Debonding Method Research Articles

Comparison of the Debonding Characteristics of Conventional and New Debonding Instrument used for Ceramic, Composite and Metallic Brackets - An Invitro Study.

Debonding procedure is time consuming and damaging to the enamel if performed with improper technique. Various debonding methods include: the conventional methods that use pliers or wrenches, an ultrasonic method, electrothermal devices, air pressure impulse devices, diamond burs to grind the brackets off the tooth surface and lasers. Among all these methods, using debonding pliers is most convenient and effective method but has been reported to cause damage to the teeth. Recently, a New Debonding Instrument designed specifically for ceramic and composite brackets has been introduced. As this is a new instrument, little information is available on efficacy of this instrument. The purpose of this study was to evaluate the debonding characteristics of both "the conventional debonding Pliers" and "the New debonding instrument" when removing ceramic, composite and metallic brackets. One Hundred Thirty eight extracted maxillary premolar teeth were collected and divided into two Groups: Group A and Group B (n = 69) respectively. They were further divided into 3 subGroups (n = 23) each according to the types of brackets to be bonded. In subGroups A1 and B1{stainless steel};A2 and B2{ceramic};A3 and B3{composite}adhesive precoated maxillary premolar brackets were used. Among them {ceramic and composite} adhesive pre-coated maxillary premolar brackets were bonded. All the teeth were etched using 37% phosphoric acid for 15 seconds and the brackets were bonded using Transbond XT primer. Brackets were debonded using Conventional Debonding Plier and New Debonding Instrument (Group B). After debonding, the enamel surface of each tooth was examined under stereo microscope (10X magnifications). Amodifiedadhesive remnant index (ARI) was used to quantify the amount of remaining adhesive on each tooth. The observations demonstrate that the results of New Debonding Instrument for debonding of metal, ceramic and composite brackets were statistically significantly different (p = 0.04) and superior from the results of conventional debonding Pliers. The debonding efficiency of New Debonding Instrument is better than the debonding efficiency of Conventional Debonding Pliers for use of metal, ceramic and composite brackets respectively.

CO2 laser debonding of a ceramic bracket bonded with orthodontic adhesive containing thermal expansion microcapsules

We have been studying an easy bracket debonding method using heating of an orthodontic adhesive containing thermal expansion microcapsules. However, heating with a high-temperature heater brings obvious risks of burns around the oral cavity. Thus, we examined safer and more effective bracket debonding methods. The purpose of this in vitro study was to examine the reduction in debonding strength and the time taken using a bracket bonded with an orthodontic adhesive containing thermal expansion microcapsules and a CO2 laser as the heating method while maintaining safety. Ceramic brackets were bonded to bovine permanent mandibular incisors using bonding materials containing various microcapsule contents (0, 30, and 40wt%), and the bond strengths were measured after laser irradiation for 4, 5, and 6s and compared with nonlaser-treated groups. Subsequently, the temperature in the pulp chamber during laser irradiation was measured. After laser irradiation for 5 or 6s, the bond strengths of the adhesive containing 40wt% microcapsules were significantly decreased to ∼0.40 - 0.48-fold (4.6-5.5MPa) compared with the nonlaser groups. The mean temperature rise of the pulp chamber was 4.3°C with laser irradiation for 6s, which was less than that required to induce pulp damage. Based on these results, we conclude that the combined use of a CO2 laser and an orthodontic adhesive containing thermal expansion microcapsules can be effective and safe for debonding ceramic brackets with less enamel damage or tooth pain.

Orthodontic bracket debonding: risk of enamel fracture

Until now, it is not clear if various procedures of bracket debonding differ with regard to their risk of enamel fracture. Therefore, the objective of the present study was to compare these procedures biomechanically for assessing the risk of complications. An anisotropic finite element method (FEM) model of the mandibular bone including periodontal ligament, enamel, dentin, and an orthodontic bracket was created. The morphology based on the CT data of an anatomical specimen. Typical loading conditions were defined for each method of bracket debonding (compression, shearing off, twisting off). Shortly before the adhesive's break, the induced stress in enamel, periodontal ligament, and in the alveolar bone was measured. The statistical analysis of the obtained values was performed in SPSS 19.0. Relatively high stresses occurred in the enamel using frontal torque (max. 44.18MPa). With shearing off, the stresses were also high (max. 41.96MPa), and additionally high loads occurred on the alveolar bone as well (max. 11.79MPa). Moderate maximum values in enamel and alveolar bone appeared during the compression of the bracket wings (max. 37.12MPa) and during debonding by lateral torque (max. 35.18MPa). The present simulation results indicate that the risk of enamel fracture may depend on the individual debonding procedure. Further clinical trials are necessary to confirm that. For patients with prior periodontal disease or loosened teeth, a debonding procedure by compression of the bracket wings is recommended, since here the load for the periodontal structures of the tooth is lowest.

20.2: Invited Paper: Reliability Improvement of Flexible AMOLED Based on Auxiliary Functional Film Technology

AbstractThe flexible universal plane (FlexUP) technology was demonstrated with Polyimide (PI) substrate and a novel de‐bonding method. The transparent amorphous oxide semiconductor (TAOS) TFT, and OLEDs were developed along with the FlexUP technology, aiming to improve the reliability of flexible AMOLED. TAOS TFT successfully improved the bias stress reliability (T50) to approximately over 10 years, and the life time of flexible AMOLED were improved by the new passivation structure and encapsulation materials.

Room Temperature Debonding - An Enabling Technology for TSV and 3D Integration

Thin wafer processing is a critical technology for TSV manufacturing and 3D integration. Thin wafer processing allows to reduce the aspect ratio of the vias, thereby reducing the total processing cost and enables ultra-thin packages for handheld applications. Temporary bonding to a rigid support carrier and debonding after backside processing have been used for thin wafer handling/processing for many years. However, so far all the debonding methods imposed severe limitations on the manufacturability. For light induced debonding the carrier had to be transparent and for solvent based debonding the carrier had to be perforated. For thermally induced debonding, “slide-off debonding” the debonding temperature had to be below the reflow temperature of the solder bumps, which limited the maximal process temperature of the adhesive. In this paper we describe a new debonding method at room temperature. This new technology decouples the debonding process from the adhesive properties, which creates a de facto material independent debonding standard. As the debonding process does not rely on the adhesive properties a major boundary for adhesive engineering has been removed. The debonding method is compatible with bumps or pillars in the bond interface as well as on the backside of the wafer stack. No force is applied on the bumps during debonding which results in very high yields.

Evaluation of enamel surfaces after bracket debonding: An in-vivo study with scanning electron microscopy

The purposes of this in-vivo study were to compare the modes of failure of uncoated and adhesive precoated metal brackets by using the adhesive remnant index, and to assess the quality of the enamel surface after cleanup by using the enamel damage index. Twelve Victory brackets (group A) and 12 Victory adhesive precoated brackets (group B) (both, 3M Unitek, Monrovia, Calif) were bonded onto the maxillary second premolars of 12 volunteers. The uncoated brackets were bonded with Transbond XT adhesive resin (3M Unitek). Replicas of the teeth were made before bonding (T0), after bracket removal (T1), and after cleanup (T2). Scanning electron microscope images of all labial enamel surfaces were taken at T0, T1, and T2, and these were evaluated according to the adhesive remnant index and the enamel damage index. Evaluation of the adhesive remnant index scores with the chi-square test showed no statistically significant difference between the groups. Evaluation of the enamel damage index grades with the sign test for paired samples showed a statistically significant difference (P <0.01) between T0 and T2. Uncoated and precoated brackets exhibited similar debonding patterns. Additionally, the debonding method tested in this study did not restore the original enamel surface, although there was no clinically relevant enamel damage.

Rebonding performance of different ceramic brackets conditioned with a new silane coupling agent

The objective of this study was to investigate the rebonding effect of a new silane coupling agent on various ceramic brackets bonded to ceramic specimen. Different ceramic brackets (Fascination 2, Clarity SL, and In-OvationC) were assigned to three groups: rebonding with new silane coupling agent, rebonding with conventional silane coupling agent, or regular bonding as control (n = 16). Bracket adhesion was calculated with a shear test in a universal testing machine. The bracket-composite-ceramic interface was evaluated using the adhesive remnant index score. One-way analysis of variance was applied for inferential statistics. Rebonding with the new silane coupling agent resulted in high shear bond strengths (SBSs; mean values: 37.44-41.24 MPa) and ceramic specimen fractures. Rebonding with the conventional silane coupling agent resulted in significantly (P < 0.001) lower clinically adequate SBS (mean values: 20.20-29.92 MPa) with the least ceramic specimen fractures. Regularly bonded ceramic brackets resulted in clinically adequate to high SBS (mean values: 17.06-41.56 MPa) depending on their bracket base design. Rebonded ceramic brackets showed sufficient SBS to ceramic specimen surfaces. However, increased bracket adhesion was associated with a risk of ceramic specimen surface damage. Therefore, ceramic brackets rebonded with the new silane coupling should be debonded cautiously using alternative debonding methods.

Effects of different application durations of scanning laser method on debonding strength of laminate veneers

Porcelain laminate veneers as esthetic and minimally invasive restorations are being used as an alternative to full veneer crowns. However, the removal of porcelain veneers that have failed may be an uncomfortable and time-consuming procedure because of the high bond strength between the porcelain laminate veneers and the tooth surface. The purpose of this study was to prepare a simple and reliable method for porcelain laminate veneer debonding by using an Er:YAG laser with the scanning method and to determine the amount of lasing time required. Eighty cylindrical specimens with a thickness of 0.7 mm and a diameter of 5 mm were fabricated from Empress II ceramic material. They were cemented on the labial surface of extracted bovine mandibular incisors using Variolink II (Ivoclar Vivadent AG, Schaan, Liechtenstein) and light cured for 40 s. The specimens were randomly divided into four groups of 20. The first group was assigned as the control group and no laser application was performed. The Er:YAG laser was applied on each specimen in the other three study groups for 3, 6, and 9 s by using the scanning method. One second after the lasing, a mechanical force was applied to remove the laminate veneers by using an Instron Universal Testing machine. Results of this study exhibited statistically significant differences between the control group and the three study groups. Intergroup comparison of shear bond strengths of the three study groups showed a statistically significant difference (p = 0.0001). This study showed that all three application times of Er-YAG laser were effective for debonding ceramic laminate veneers by softening the adhesive resin.

The influence of dental loupes on the quality of adhesive removal in orthodontic debonding

Bracket bonding has been a major advance in orthodontic treatment. However, the method of debonding can lead to diverse problems such as enamel fractures, enamel loss and enamel scratching. In this clinical investigation we aimed to evaluate the influence of wearing dental loupes on enamel damage during the debonding procedure. 22 consecutive patients were randomly assigned in a split-mouth study to evaluate adhesive removal with and without the use of dental loupes (2.5×, LED headlight). Tooth replicas in epoxy resin were made from silicone impressions. Electron microscopic images (50× magnification) of 394 buccal enamel surfaces were evaluated according to an enamel damage index (EDI), line angle grooves (LAG) and composite residues (CR) on anterior teeth, premolars and molars. The EDI revealed highly significant advantages for debonding with dental loupes, with which the EDI was significantly higher for molars, while still less than without dental loupes. We detected no differences between the tooth groups without dental loupes. We found significantly fewer LAG on anterior teeth debonded with dental loupes. CR were fewer in the dental loupes group, and we noted no significant differences between the tooth groups. Dental loupes affect the quality of the debonding procedure, resulting in less enamel damage and composite residue, as well as fewer LAG compared to the control group. We therefore strongly recommend the use of dental loupes in orthodontic debonding procedures.

Impact of adhesive rheology on stress-distortion of bonded plastic substrates for flexible electronics applications

For fabrication of flexible electronics using standard microelectronics toolsets, a temporary bond–debond method has been developed that requires minimization of the distortion of bonded flexible substrate and bow of bonded system (flexible substrate-adhesive-carrier) during processing. To elucidate the critical parameters of the adhesive used in the bonding that control the stress (bow) and distortion, adhesives with different viscoelastic properties are examined systematically. By blending a high modulus adhesive into a low modulus adhesive, the storage modulus, loss modulus and loss factor of the adhesive can be tuned by orders of magnitude. Detailed examination of the impact of these three rheological parameters on the stress and distortion of bonded system reveals that the relative viscoelastic flow properties of the bonding adhesive to that of the bonded flexible substrate are directly correlated to bow and distortion. When the loss factor of the adhesive is less than that for the plastic substrate, precise registration of layers during photolithography is observed. These results provide insight into the rheological parameters critical to the adhesive formulations for the temporary bond–debond method in the fabrication of flexible electronics.

Ceramic Bracket Debonding by Tm:YAP Laser Irradiation

The aim of this study was to prepare a simple and reliable method for ceramic bracket debonding, ensuring minimal changes in the enamel structure and an acceptable temperature rise in the pulp. Ceramic bracket debonding is based on the principle of degrading the strength of adhesive resin between the tooth and ceramic bracket. The search for a safe and efficient method of adhesive resin removal following debonding has resulted in the introduction of a wide range of instruments and procedures, among which proper use of laser irradiation can be promising. The debonding of two types of ceramic brackets utilized a diode-pumped Thulium:Ytterbium-Aluminium-Perovskite (Tm:YAP) microchip laser generating irradiation at a wavelength of 1998 nm (spot size 3 mm; focused by lens), with two power settings (1-2 W). Loss of enamel and residual resin on teeth, as well as rise in temperature inside the tooth were subsequently investigated in detail. A 1W power of irradiation during a 60-sec period resulted in a temperature rise from 3 to 4°C in the approximate root location. This power is also suitable for debracketing from the point of view of damage to enamel lying below the bracket. Only a slight damage to the enamel was registered by SEM compared to conventional bracket removal. Use of a Tm:YAP laser (wavelength 1998 nm, power 1 W, irradiance 14 W/cm(2), interacting time 60 sec) which is at the same time compact and small enough to be used in the dental practice, together with moderate cooling, could be an efficient tool for debracketing.

Impulse debracketing compared to conventional debonding

To evaluate impulse debonding compared to three conventional methods for bracket removal in relation to the damage caused to the enamel surface. Ninety-six osteotomed third molars were randomly assigned to two study groups (n = 48) for bracket bonding with either a composite adhesive system (CAS) or a glass-ionomeric cement (GIC). These two groups were then each randomly divided into four subgroups (n = 12) according to the method of debonding using (1) bracket removal pliers, (2) a side-cutter, (3) a lift-off debracketing instrument, or (4) an air pressure pulse device. Following debonding and corresponding postprocessing with either a finishing bur (CAS) or ultrasound (GIC), the enamel surfaces were assessed for damage, adhesive residues, and the need for postprocessing using scanning electron microscopy and the Adhesive Remnant Index, and the surfaces were compared in terms of mode of removal and type of adhesive using Fisher's exact test (alpha = 5%). No significant differences were found between the two different types of adhesives (CAS, GIC) in terms of the amount of damage to the enamel. Portions of enamel damage were found for impulse debonding/0%<bracket removal pliers/4%<lift-off debracketing instrument/17%<side-cutter/21%. The highest Adhesive Remnant Index grades were seen for impulse debonding. GIC residues after postprocessing using ultrasound were seen in 79%, compared to 48% after rotational postprocessing of CAS residues. Impulse debonding provides a good alternative to conventional debonding methods, as the adhesion is usually separated at the bracket-adhesive interface, thereby avoiding enamel damage, independent of the adhesive used.

Suitability of orthodontic brackets for rebonding and reworking following removal by air pressure pulses and conventional debracketing techniques

To test the null hypothesis that there are no significant differences in the reusability of debonded brackets with regard to debonding technique and adhesive used. Ninety-six osteotomed third molars were randomly assigned to two study groups (n = 48) for bonding of a 0.018-inch bracket (Ormesh, Ormco) with either a composite adhesive (Mono-Lok2; RMO) or a glass ionomer cement (GIC; Fuji Ortho LC;GC). Each of these two groups were then randomly divided into four subgroups (n = 12) according to the method of debonding using (1) bracket removal pliers (BRP; Dentaurum), (2) a side cutter (SC; Dentaurum), (3) a lift-off debracketing instrument (LODI; 3M-Unitek), or (4) an air pressure pulse device (CoronaFlex; KaVo). The brackets were subsequently assessed visually for reusability and reworkability with 2x magnification and by pull testing with a 0.017- x 0.025-inch steel archwire. The proportions of reusable brackets were individually compared in terms of mode of removal and with regard to adhesives using the Fisher exact test (alpha = 5%). The null hypothesis was rejected. Not taking into account the debonding method, brackets bonded with GIC were judged to a significant extent (81%; n = 39; P < .01) to be reworkable compared with those bonded with composite (56%; n = 27). All brackets in both adhesive groups removed with either the LODI or the CoronaFlex were found to be reusable, whereas 79% (46%) of the brackets removed with the BRP (SC) were not. The proportion of reusable brackets differed significantly between modes of removal (P < .01). With regard to bracket reusability, the SC and the BRP cannot be recommended for debonding brackets, especially in combination with a composite adhesive.

A model for predicting the shear bearing capacity of FRP-strengthened beams

The shear failure of reinforced concrete beams needs more attention than the bending failure since no or only small warning precedes the failure. For this reason, it is of utmost importance to understand the shear bearing capacity and also to be able to undertake significant rehabilitation work if necessary. In this paper, a design model for the shear strengthening of concrete beams by using fiber-reinforced polymers (FRP) is presented, and the limitations of the truss model analogy are highlighted. The fracture mechanics approach is used in analyzing the bond behavior between the FRP composites and concrete. The fracture energy of concrete and the axial rigidity of the FRP are considered to be the most important parameters. The effective strain in the FRP when the debonding occurs is determined. The limitations of the anchorage length over the cross section are analyzed. A simple iterative design method for the shear debonding is finally proposed.

Development of a device to measure bracket debonding force in vivo

The purposes of this study were to develop a device to measure bracket debonding force in vivo and to evaluate, in vitro, the bond strength obtained with the device and with tensile and shear bond strength (SBS) tests performed in a universal testing machine. The device was developed using polypropylene pliers (3M Unitek). The basic principle consisted of measuring the applied force to debond, using two strain gauges (Kyowa) bonded to the region of major deformation of the plier handles. The crowns of 75 bovine incisors were embedded in acrylic resin and orthodontic brackets were bonded to the facial surface with Transbond XT (3M Unitek). In group A (n = 25) debonding was carried out with the device, while tensile bond strength testing was performed in group B (n = 25) and SBS testing in group C (n = 25). A universal testing machine (EMIC-DL-2,000) was used for these last two groups. According to analysis of variance and Tukey's test (alpha = 0.05), the mean bond strength for group C (7.71 MPa) was statistically higher than for groups A (2.98 MPa) and B (2.69 MPa). Groups A and B were not statistically different. The device was shown to be feasible to obtain in vivo bond strength values for orthodontic brackets, and that the bond strength values were dependent on the method and direction of debonding.

Fabrication Techniques for Thin-Film Silicon Layer Transfer

New, cost effective fabrication processes for bonding and thinning silicon wafers for improving device performance and creating 3-D structures were investigated. Wafer bonding and de-bonding are key fabrication steps for many applications such as 3-D devices. Double bond transfer and single bond processes to fabricate silicon thin films on permanent substrates were investigated. Polymer and direct bonding techniques were studied to create both permanent and temporary bonds. De-bonding methods utilizing wet chemistry and laser lift-off are discussed.

Influence of Face/Core Interface on Debond Toughness of Foam and Balsa Cored Sandwich

The face/core debond fracture resistance of sandwich panels consisting of glass fiber/vinylester face sheets over a 155 kg/m 3 end-grain balsa wood core and a 200 kg/m 3 PVC foam core has been examined. The sandwich panels were prepared using a variety of resin infusion strategies with the objective of comparing face/core adhesion. The resin infusion methods include machining grooves in the core, adding a layer of continuous filament mat at the face/core interface, resin distribution medium on top of the face sheet fibers, and no infusion aid but significantly delayed gel-time by addition of cure inhibitor. The tilted sandwich debond (TSD) method is used for determination of debond fracture toughness (G C). It was found that the use of a continuous filament mat between the face and core provided the toughest interface, although the panels prepared using the resin cure inhibitor are almost as tough. Overall, the PVC foam core provided higher toughness than the balsa wood core.

In vivo debonding strength and enamel damage in two orthodontic debonding methods

Bracket debonding strength related to diverse debonding methods and enamel demage has not been assessed in vivo. The study hypothetized a direct relationship between these three parameters. Debonding strength was measured clinically in the wings method and base method on 50 patients in a split mouth method using a calibrated debonding plier. Brackets from 30 of these patients were scanned in SEM and EDAX for adhesive remnant index and enamel calcium remnants. Base method debonding force was significantly greater than wings method (163.5±68.7N, 106.1±66.2N, respectively, p<0.001). A positive adhesive remnant index score was found in both methods (68.7%, 66.7%, respectively). Debonding strength vs. adhesive remnant index or calcium index scores were not correlated. However, the latter two were significantly correlated (0.524<R<0.895, p<0.031). Half of the debonding failures developed at the adhesive enamel interface. The results warnts the potential of enamel damage during debonding.

Quasi–static studies of the deformation and failure of PBX 9501

This paper examines the influence of microstructure on the quasi–static failure of PBX 9501, a polymer–bonded explosive (PBX) manufactured for the Los Alamos National Laboratory in America. Optical microscopy has been used to examine qualitatively cracked and pristine material. Consequent on the manufacturing process, the explosive crystals display angular features and natural facets. In addition, considerable growth twinning, internal defects and voidage has been observed. These defects are found significantly to alter the failure path. In common with other PBXs, failure paths tend to run around the long straight edges of the explosive filler and avoid regions of fine filler and binder. Explosive crystals were found to fracture due either to cracks propagating from another region or internal defects. These observations are confirmed by the use of high–resolution moire interferometry. This sensitive optical technique allows the deformation of the sample to be measured up to and including the point of failure. By taking white–light micrographs that are in exact registration with the measured displacement maps, the influence of the underlying microstructure can be seen.

Debonding orthodontic ceramic brackets by ultrasonic instrumentation

Breakage of ceramic brackets because of brittleness may cause such problems as aspiration of fragments and injury by flying debris. Portions remaining on the tooth must be laboriously ground off with a handpiece. This study investigated a potential method of lowering the force required to remove ceramic brackets, i.e., use of an ultrasonic chisel. Ceramic brackets were bonded to extracted incisors and canines. The degree of cure of a light-activated cement was systematically varied with different exposure times to a curing light. The brackets were sheared from the teeth with a universal testing machine and a chisel tip on a Cavitron. The ultrasonic chisel markedly reduced the force required to debond the brackets; however, the time of application averaged 16.6 seconds. Reducing the degree of cure of the cement had only a slight effect on the time required and the forces generated. This method of debonding is not recommended without further development. (A M J O RTHOD D ENTOFAC O RTHOP 1995;108:262-66.)