Abstract
In this work, the corrosion behavior of copper in a simulated organic acid environment containing formic acid and acetic acid was investigated by electrochemical testing and surface characterization. In addition to deducing the corrosion mechanism of copper in the organic acid corrosion environment, the corrosion inhibitor BTA was also used to slow down the corrosion of copper by organic acid. The results show that the corrosion rate of copper in the two groups of organic acids first decreases and then increases with the immersion time. Microelectrochemical (Scanning Vibrating Electrode Technique) results shows that the anodic peak of the sample is higher in formic acid. Formic acid is more corrosive. The corrosion products of red copper gradually increased in the two groups of organic acid atmospheres, and the final corrosion products were cuprous oxide, copper formate particles and copper acetate hydrate, respectively. When the concentration of BTA is 0.5 g/L, the electrochemical activity of TP2 copper is weakened, the surface of the sample is relatively smooth, there are no large corrosion pits, and the corrosion rate is reduced.
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