Design Of Optical Interconnects Research Articles

Modeling and optimization of photonic integrated Silicon-LiNbO3 hybrid interferometer for E-S-C-L wavelength band

Abstract The Silicon on Insulator (SOI) is a potential technology for thin-film optical waveguide, enabling the design of optical interconnects, including modulators and interferometers. The manuscript presents the broadband modulator for phase and intensity modulation. The nanoscale optimized interferometric modulator utilizes Silicon (Si) and Electro-optic material Lithium Niobate (LiNbO3) as the guiding material to work in terahertz regime, without any bends in the structure. Optimization of the structure is validated by the evaluation of the confinement factor at the operational wavelength of 1550 nm using Finite Element Method (FEM) based simulation. To excite the SOI interferometric modulator, an external RF signal with a maximum amplitude of 5 V is used. The hybrid structure of Si and LiNbO3-based modulators shows the electro-optic phenomenon caused by nonlinearities, namely the Pockels effect and Kerr effect, which in turn changes the effective mode index, providing π phase shift along with −0.92 dB/cm absorption loss, 117 μm electrode length at V π Volts and 265 nm 3dB optical bandwidth covering the E-S-C-L optical bands. The device footprint calculated is 667 μm2, whereas the active region footprint is ∼46.8 μm2.

Polymer waveguide photonic interconnect for multichip communications-based heterogeneous integration

An on-package optical interconnect design is proposed for the first time, with silicon photonics in conjunction with the polymer-on-glass interposer technology to enable heterogeneous integration. Glass substrates are used for low-cost, high reliability packaging while silicon photonics allows for high-speed modulation and wavelength division multiplexing within a small footprint. By combining silicon-photonic and benzo-cyclobutene-on-glass interposer technologies, we propose a scalable on-package photonic interconnect that can provide data rates >224 Gb / s for medium-reach links. Our proposed interconnect considers microring modulators and high-speed detectors available in photonic-foundry processes. We present the power-budget analysis to identify the key limiting parameters toward achieving an energy consumption of < 1 pJ / bit.

Modeling Free-Space Opticalk-aryn-Cube Wormhole Networks

This paper presents an optical interconnect model fork-aryn-cube network topologies based on free-space analysis. This model integrates relevant parameters inherent to optics with traditional network parameters to make it applicable for performance evaluation of parallel processor optical network designs. We apply this model to a free-space diffractive–reflective optical interconnect design and compare our results with electronic-based networks.

Design methods for space-variant optical interconnections to achieve optimum power throughput

Optoelectronic systems based on space-variant optics give great freedom to the system designer in terms of interconnect topologies. One feature of space-variant systems is that they can achieve a high interconnect density. However, this density is achieved by having large arrays of diffractive elements with very small apertures relative to the propagation distances involved. Thus diffraction losses from the finite apertures can significantly affect power throughput for these types of systems, regardless of the diffractive efficiencies of the optical elements involved. Therefore it is desirable that this loss be minimized. We present several space-variant optical interconnect design methods (for both one-to-one and fan-out interconnects) and compare them in terms of power throughput for diffraction-limited interconnect distances. Both numerical simulations and experimental results are presented.

Bending performance of clamped optical fibers: stresses due to the end off-set

Misalignment of the openings in the frame and the terminal fixture could cause significant bending stresses in an optical fiber located within this frame. We developed simple and easy-to-use formulas which enable one to evaluate these stresses and determine the minimum allowable length of the clamped portion of the fiber for the given misalignment. Our stress analysis model considers the favorable effect of the fiber coating compliance. The results can be of help in the physical design of optical interconnects with misalignments.