A recycling process consisting of hydrochloric acid leaching with ferric chloride as an oxidant and cementation using Sn powder followed by solvent extraction was proposed to separate Sn from Pb-free solder. Leaching tests showed that the effect of HCl concentration on the leaching efficiency of Sn was negligible in 1.0–2.0kmol·m−3 HCl, and the efficiency was lower at 0.5kmol·m−3 HCl. Higher temperature yielded higher dissolution rates of Sn and Cu in the beginning of leaching; the leaching efficiencies of Sn and Cu increased to more than 99% within 90min, but Ag was not detected, indicating that Ag could be separated successfully from Sn and Cu. When more than 1g of Sn powder was added to 100ml of leach solution containing 98.1g·m−3 Cu, Cu ions could be removed from the leach solution by the cementation reaction. In the solvent extraction test using tri-butyl phosphate (TBP) diluted with kerosene, the extraction efficiency of Sn increased with increasing TBP volume ratio in the organic phase, and 99.9% of Sn was extracted selectively by 3-time solvent extraction with 15% TBP and 1:1 O/A ratio at 30°C.