Electrical resistivities of vitreous materials in the system AsSTe (composition: 12.7–43.2 at % As, 33.4–87.3 at % S and 0–41.0 at % Te) were measured in the temperature range from −70 to 120°C. The resistivity at room temperature, ranging from 10 8 to 10 17 ohm · cm, decreased with increasing tellurium content. The activation energy varied from 1.15 to 2.71 eV, and showed a similar composition dependence as in the case of resistivity. From the bond-structural approach it was suggested that the chemical bonds involving tellurium in the materials contribute to the decrease in resistivity in the order of TeTe > TeAs > TeS. The relationship between the resistivity at 25°C, ϱ 25, and activation energy, E th, was represented by the empirical formula E th = 0.1195 log ϱ 25 + 0.0899, except for a sulfur-rich material with a relatively small amount (10%) of tellurium and the materials without tellurium (the system AsS). From this formula it was derived that the pre-exponential factor ϱ 25 in ϱ = ϱ 0 exp ( E th/2 kT) was independent of composition. On the basis of the above independency, the suggestion is given that the drift mobility of charge carriers is independent of composition and that the concentration of charge carriers is the predominant factor controlling the resistivity of vitreous materials in the system AsSTe. The resistivity increased when the dispersed phase of crystalline tellurium was formed in a vitreous matrix. The amount of crystalline tellurium included in partially crystalline materials was determined from the values of the resistivity by using Maxwell's equation. This type of determination agreed fairly well with that obtained by the X-ray diffraction measurement.
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