Corrosion Mechanism Of Copper Research Articles

Effect of Sulfide Addition on the Corrosion Mechanism of Copper in Saline Groundwater Solution

The interaction of copper with sulfide-containing simulated saline groundwater is studied by electrochemical techniques (voltammetry, current-time transients, and electrochemical impedance spectroscopy, EIS) complemented with surface and cross-sectional microscopic observations and energy dispersive spectroscopic analyses. Both experimental findings and quantitative interpretation of EIS data using previously published kinetic models indicate that no continuous adherent barrier-type layer is formed on Cu in sulfide-containing groundwater, thus precluding the possibility of the development of localized corrosion modes.

Investigation on the Electrochemical Corrosion Behavior of TP2 Copper and Influence of BTA in Organic Acid Environment

In this work, the corrosion behavior of copper in a simulated organic acid environment containing formic acid and acetic acid was investigated by electrochemical testing and surface characterization. In addition to deducing the corrosion mechanism of copper in the organic acid corrosion environment, the corrosion inhibitor BTA was also used to slow down the corrosion of copper by organic acid. The results show that the corrosion rate of copper in the two groups of organic acids first decreases and then increases with the immersion time. Microelectrochemical (Scanning Vibrating Electrode Technique) results shows that the anodic peak of the sample is higher in formic acid. Formic acid is more corrosive. The corrosion products of red copper gradually increased in the two groups of organic acid atmospheres, and the final corrosion products were cuprous oxide, copper formate particles and copper acetate hydrate, respectively. When the concentration of BTA is 0.5 g/L, the electrochemical activity of TP2 copper is weakened, the surface of the sample is relatively smooth, there are no large corrosion pits, and the corrosion rate is reduced.

Corrosion mechanism of copper in seawater containing the bacterial pyomelanin with redox activity

Copper has bactericidal properties, which can effectively prevent the adhesion of biofilms and thus avoid microbiologically influenced corrosion. In this study, however, pigmented Pseudoalteromonas lipolytica strain producing pyomelanin can accelerate the corrosion of copper even after the bacteria are destroyed by copper ions. Moreover, uniform and pit corrosion were most serious in an abiotic pyomelanin solution. Surface characterization and electrochemical analysis indicated that pyomelanin was the key corrosive factor, owing to its redox cycling properties. The pyomelanin may participate in the oxidation of Cu to Cu (Ⅰ). This study introduces a new perspective for inhibiting MIC of copper.

Corrosion Mechanism of Copper in Seawater Containing the Bacterial Pyomelanin with Redox Activity

Corrosion Mechanism of Copper in Seawater Containing the Bacterial Pyomelanin with Redox Activity

Corrosion Mechanism of Copper in Seawater Containing the Bacterial Pyomelanin with Redox Activity

Corrosion Mechanism of Copper in Seawater Containing the Bacterial Pyomelanin with Redox Activity

Sodium nitrite as a corrosion inhibitor of copper in simulated cooling water

The corrosion inhibition behavior of sodium nitrite (NaNO2) towards pure copper (99.95%) in simulated cooling water (SCW) was investigated by means of electrochemical impedance spectroscopy (EIS) and dynamic electrochemical impedance spectroscopy (DEIS). NaNO2 interferes with metal dissolution and reduce the corrosion rate through the formation or maintenance of inhibitive film on the metal surface. Surface morphologies illustrated that the surface homogeneity increased on adding sodium nitrite. Sodium nitrite’s adsorption on copper surface followed the modified form of Langmuir, Freundlich and Frumkin isotherms. Physiosorption mode was involved in the corrosion protection. Electrochemical results revealed an corrosion resistance of copper increases on increasing the inhibitor concentration. The DEIS results indicated that copper corrosion mechanism could be hindered by 50% even after interval of 24 h by optimum concentration of sodium nitrite. The maximum inhibition was achieved with 2000 ppm of NaNO2. With this concentration, inhibition efficiency of up to 61.8% was achievable.

Corrosion protection of copper and copper alloys in different corrosive medium using environmentally friendly corrosion inhibitors

AbstractThe corrosion mechanism of copper and copper alloy is reviewed. A number of scientific papers have been investigated to determine the corrosion mechanism and protection techniques of copper and copper alloy corrosion. Results have shown that copper can be corroded in an acidic or an alkaline environment, and oxide formation is the corrosion initiation process. The use of corrosion inhibitors is one of several ways of controlling metal corrosion. There are inorganic (toxic) and organic (green) corrosion inhibitors invented so far. Nowadays, environmental issue is a concern of several scientists in the world. From the results of recent scientific papers, green corrosion inhibitors can be used for copper corrosion protection and they are both economical and environmentally safe. Furthermore, future researches are needed to determine more efficient, environmentally friendly corrosion inhibitors for copper and copper alloys.

The Effect of Hematite on the Corrosion Behavior of Copper in Saturated Red Soil Solutions

The effect of α-Fe2O3 as a substitute for hematite on the corrosion behavior of copper in saturated red soil solutions was investigated by electrochemical methods and surface analysis. It was observed from experimental results that α-Fe2O3 was stably dispersed in the weakly acidic saturated red soil solutions without an electrochemical reaction with the immersed bare copper. The electrochemical results showed that the charge transfer resistance of each electrode increased first and then decreased as a whole in the same saturated red soil solution while the charge transfer resistance of copper electrodes increased with the addition of α-Fe2O3 from 10 to 50 g/kg. The addition of α-Fe2O3 mainly inhibited the cathodic corrosion behavior of copper. The characterization using SEM–EDS and XRD verified that the main component of the corrosion products was Cu2O on the copper surface in the saturated red soil solutions, with additional α-Fe2O3. α-Fe2O3 acted as a physical barrier to copper corrosion and prevented more dissolved oxygen from reaching the copper surface in the saturated red soil solutions. Therefore, a uniform and compact Cu2O film formed on the copper surface which protected the inner copper substrate from further corrosion. A copper corrosion mechanism was proposed for the saturated red soil solutions, with and without α-Fe2O3.

Galvanic corrosion of electronic material copper coupled silver-coating in electronic systems

Purpose The purpose of this study is to provide a theoretical basis for the study of the galvanic corrosion mechanism of copper coupled silver-coating under a thin electrolyte layer in electronic systems. Design/methodology/approach Electrochemical measurements and surface characterizations. Findings The results indicate that the potential difference between copper and silver electrodes first quickly increases, and then reaches a relatively stable and large value with the extension of the immersion time. With the significant increase in the cathode/anode area ratio in electronic systems, the area ratio effect obviously accelerates the corrosion of copper due to the remarkable promotion of the cathode process. For a large cathode/anode area ratio, the galvanic current density always maintains a large value and exhibits an increasing trend with the extension of the immersion time, which is attributed that the area ratio effect reduces the protection of corrosion products. For the same area of cathode and anode, the galvanic current density always maintains a small value with the extension of the immersion time due to a low galvanic effect and protective corrosion products. Practical implications This work provides some information for the establishment of reliably protective measures for electronic systems in service. Social implications This work not only provides some information for the establishment of reliably protective measures for electronic systems in service, but also provides a theoretical basis for the selection of metal materials in microelectronic systems. Originality/value This work provides not only a theoretical basis for the study of the galvanic corrosion mechanism of Cu/Ag under a thin electrolyte layer, but also provides some information for the establishment of reliably protective measures for electronic systems in service.

Effect of MgCl2 on the Corrosion Behavior of Copper Under Periodic Wet/Dry Cycle Condition

The corrosion behaviors of copper under periodic wet/dry cycle conditions were investigated. The characteristics of the corrosion product formed on copper were analyzed by x-ray diffraction, scanning electron microscopy, energy-dispersive spectroscopy, and in situ electrochemical impedance spectroscopy. Weight loss results showed that the corrosion of copper under an MgCl2 deposition condition was more severe than that under NaCl. The main corrosion products formed on the tested sample under NaCl deposition condition consisted of Cu2Cl(OH)3 and Cu2O, while those under the MgCl2 deposition condition consisted of Cu2Cl(OH)3 and Mg2(OH)3Cl·4H2O. In the case of the NaCl deposition condition, a two-layered structure formed during the corrosion process. However, the corrosion product layer formed on copper under the MgCl2 deposition condition had an extremely loose structure. The effect of MgCl2 on the corrosion mechanism of copper is discussed.

Research on the effect of the pH value on corrosion and protection of copper in desalted water

PurposeThe hollow copper wires of the generator are seriously corroded in cooling water. This paper aims to explore the mechanism of copper corrosion by thermodynamic calculation and kinetic experiments and to find out the precise pH range for preventing corrosion of copper in stator internal water and dual internal water cooled generators.Design/methodology/approachThermodynamic and kinetic studies were carried out for the purpose of preventing the corrosion of hollow conducting copper wires in the internal cooling water. Thermodynamic calculation results demonstrate hollow copper wires electrochemically corroded by oxygen rather than acids (H+) and find out a precise anti-corrosion pH range. Kinetic experiments research on the effect of the pH value and oxygen concentration on corrosion and protection methods of copper in desalted water.FindingsResearch results demonstrate that, in the internal cooling water, hollow copper wires are electrochemically corroded by oxygen, rather than acids (H+). The method of preventing copper from corrosion in the desalted water is to control the pH value of the stator cooling water and the dual water inner cooling water between 7.86-8.86 and 7.86-9.26, respectively.Originality/valueThe thermodynamic calculation and potentiometric-pH diagram are used to obtain the accurate pH range of the inner cooling water and inner cooling water in the inner cooling water system. The kinetic experiments provide data support for the effect of temperature, pH value and oxygen concentration.

Corrosion mechanism of copper immersed in ammonium sulfate solution

(NH4)2SO4 is abundant in the dust of the rural and industrial atmosphere, by which a thin layer of (NH4)2SO4 solution will be formed on the copper surface and give rise to serious corrosion as soon as the ambient humidity gets the critical relative humidity. In this work, the corrosion mechanism of copper in (NH4)2SO4 solution was studied by microgravimetry associated with SEM/EDS, FT‐IR, XRD, titration method, and electrochemical tests. The results suggest that the corrosion of copper is not only caused by electrochemical effect, but also caused by the synergistic actions of the electrochemical and chemical reactions. In addition, it is found that the presence of free Cu2+ is the prerequisite for the formation of corrosion products on copper immersed in (NH4)2SO4 solution. NH4+ plays a dual role in promoting the corrosion of copper and inhibiting the formation of corrosion products on copper surface.

Experimental insight into the chemical corrosion mechanism of copper with an oil-in-water emulsion solution.

Chemical corrosion mechanism of copper in an oil-in-water (O/W) emulsion is worthy of study since it would contribute to emulsion-lubrication in a metal-working process and for copper storage. The immersion experiments were carried out and the corrosion rates were measured using the weight-loss method. Surface morphology of the copper specimen was observed using a scanning electron microscope (SEM). The compositions of the corrosive residues were analyzed using an energy dispersive spectrometer (EDS) and an X-ray photoelectron spectrometer (XPS). It was found that the corrosion rate of copper in an emulsion linearly increases and the kinetics relationship could be deduced as D1 = 2.66 × 10−3t11.68 at room temperature (25 °C). After 1488 h of immersion time, the corrosion products on the copper surface were determined to be Cu2O, CuO, Cu(OH)2, CuCO3 and Cu2(OH)2CuCO3, which also changed the appearance of the emulsion. During adsorption, copper is more likely to coordinate with hydroxide, carboxylate or ester anions to generate copper compounds. The surfactants were consumed and the efficiency of emulsification characteristics was lost and finally, the O/W emulsion separated into two layers, which might hint the significance of introducing an inhibitor to protect the copper surfaces.

Impact of chlorinated disinfection on copper corrosion in hot water systems

Abstract In France, hot water quality control inside buildings is occasionally ensured by disinfection treatments using temperature increases or addition of sodium hypochlorite (between 0.5 ppm and 1 ppm residual free chlorine). This disinfectant is a strong oxidiser and it could interact with metallic pipes usually used in hot water systems. This work deals with the study of the impact of these treatments on the durability of copper pipes. The objective of this work was to investigate the influence of sodium hypochlorite concentration and temperature on the copper corrosion mechanism. Copper samples were tested under dynamic and static conditions of ageing with sodium hypochlorite solutions ranging from 0 to 100 ppm with temperature at 50 °C and 70 °C. The efficiency of a corrosion inhibitor was investigated in dynamic conditions. Visual observations and analytical analyses of the internal surface of samples was studied at different ageing duration. Corrosion products were characterised by X-ray diffraction and Raman spectroscopy. Temperature and disinfectant were found to considerably affect the copper corrosion mechanism. Surprisingly, the corrosiveness of the solution was higher at lower temperatures. The temperature influences the nature of corrosion products. The protection efficiency is then strongly depend on the nature of the corrosion products formed at the surface of copper samples exposed to the aggressive solutions containing different concentration of disinfectant.

Research on the Regularity and Mechanism of Copper Corrosion in Air Containing Sulfur Dioxide

Copper corrosion in air containing sulfur dioxide atmosphere was described in detail, for which was one of the most primary atmospheric corrosion.In the first, effection from the synergy of pure sulfur dioxide gas and mixed gas on copper corrosion was set out, together with the introduction of certain corrosion products and formation mechanism. Besides, initial copper corrosion behaviors in variety gas concentration as well as different film thickness were summarized using electrochemical method. The research prospects were depicted in the last.

Theoretical challenges in understanding the inhibition mechanism of copper corrosion in acid media in the presence of three triazole derivatives

Using quantum chemical and molecular dynamics approaches, we investigated the corrosion inhibition mechanism of the Cu/HNO3system in the presence of three triazole derivatives.

A possible mechanism of copper corrosion in anoxic water

Recent experiments show that solid Cu reacts with anoxic water. The reaction is observed by measuring the hydrogen release. This release is continuous and stable over a period of months. We have since theoretically found that water adsorbs dissociatively at a copper surface. But this adsorption is not enough to explain the amount of hydrogen released in the experiment. This observation calls for the explanation of the removal of the reaction product from the surface to provide a clean Cu surface where the water dissociation takes place. In this paper we investigate, by first-principles calculations, two possible mechanisms for this removal: first the possibility of Cu–O–H nanoparticulate formation, and second the diffusion of the dissociation products into Cu. We show that while the formation of nanoparticulates is energetically unfavorable, the diffusion of OH along grain boundaries can be substantial. The OH being placed in a grain boundary of the Cu sample quickly dissociates and O and H atoms diffuse independently of each other. Such a diffusion is markedly larger than the diffusion in bulk Cu. Thus, grain boundary diffusion is a viable mechanism for providing a clean Cu surface for the dissociation of water at the Cu surface. An order-of-magnitude estimate of the amount of hydrogen released in this case agrees with experiment. But this mechanism is not enough to explain the result of the experiment. We propose the formation of nanocrystals of copper oxide as a second step. A decisive experiment is proposed.

Corrosion mechanism of copper in palm biodiesel

Biodiesel is a promising alternative fuel. However, it causes enhanced corrosion of automotive materials, especially of copper based components. In the present study, corrosion mechanism of copper was investigated by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). Compositional change of biodiesel due to the exposure of copper was also investigated. Corrosion patina on copper is found to be composed of Cu2O, CuO, Cu(OH)2 and CuCO3. Dissolved O2, H2O, CO2 and RCOO− radical in biodiesel seem to be the leading factors in enhancing the corrosiveness of biodiesel.

A Mechanism for the Atmospheric Corrosion of Copper Determined by Voltammetry with a Strongly Alkaline Electrolyte

A recently developed voltammetric technique using a strongly alkaline electrolyte was successfully applied to clarify a corrosion mechanism of copper under atmospheric conditions. In contrast to conventional potentiometric methods with neutral or weak alkaline electrolytes (e.g., 0.1 M KCl), the developed method could give qualitative and quantitative information about the corrosion products of copper, including oxides (i.e., and CuO) and hydroxide . In the presence of water under such atmospheric conditions, was the initial corrosion product formed on a copper surface. However, the surface layer did not grow much but dehydrated to become a layer of CuO. The thus-formed CuO layer grew until it became several molecules thick . For further progress of corrosion, an inner layer was generated by the proportionation reaction between the CuO layer and the base metal Cu. The inner layer grew for the subsequent oxidation until the thickness reached a certain value . For further oxidation, the top CuO layer grew again preferentially over the inner layer.

A lithium–air fuel cell using copper to catalyze oxygen-reduction based on copper-corrosion mechanism

The copper-catalyzed O(2) reduction in aqueous electrolyte and the Li-anode in organic electrolyte were united together by a ceramic Li-ions exchange film to form a lithium-air fuel cell. The achieved results demonstrate the cycle between Cu and Cu(2)O can be used to catalyze O(2) electrochemical reduction based on the copper-corrosion mechanism.