Abstract
The interaction of copper with sulfide-containing borate buffer solution either via direct immersion or by de-passivation following oxide film formation, is studied by electrochemical techniques (voltammetry, current-time transients and electrochemical impedance spectroscopy, EIS) complemented with surface and cross-sectional microscopic observations and energy dispersive spectroscopic analyses. Both experimental findings and quantitative interpretation of EIS data using newly developed and previously published kinetic models indicate that no continuous adherent barrier-type layer is formed on Cu in sulfide solutions, thus precluding the possibility of the development of localized corrosion modes.
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