The interactions between buried defects and impurities formed by MeV-level nitrogen ion implantation in silicon have been investigated. The interactions between the oxygen atoms in a CZ Si wafer and the defects introduced during annealing after implantation are discussed in terms of the amount, nature, morphology, and depth distribution of the defects. Oxygen atoms are found to be gettered in two different regions in the implanted layers. A shallow oxygen peak appears in regions near the surface (between 0.5 and 1.5 µm). A deep oxygen peak is also observed at locations with secondary defects, which mainly consist of elongated dislocation loops and dislocation networks. In this case, the gettered oxygen content is not especially influenced by the amount or nature of the generated defects. Rather, there is a good correlation between the gettered oxygen amount and the mismatch stress induced by the atomic radius difference.
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