The electrochemical behaviour of copper-silver alloys was studied in 0.5 M NaOH containing sulphide ions using cyclic voltammetric and potentiodynamic anodic polarization techniques between the hydrogen and the oxygen evolution reactions under the effect of different variables such as reversal potential, scan rate, sulphide ion concentration, temperature and number of repeated cycles. The anodic sweep of potential was characterized by the appearance of three potential regions: sulphide attack potential region, copper dissolution potential region and silver dissolution potential region, prior to the oxygen evolution reaction. The first potential region was characterized by the appearance of three anodic peaks A1, A2 and A3, which were related to the formation of CuxS, Ag2S and sulphur on the electrode surface. The formation of CuxS and Ag2S was associated with the formation of pits on the electrode surface. Scanning electron microscope was used to examine the electrode surface for pitting corrosion. In the copper dissolution potential region, copper dissolved selectively that was associated with the appearance of three anodic peaks A4, A5 and A6, which are related to the formation of Cu2O, Cu(OH)2 and CuO, respectively. In the third potential region, silver dissolves, which was associated with the appearance of two anodic peaks A8 and A9 , which were related to the formation of Ag2O and both of Ag2O2 and soluble SO4 2 ¯ compounds, respectively. X-ray diffraction analysis confirmed the existence of Ag2S, CuxS, Ag2O and CuO on alloy I potentiodynamically polarized to 400 mV. The reverse sweep was characterized by the appearance of one activation peak A10 and eight cathodic peaks C1, C2, C3, C4, C5, C6, C8, and C9.