Abstract
The interaction of copper with sulfide-containing simulated saline groundwater is studied by electrochemical techniques (voltammetry, current-time transients, and electrochemical impedance spectroscopy, EIS) complemented with surface and cross-sectional microscopic observations and energy dispersive spectroscopic analyses. Both experimental findings and quantitative interpretation of EIS data using previously published kinetic models indicate that no continuous adherent barrier-type layer is formed on Cu in sulfide-containing groundwater, thus precluding the possibility of the development of localized corrosion modes.
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