to the film. By optimizing a concentration of NaNO/sub 2/ in an oxidizing solution and the deposition rate, Co-Ni ferrite films with H/sub c/spl perp// of 3200 Oe and (M/sub r//M/sub s/)/sub /spl perp// of 0.6 were obtained without any heat-treatment. Disk media with higher H/sub c/spl perp// and (M/sub r//M/sub s/)/sub /spl perp//, exhibited reproduced waveforms of di-pluses shape and better frequency responses than that with lower /sub c/spl perp// and (M/sub r//M/sub s/)/sub /spl perp//. Media noise did not increase with increasing frequency, suggesting that the transition noise was low.

Effects of plating conditions on the microstructure of 80Sn20Pb electrodeposits from an organic sulphonate bath

Alloy deposits of 80Sn20Pb were electroplated on a Cu-based lead frame alloy (PMC-102) from an organic sulphonate bath using direct or pulsed currents and the effects of the plating parameters on the microstructure of the electrodeposits were investigated. At a cathodic current density of 10 A dm −2 the addition of a grain-refining additive to the bath increased the cathodic polarization for the deposition of 80Sn20Pb to about 560 mV greater than that in the bath without the additive, thereby producing an extremely fine deposit. The grain morphology of the electrodeposits formed by pulsed currents was also extremely fine at low duty cycle and low frequency but gradually coarsened with increasing duty cycle and/or frequency, approaching that of the deposit formed by direct current. The electrodeposits of 80Sn20Pb were identified as a mixture of Pb and β-Sn crystals. While the Pb crystals were randomly oriented, the β-Sn crystals exhibited {200} preferred orientation which gradually transformed to {220} with decreasing duty cycle and/or frequency of pulsed plating.

Influence of plating conditions on tribology behaviour of Ni–SiC composite deposit

The effects of plating conditions on the characteristics of a Ni–SiC composite deposit were studied. It was found that the wear resistance of the composite deposit increased as the quantity of SiC powder in the deposit increased. The matrix hardness of Ni was not affected by the applied current density. A relationship is proposed in which the hardness Hv of the Ni–SiC deposit is predicted to vary with the volume/raction of SiC in the deposit α as Hv=650α1/2+185. It was als%und that the SiC powder in the deposit tended to concentrate on the surface during lubricated wear testing. This helps to retain the lubricating oil by the formation of an oil membrane on the surface of the composite deposit. This behaviour can decrease the friction coefficient and enhance the tribology resistance of the composite deposit.MST/2080

リン青銅スズ，はんだめっき材の熱はく離に及ぼすめっき条件の影響

The effects of plating conditions on the thermal peeling of tin or solder plated phosphor-bronze were examined.Main findings are summarized as follows.1. The resistance to thermal peeling of reflowed tin films with 0.5μm copper undercoat was highest when plated in a phenolsulfonate bath, while that of reflowed tin films with no undercoat was highest when plated in a sulfate bath.2. Thermal peeling took place more readily and was less sensitive to plating bath composition for bright solder films than for reflowed tin films. In phosphor-bronze that was bright solder plated in a methanesulfonate bath, thermal peeling was observed after aging at room temperature for 16, 000h.3. An arrhenius type relation was obtained between the aging time to peeling and aging the temperature.

鋼板の１回掛けほうろうを目的としたＣｏ‐Ｍｏ合金めっきの研究

Co-Mo alloy plating from ammonium-citrate bath was studied for the purpose of developing a new pretreatment method for direct-on enameling on steel sheet.The effect of plating conditions on the Co/Mo alloy ratio was studied first, and on the basis of the results, the effect of the Co/Mo ratio on adhesion for direct-on enameling was examined.It was found that: 1) Co/Mo alloy ratio in the electrodeposit was affected by bath composition including the concentration ratio of CoSO4 to Na-citrate, the ammonium hydroxide concentration and pH. 2) To obtain excellent adhesion for direct-on enameling, Co-Mo alloy deposits on steel sheet should have Co/Mo ratio of less than 1.4:1 and coating weight of more than 1.5g/m2 for both Co and Mo.

The microstructure of electrodeposited chromium

Electrodeposition of chromium, i.e., chrome plating, is widely used to provide corrosion protection or wear resistance to other materials following fabrication to their finished dimensions and shape. Chrome plate is characterized by hardness as high as 1200 KHN and initially large internal tensile, i.e., contractile, stresses that result in extensive cracking and partial relaxation of the stresses although further electroplating may result in the generation of compressive stresses. These, and other properties of electrodeposited chromium, depend on plating conditions such as current density and bath temperature. Scanning and transmission electron microscopy have been utilized to determine the effects of plating conditions on microstructure.Chromium was electrodeposited on 4340 steel to a thickness of 100 μm, with a conventional chromic acid solution under the following conditions: Sample A, 30 amp/Dm2 at 55°C, resulting in a bright hard (1150 KHN) coating; Sample B, 120 amp/Dm2 at 85°C, resulting in a dull and softer (650 KHN) coating.

Effect of Plating Conditions on Performance of Porous Cadmium Deposit

Abstract Porous cadmium plating of high-strength steel was evaluated in terms of corrosion behavior, hydrogen embrittlement of the steel due to plating, and the relationship of these parameters to the microstructure of the electrodeposit. Emphasis was placed on investigating this system under conditions which can be encountered in industrial plating. High plating current density and low cadmium concentration of the plating bath result in severe hydrogen embrittlement. The rate of cadmium dissolution, when Cd plated steel was galvanically coupled to Al 2024, is found to increase linearly with increasing plating current density and is also affected by variation of the cadmium concentration of the plating bath. Additions of Na2CO3 tend to decrease cadmium dissolution rate, while FeSO4 additions have no apparent effect on either corrosion behavior of the Cd coating or hydrogen embrittlement of the steel. Scanning electron photomicrographs indicate that the plate structure is crystalline, containing numerous microscopic pores, some of which penetrate to the surface of the steel substrate. These pores are thought to facilitate the escape (during subsequent baking) of hydrogen trapped within the plate.

The Effects of Plating Conditions on Porosity in Gold Electrodeposits

SummaryThe porosity of gold deposited from alkaline cyanide, acid citrate, and neutral phosphate baths, has been investigated as a function of operating conditions and composition. All operating conditions, and all except one of the composition variables investigated, can markedly affect porosity. Two bright golds (Au-Ag and Au-Ni) were, other things being equal, less porous than the equivalent dull coatings. The low metal content (Au=8 g/I) often adopted, whilst not precluding the plating of coatings of very low porosity, makes the optimum operating conditions critical in all baths.

無電解コバルトメッキ膜の磁性に及ぼすメッキ条件の影響-カセイアルカリ性浴について-

Effects of pH, temperature, and composition of two different caustic alkaline electroless cobalt plating baths on magnetic properties of deposited films were investigated and the following results were obtained.(1) The films deposited from caustic alkaline electroless plating solution had the maximum flux density (Bs) of about 10, 000 gauss. The remanent flux density (Br) varied in the range of 2, 000-7, 000 gauss and the coercive force (Hc) varied in the range of a few -800 oersted, according to plating conditions.(2) In general, tartrate bath gave a film with high coercivity, while citrate bath had a tendency to deposit a film with low coercivity.(3) The characteristics of these baths were discussed about the behavior of cobalt-complex in the baths.(4) The effects of plating conditions on magnetic properties of the films were not the same in both baths, but they could be explained on the characteristics of each bath and the theory of ferromagnetic fine grains.

アンモニアアルカリ性無電解コバルトメッキ膜の磁性に及ぼすメッキ条件の影響

Effects of pH, temperature, and composition of bath on magnetic properties of deposited films were studied for two sorts of ammoniacal alkaline electroless cobalt plating baths.The results obtained were as follows.(1) The films deposited from ammoniacal alkaline baths had the maximum flux density (Bs) of about 9, 000 gauss, coercive force (Hc) of 200 oersted, and squareness of 0.5-0.7 in general. The variations in the above values of films depending upon plating conditions were found to be less than those of films deposited from caustic alkaline baths reported in the previous paper.(2) In general, citrate bath (A-C type) was stable and gave films of higher squareness. However, the magnetic properties of these deposits greatly depended upon pH and concentration of complexing agents.(3) Tartrate bath (A-T type) was less stable than citrate bath and generally gave films of lower squareness. However, the dependence of coercive force of these films upon the bath conditions such as pH and concentration of complexing agents was little.(4) The difference in the effects of plating conditions of the both baths on the magnetic properties of films was systematically explained by each characteristics of the baths.

RIFAMYCIN. XXXIII. ISOLATION OF ACTINOPHAGES ACTIVE ON STREPTOMYCES MEDITERRANEI AND CHARACTERISTICS OF PHAGE-RESISTANT STRAINS.

Five actinophages highly specific for Streptomyces mediterranei were isolated from lysed broth cultures. Studies were performed on the effect of plating conditions on plaque formation. The development of phage-resistant strains of S. mediterranei not only eliminated the phage but also significantly increased rifamycin yields. The phage-resistant cultures proved to be more unstable than the original sensitive strain. Maintenance of the cultures as frozen vegetative mycelium assured culture stability and reproducibility of the results. Strict aseptic precautions throughout the laboratories and fermentation areas did not eliminate the danger of phage infection; effective control was obtained only with the introduction of resistant strains. S. mediterranei phages proved to be highly specific for calcium as an adsorption cofactor; addition of calcium-sequestering agents to sensitive mycelium completely prevented its lysis by the phage. The resistant strains developed were capable of adsorbing the phage and of releasing it without multiplication upon aging of the mycelium. No marked morphological, cultural, or biochemical differences were found among the various phage-resistant strains.

シアン化銅メッキ浴の平滑能について

Using the experimental method as in the previous paper, effects of plating conditions on the levelling power of copper cyanide plating bath were investigated.As a result obtained it is concluded that the levelling power of copper cyanide bath depends largely upon cathodic concentration polarization.Some other important findings will be explained in detail and discussed in this paper.

光沢シアン化銅メッキの研究 (第3報)

Observation of Microscopic structure of the cross section of bright copper deposits leads to the following conclusions:Without brightener, the crystal mostly grows parpendicular to the base and the band structure does not appear, even though the periodic reverse process, periodic alternate current process, or periodic intermittent process is applied. With brightener, however, the band structure appear, especially when each of the above processes is applied its clearness increases.The effect of plating conditions on band structure is that the clearness increases with an increase of brighteners, free cyanide, potassium salt and C. D., which means alternate deposits of copper and brightener.The appearance of band structure, however, does not necessarily bring about brightness. The band structure is nothing but a phenomenon caused by brightening action and the section of the bright deposit shows structure that seem to retard the growth parpendicular to the base.