Impact physics provide equation of state information for material performance in extreme environments. There is some evidence that the underlying microsctructure impacts the response at some velocities1. One way to probe the microstructure is through controlled electrodeposition. Both pulse plating and chemical additives are known to modify the grain structure during electrodeposition. However, additives can be incorporated in the coating and influence the resulting properties such as hardness and mechanical properties. Therefore, we aim to control electroformed coatings through exclusively using square wave pulses. There are some preliminary studies indicating control of grain size of electroplated coatings, however, process control has, so far, only been studied by post characterization analysis on often limited subsets2–5. A methodical approach leads to a deeper mechanistic understanding of isolating plating parameters to control the grain structure. In this work, we explore the impact of current density, duty cycle, frequency and pulse widths/heights and their impacts on the grain structure. We show uniform grain structure through thick films (>3mm), and control over the texture and orientation of grains (Fig. 1). (1) Escobedo, J. P.; Dennis-Koller, D.; Cerreta, E. K.; Patterson, B. M.; Bronkhorst, C. A.; Hansen, B. L.; Tonks, D.; Lebensohn, R. A. Effects of Grain Size and Boundary Structure on the Dynamic Tensile Response of Copper. J. Appl. Phys. 2011, 110 (3), 033513. https://doi.org/10.1063/1.3607294. (2) Marro, J. B.; Darroudi, T.; Okoro, C. A.; Obeng, Y. S.; Richardson, K. C. The Influence of Pulse Plating Frequency and Duty Cycle on the Microstructure and Stress State of Electroplated Copper Films. Thin Solid Films 2017, 621, 91–97. https://doi.org/10.1016/j.tsf.2016.11.047. (3) Chan, K. C.; Qu, N. S.; Zhu, D. Crystallographic Textures and Magnetic Properties of Electroformed Nickel. J. Appl. Electrochem. 1998, 28 (10), 1095–1099. https://doi.org/10.1023/A:1003452615814. (4) Sivasakthi, P.; Sekar, R.; Bapu, G. N. K. R. Pulse Electrodeposited Nickel Using Sulphamate Electrolyte for Hardness and Corrosion Resistance. Mater. Res. Bull. 2015, 70, 832–839. https://doi.org/10.1016/j.materresbull.2015.06.019. (5) El-Sherik, A. M.; Erb, U.; Page, J. Microstructural Evolution in Pulse Plated Nickel Electrodeposits. Surf. Coat. Technol. 1997, 88 (1), 70–78. https://doi.org/10.1016/S0257-8972(96)02928-3. Figure 1
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