Abstract
AbstractThe flexible universal plane (FlexUP) technology was demonstrated with Polyimide (PI) substrate and a novel de‐bonding method. The transparent amorphous oxide semiconductor (TAOS) TFT, and OLEDs were developed along with the FlexUP technology, aiming to improve the reliability of flexible AMOLED. TAOS TFT successfully improved the bias stress reliability (T50) to approximately over 10 years, and the life time of flexible AMOLED were improved by the new passivation structure and encapsulation materials.
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