Deposition Of CuS Research Articles

Bridge for the thermodynamics and kinetics of electrochemical corrosion: Designing a corrosion–resistant HP–13Cr stainless steel by Cu alloying for use in an H2S–containing geothermal environment

The dissolution–ionization–diffusion–deposition (DIDD) model was used for developing a corrosion–resistant stainless steel (SS) by the means of alloying and the guidelines for the process were proposed. The novel HP–13Cr–Cu SS was designed to resist corrosion in H2S–containing geothermal environment. The results indicated that the preferential deposition of CuS promoted the heterogeneous nucleation rate of Cr2O3, FeCr2O3, and FeS, which formed denser corrosion product layer. As a result, this alloy exhibited a low corrosion rate and a high sulfide stress cracking (SSC) resistance. The results were consistent with the theoretical calculation conducted by the DIDD model.

Stirring effect of CuS deposition over cotton thread for photocatalysis and electrical application

In the present work CuS coated cotton thread was synthesized by co-precipitation method with (WS) and without stirring effect (WOS). XRD and FESEM were used to analyze the structural morphology of CuS over thread. The crystallite size for WS and WOS were 25.1 nm and 22.1 nm. The band calculated were 1.48 and 1.60 eV for WS and WOS. The XPS analysis confirm the presence of Cu+, Cu2+, Cu° charge state. MB organic dye was tested for degradation and reported degradation up to 94% of 50 ml MB dye in 20 min with using low catalytic weight 0.4 gm. IV measurement was also taken to study the electronic properties of coated threads. The high current under light presence and high degradation of MB dye through WOS thread is discussed in this work.

Molten salt shielded preparation of rice straw biochars doped by copper sulfide for elemental mercury capture

Biochar adsorbents are obtained from rice straw under an air atmosphere through a simple eutectic salt (K2CO3+Li2CO3) synthesis approach. Pristine biochars present relatively low mercury capture ability probably due to their small specific surface areas with less adsorption sites. Deposition of CuS can notably strengthen the mercury adsorption ability of the biochars. The best CuS content is 5 wt% associated with nearly complete mercury capture within 60–100 °C. The Hg0 removal ability of CuS-doped biochars are subtly degraded by NO and negligibly affected by SO2. Cu2+ and S2− species function as adsorption sites, resulting in the production of HgS accompanied by the reduction of partial surface Cu2+ ions into low-valence Cu+ ions.

Solution ALD: A Versatility Process for Various Material Growth

We have proposed and demonstrated a novel thin film deposition technique by transferring the principles of atomic layer deposition (ALD), known with gaseous precursors, towards precursors dissolved in a liquid. The technique can also be considered as a generalization of already established methods such as the ‘layer by layer’ growth or the ‘successive ion layer adsorption and reaction’ (SILAR). 'Solution ALD' (sALD) shares the fundamental properties of standard ‘gas ALD’ (gALD), specially the self-limiting growth and the ability to coat conformally deep pores. It has been already shown that it is possible to transfer standard reactions from gALD to sALD such as TiO2 deposition . However, sALD also offers novel opportunities such as overcoming the need for volatile and thermally robust precursors.To illustrate this, we establish sALD procedures for depositing films of non oxides layers such as Pb-compound deposition, MOF, selenides and sulfides. Those examples highlight how ionic, polar, or high-molecular weight precursors that only exist in the condensed phase are now rendered amenable to being utilized in surface-controlled thin film formation by sALD for depositing materials that would otherwise be more difficult or more expensive to achieve by gALD or hazardous. The deposition was achieved on small (2 cm*1 cm) and large samples (up to 10 cm*10 cm). The ALD behavior has been shown. The influence of the deposition parameters on the morphology, the crystalline structure and the chemical composition has been investigated by scanning electron microscopy, atomic force microscopy, grazing incidence x-ray diffraction and x-ray photoelectron spectroscopy. Additionally, the nucleation is studied in function of chemical pretreatment to control the gowth and allow selective deposition of CuS, ZnS and SnS.This particular ALD process offer the growth of high quality and crystalline layers in middle conditions with the use of low cost and environmental friendly precursors. Y. Wu, D. Döhler, M. Barr, E Oks,M. Wolf, L. Santinacci and J. Bachmann, Nano Lett. 2015, 15, 6379 J. Fichtner, Y. Wu, J. Hitzenberger, T. Drewello and J. Bachmann, ECS J. Solid State Sci. Technol. 2017, 6, N171 Figure 1

Bifunctional flexible fabrics with excellent Joule heating and electromagnetic interference shielding performance based on copper sulfide/glass fiber composites.

Flexible and wearable electronic technology is in great demand with the rise of smart electronic systems. Among these, multifunctional systems with high performance at low cost have attracted extensive attention of scholars from the practical application perspective. However, the fabrication of devices with multifunctionality without sacrificing their connatural flexibility advantages remains a huge challenge. In this study, a CuS-modified glass fiber first acts as a bifunctional wearable electronic device for superior thermal management and electromagnetic interference (EMI) shielding. Specifically, the inherent glass fiber was initially modified with a silane coupling agent for the amino group (-NH2) functionalization followed by further CuS deposition via a facile electroless plating technology. Interestingly, due to the strong interaction between CuS and the glass fiber through the coordinate -NH2 and Cu2+, the prepared copper sulfide/glass fibers (CuS/GFs) not only keep the inherent flexibility and lightness of the fiber substrate, but also have excellent electrothermal conversion performance accompanied by a wide temperature range (38 °C-209 °C), low working voltage (0.3 V-1.5 V), and rapid response time (reaching 209 °C within 10 s at 1.5 V). Moreover, the prepared CuS/GF textile also exhibits interesting electromagnetic interference shielding efficiency (EMI SE) of 61 dB as well as a high specific shielding effectiveness up to 6130.65 dB cm2 g-1 with a CuS mass loading of 9.95 mg cm-2. These features confirm the potential of CuS/GFs as a flexible, wearable, and efficient electrical heater and EMI shielding material for the new type of intelligent electronic devices.

CuS/g-C3N4 Composite as High-Performance Counter Electrode Materials in QDSCs

Graphic-carbon nitride (g-C3N4) microsheet loaded with CuS nanocrystals was coated on fluorine-doped tin oxide (FTO) conductive glass to act as counter electrodes (CEs) in quantum dots sensitized solar cells (QDSCs) for the first time. The successive ionic layer absorption and reaction (SILAR) method was employed to fabricate CuS nanocrystals in different amounts onto the surface of g-C3N4 microsheets through varying deposition cycle times (0, 1, 3, 5, and 7). From the results of SEM and TEM, it was found that the amount of CuS nanocrystals deposited on the surface of g-C3N4 increased gradually with the CuS deposition cycle times. According to the results of the electrical impedance spectrum, series resistance and charge transfer impedance exhibited a declining trend until CuS deposition cycle time was up to 5, which was proved through Tafel curves as well. According to current density–voltage curve results of all these cell samples, g-C3N4 with five cycle times QDSC yielded the highest power conversion efficiency and corresponding charge transfer resistance was the lowest, while the cell based on CuS/g-C3N4 CE of seven cycle times presented worse photovoltaic performance due to the aggregation of excessive CuS particles. The optimized CuS/g-C3N4 CEs possessed the fast electron transfer and superior electrocatalytic ability, which are critical in high-performance QDSCs.

Voltammetric nonenzymatic sensing of glucose by using a porous nanohybrid composed of CuS@SiO2 spheres and polypyrrole.

Porous spheres of CuS@SiO2 were obtained by deposition of CuS on silica spheres through a one-step chemical method. Subsequently, polypyrrole (PPy) was deposited on the CuS@SiO2 spheres. The formation of the porous spheres was elucidated by control experiments and physical characterizations. The nanohybrid was placed on a glassy carbon electrode (GCE) surface where it displays good electrocatalytic activity in terms of glucose electrooxidation with an optimum at a working potential of 0.55V (vs. Ag/AgCl) in 0.1M NaOH solution. The PPy-CuS@SiO2 achieves an extremely high sensitivity (505.3μAmM-1cm-2), wide linear range (10μM-4.2mM), lowdetection limit (1.0μM), short response time (˂0.5s), high selectivity, long-term durability, and reproducibility. The fabricated electrode based on PPy-CuS@SiO2 was further used for the determination of glucose in blood sample with good recoveries. Graphical abstract Schematic representation of the method for fabrication of polypyrrole-coated porous CuS@SiO2 sphere.

Combustion synthesis, characterization and photocatalytic application of CuS/Bi4Ti3O12 p-n heterojunction materials towards efficient degradation of 2-methyl-4-chlorophenoxyacetic acid herbicide under visible light

In this study, a series of CuS/Bi4Ti3O12 p-n heterojunction materials were synthesized by a two-step process. Initially, the Aurivillius phase Bi4Ti3O12 (BT) was synthesized by a facile combustion route using urea as a fuel. The Bi4Ti3O12 was subsequently modified by deposition of CuS (5–20 wt%) using a hydrothermal route to prepare the heterojunction materials. The methods of synthesis and calcination temperature were important factors which influenced the morphology, particle size and phase purity of Bi4Ti3O12 material. Phase pure BT nanoplates with planar dimension of 150–200 nm and thickness between 50 and 70 nm were obtained at a calcination temperature of 600 °C. Pure CuS prepared by hydrothermal method, contained hierarchical microspheres with diameter in the range of 1.2–1.6 μm. The heterostructure materials exhibited hierarchical flower like structure consisting of ultrathin CuS nanosheets and BT-nanoflakes. HRTEM and microstructural study revealed microscopic close interaction between the two phases. The optical and electrical measurement study suggested significant improvement in visible light absorption (400–800 nm) and charge carrier separation due to heterojunction formation. The CuS/Bi4Ti3O12 materials showed excellent photocatalytic activity for aqueous phase degradation of 2-methyl-4-chlorophenoxyacetic acid (MCPA) herbicide under visible light (>95% degradation in 3 h). The rate constant for CuS/Bi4Ti3O12 materials was 4.5 times higher than the pure BT material towards MCPA degradation. The OH and O2– radicals have been identified as the reactive species, the formation of which was confirmed by spectrometric method using terephthalic acid and nitroblue tetrazolium as molecular probes. The mechanism of MCPA degradation over the photocatalyst surface has also been elucidated using LC-ESI-MS, TOC and scavenger experiments.

High figure of merit p-type transparent conducting thin film based on solution processed CuS-ZnS nanocomposite

Until now only n-type transparent conducting films (TCFs) have accomplished sufficient maturity while p-type TCFs are still in infancy which limits the success of all-transparent electronics. Considerable endeavors are made till date for development of new p-type TCFs with limited success. Here, we report a highly transparent and conducting p-type thin films (∼60 nm) based on CuS-ZnS nanocomposite deposited by simple chemical bath deposition method at ∼80 °C on glass substrates using different x values (0.1, 0.35, 0.6, 0.8) where x = Cu (mol %)/(Cu+Zn) (mol%). Grazing incidence X-ray diffractometry, X-ray photoelectron spectroscopy, field emission scanning electron microscopy, and atomic force microscopy are used to evaluate the structural and microstructural characteristics of the films. The existence of ZnS phase is seen only for x ≤ 0.6 due to a preferential deposition of CuS which helps to retain a significant visible light transparency for x = 0.6 with a small drop in the conductivity value as compared to CuS. Thus the film with x = 0.6 is found to have the optimum electrical properties with resistivity, hole concentration, and mobility values of 1.03×10−3 Ω-cm, 4.16 × 1022 cm−3, and 0.15 cm2/Vs respectively as well as an optical transmission value of 83% at 550 nm. An unprecedented figure of merit value of 9.2 × 10−4 Ω−1 is obtained for the optimized film which is not reported till date to our knowledge. A p-n heterojunction is fabricated using the optimized film on n-GaN which shows a rectification ratio of 3.06 × 104 at 2 V indicating a great potential as p-type TCF for flexible transparent electronics.

Preparation of Copper Sulfide Deposition on Modified Poly(Ethylene Terephtalate) Fibres with Good Conductivity

The immobilization of CuS on the surface of poly (ethylene terephtalate) (PET) fibres was carried out by the functionalization of PET fibres with chitosan (CS), followed by the chemical deposition method. Crosslinked chitosan with NH2 functionality was used as a chelator to absorb copper ions, which can successfully initiate CuS deposition in the following chemical deposition stage. The CuS-loaded fibres were characterised by scanning electron microscopy, X-ray diffraction, infrared spectroscopy and thermal gravimetry, respectively. The properties of tensile and conductivity were also investigated. The lowest surface resistance 42 Ω/cm of the treated PET fibres was obtained when the CS concentration was 1.0%.

Electronic paper from facile, two-step deposition of CuS

A method is proposed to impregnate regular cellulosic paper with semi-conductive particles of copper sulfide. The method consists of a simple two-step procedure: first, metal (Cu) ions in solution are applied to the paper, and second, the aqueous application of a source of sulfide ions, which leads to the spontaneous formation of metal sulfides in the pores of the paper matrix, as evidenced by a color change. This methodology is easy to implement and involves very low-cost and easily available chemical agents, leading to the production of low-price semiconductor devices. In this work, the microscopic morphology and crystalline structures of films were studied, as well as their optical and electrical properties. The proposed sample preparation route could potentially be implemented in further research using different metals in order to obtain tunable physical properties, such as band gap, conductivity and conductivity carrier types.

Nanostructured Multilayer Composite Films of Manganese Dioxide/Nickel/Copper Sulfide Deposited on Polyethylene Terephthalate Supporting Substrate

Nanostructured multilayer manganese dioxide/nickel/copper sulfide (MnO2/Ni/CuS) composite films were successfully deposited onto supporting polyethylene terephthalate (PET) substrate through the sequential deposition of CuS, Ni, and MnO2 thin films by chemical bath deposition, electrodeposition, and horizontal submersion deposition techniques, respectively. Deposition of each thin‐film layer was optimized by varying deposition parameters and conditions associated with specific deposition technique. Both CuS and Ni thin films were optimized for their electrical conductivity whereas MnO2 thin film was optimized for its microstructure and charge capacity. The electrochemical properties of nanostructured multilayer MnO2/Ni/CuS composite films were evaluated by cyclic voltammetry as electrode materials of an electrochemical capacitor prototype in a dual‐planar device configuration. Cyclic voltammogram in mild Na2SO4 aqueous electrolyte exhibited a featureless and almost rectangular shape which was indicative of the ideal capacitive behavior and high cycling reversibility of the electrochemical capacitor prototype. Nanostructured multilayer MnO2/Ni/CuS composite films on supporting polyethylene terephthalate (PET) substrate could potentially be utilized as electrode materials for the fabrication of high performance electrochemical capacitors.

Nanostructured Multilayer Manganese Dioxide/Nickel/Copper Sulfite (MnO2/Ni/CuS) Composite Films for Electrochemical Applications

Nanostructured multilayer manganese dioxide/nickel/copper sulfite (MnO2/Ni/CuS) composite films were successfully deposited on supporting polyethylene terephathalate (PET) substrate through the sequential deposition of CuS, Ni and MnO2 thin films by chemical bath deposition, electrodeposition, and horizontal submersion deposition techniques, respectively. Deposition of each thin-film layer was optimized through varying deposition parameters and conditions associated with specific deposition technique. Both CuS and Ni thin films were optimized for their electrical conductivity whereas MnO2 thin film was optimized for its microstructure and charge capacity. The electrochemical properties of nanostructured multilayer MnO2/Ni/CuS composite films were evaluated by cyclic voltammetry as electrode materials of electrochemical capacitor prototype in a dual planar device configuration. Cyclic voltammograms in mild Na2SO4 aqueous electrolyte exhibited a featureless and almost rectangular shape which was indicative of ideal capacitive behavior and high cycling reversibility for prolonged cycling up to 1,500 cycles. Nanostructured multilayer MnO2/Ni/CuS composite films on supporting polyethylene terephathalate (PET) substrate could potentially be utilized as electrode materials for the fabrication of high performance electrochemical capacitors.

Monte Carlo simulation to reveal the copper dissolution kinetics of an ion selective electrode based on copper sulfide

The present work aims at studying copper dissolution of a Cu2+ ion-selective electrode based on a CuS thin film. The electrode is prepared using electrochemical deposition of CuS on a silicon substrate. The obtained film exhibits an apparent cohesive granular structure with an average grain size of about 33μm, a small porosity content (<4%) and a thickness of about 7.48μm. The Cu2+ electrochemical response shows a nearly Nernstian behavior in the range of pCu 6–1. The copper dissolution is experimentally studied in a wide pH range. In order to quantitatively predict copper mass dissolution, an original numerical model is developed based on Monte Carlo simulation. Our main hypothesis is based on dissolution probability that triggers the whole dissolution process through solution/electrode surface exchanges. Several probability forms are suggested accounting for the real observed electrochemical kinetics. The experimental results show that, under a low pH, the dissolution process severely leads to the consumption of large material. Moreover, our predictions suggest a dissolution profile as a two-stage process irrespective of pH. Our numerical model is able to fit correctly the observed kinetics considering an exponential probability form under all pH conditions.

Uniform Decoration of Linker-Free Quantum Dots onto Mesoporous TiO2 Using Liquid Carbon Dioxide

Use of liquid carbon dioxide (l-CO2) in the uniform and dense deposition of CuS, PbS, or CdS quantum dots (QDs) with 2.5−4.5 nm in diameter onto mesoporous TiO2 films for quantum dot sensitized solar cell (QDSSC) applications is described. The low surface tension and the low viscosity of l-CO2 lead to uniform deposition of QDs.

Effect of weak reductant on properties of electroless copper polyacrylonitrile nanocomposites for electromagnetic interference shielding

AbstractIn this work, the electroless copper method with different reductant compositions (NaHSO3/Na2 S2O3·5H2O and Na2S2O3·5H2O) without sensitizing and activating, was used to deposit copper‐sulfide deposition on the polyacrylonitrile (PAN) surface for electromagnetic interference (EMI) shielding materials. The weak reductant, NaHSO3, in the electroless copper method was used to control the phase of copper‐sulfide deposition. The Cux(x=1–1.8)S was deposited on the PAN (CuxS‐PAN) by reductant composition (NaHSO3/Na2S2O3·5H2O) and the Cux(x=1–1.8)S deposition of CuxS‐PAN possesses three kinds of copper‐sulfide phases (CuS, Cu1.75S and Cu1.8S). However, the electroless copper with reductant was only Na2S2O3·5H2O (without weak reductant, NaHSO3), the hexagonal CuS deposition was plated on the PAN (CuS‐PAN) and increased the EMI shielding effectiveness of CuS‐PAN composites about 10–15 dB. In this study, the best EMI SE of CuS‐PAN and CuxS‐PAN composites were about 27–30 dB and 15–17 dB respectively, as the cupric ion concentration was 0.24 M. The volume resistivity of CuS‐PAN composite was about 1000 times lower than that of CuxS‐PAN composite and lowest volume resistivity of CuS‐PAN composites was 0.012 Ω cm, as the cupric ion concentration was 0.24 M. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010

Electroless deposition of the copper sulfide coating on polyacrylonitrile with a chelating agent of triethanolamine and its EMI Shielding Effectiveness

In this study, an effective deposition of CuS on PAN film was proposed by an electroless plating method with the reduction agents NaHSO 3 and Na 2S 2O 3·5H 2O and a chelating agent (triethanolamine, TEA). A variety of concentrations of TEA were added to obtain the anchoring effect and chelating effect in the electroless plating bath. The GIA-XRD and laser Raman analysis indicated that the deposited layer consisted of CuS. The mechanism of the copper sulfide (CuS) growth and the electromagnetic interference shielding effectiveness (EMI SE) of the composite were studied. It was found that the vinyl acetate remained in PAN substrate would be purged due to the swelling effect by TEA solution. Then the anchoring effect occurred due to the hydrogen bonding between the pits of PAN substrate and TEA. Consequently, the copper sulfide layer was deposited effectively by the electroless plating reaction. The swelling degree ( S d) was proposed and evaluated from the FT-IR spectra. The relationship between swelling degree of the PAN composite and TEA concentration ( C) is expressed as: S d = 0.07 + 1.00 × e^(− 15.15 C). On the other hand, the FESEM micrograph showed that the average thickness of copper sulfide increased from 76 nm to 247 nm when the concentration of TEA increased from 0.00 M to 0.60 M. As a result, the EMI SE of the composites increased from 10–12 dB to 25–27 dB.

H 2S Removal with Cupric Chloride for Producing Sulfur

A novel technology of removing H 2S with cupric chloride solution was developed in this paper. Cupric as the form of CuS deposition, the CuS produced was then oxidized by excessive cupric ion in another reactor meanwhile cupric ion that has been consumed can be recovered by the oxidization of CuCl − 2 with oxygen in air, and the solution can be circulated. Moreover, the leaching kinetics of CuS by cupric ion was studied. The removal efficiency of H 2S is close to 100%, and the required operating condition is mild. Compared with other wet oxidization methods, no raw material is consumed except O 2 in air, the process has no secondary pollution and no problem of degradation and scale, and the absorbent is much stable and reliable.

CuS-poly (N-isopropylacryl-amide-co-acrylic acid) composite micro-spheres with patterned surface structures: preparation and characterization

N-isopropylacrylamide (NIPAM) and acrylic acid (AA) copolymer microspheres with various compositions were prepared by reverse suspension polymerization technique. The microspheres thus prepared were employed as micro-reactors for the deposition of CuS. In this way, several CuS-P(NIPAM-co-AA) composite microspheres with different surface morphologies were prepared. It was demonstrated that the surface structures of the composite microspheres can be tailored to a certain extent by varying the ratio of the two monomer units in the template (microgels) and/or the amount of CuS deposited. It is in prospect that the inherent advantages of microgel templates (the size, composition, charge nature and density, and crosslinking density could be easily controlled) would make the microgel template method extremely useful in the preparation of composite microspheres with different patterned surface structures.