Mo films were deposited on a polyimide substrate by dual magnetron sputtering in an UniCoad 200 vacuum unit with an unbalanced magnetic system. The dependence of the characteristics of the obtained Mo films on photon annealing and cryogenic temperature was studied. The photonic annealing of Mo films was carried out at temperatures of 200 °C and 300 °C. For cooling Mo films, liquid nitrogen was used (t = -190°С). The characteristics of the films were investigated using X-ray diffraction, scanning electron microscopy and scanning probe microscopy. The results are presented on the change in specific electrical resistance, diffuse reflection spectra and adhesion strength of Mo films. It is shown that photon annealing at different temperatures does not affect the intensity of the X-ray diffractogram peaks of the Mo coating. After exposure, at a cryogenic temperature, an insignificant change in the X-ray diffractogram occurs, a shift of the diffractogram peak (110) is observed to large angles 2θ from 40.72° to 40.89°. The obtained Mo coating has a columnar structure in the form of tightly packed polycrystallites, oriented perpendicular to the substrate of the polyimide film. Mo coating on a polyimide substrate is resistant to sudden thermal exposure at temperatures not higher than 300 °C. Processing the resulting coating with liquid nitrogen leads to strong cracking of the Mo coating. At the same time, on samples with a coating thickness of 380–400 nm, exfoliation of the Mo coating, in the place of fracture, is not observed. The adhesive strength of the Mo coating with a polyimide film is quite high – 1.11 ± 0.05 GPa. Photon annealing does not reduce the adhesive strength of the Mo coating. The Mo film under conditions of cryogenic temperature (0.89 ± 0.08 GPa) has the worst adhesion strength.
Read full abstract