Corrosion Behavior Of Sn Research Articles

Electrodeposition and corrosion behavior of Sn and Sn-reduced graphene oxide coatings on mild steel from the non-cyanide acid chloride bath solution

Reduced graphene oxide (rGO) derived from graphite has received attention among researchers because of its special unique characteristic properties. Based on the studies, rGO-based coatings on stainless steel (SS) act as an anti-corrosive protective coating on stainless steel. Herein, we prepared a few layered rGO via graphite oxide by a simple thermal exfoliation of graphite oxide. Tin and Sn-rGO coatings have been electrodeposited on SS using an optimized acid chloride bath composition in the absence and presence of rGO respectively. The prepared specimens were subjected to an aggressive corrosive environment (aqueous 5% NaCl). The corrosion behavior of Sn and Sn-rGO composite coating has been examined by potentiodynamic polarization and electrochemical impedance spectroscopic (EIS) techniques. The potential shifted towards the negative region after polarization for Sn-rGO composite coating compared to pure Sn coating. Also, Sn-rGO composite coating exhibits more resistance when subjected to EIS measurements in 5% NaCl. The change in the surface morphology of coatings before and after exposure to corrosive environments has been observed by Scanning electron microscopy. After exposure to aqueous 5% NaCl, Sn coated specimen exhibited pores on the SS surface whereas fewer pore structures were observed on the SS surface for Sn-rGO coating. The results reveal a significant increase in anti-corrosion properties of Sn-rGO on SS compared to that of pure Sn coating.

Effect of Al2O3 and NiO Nanoparticle Additions on the Structure and Corrosion Behavior of Sn—4% Zn Alloy Coating Carbon Steel

The application of a higher corrosion resistance coating modified with nano additions can effectively decrease or prevent corrosion from occurring. In the present work, a novel method is successfully developed for the modification of carbon steel surfaces aiming for high corrosion resistance using Sn—4% Zn alloy/nanoparticle composite (NiO+ Al2O3) coating. Sn—4% Zn alloy/nanoparticle composite (NiO+ Al2O3) coatings were deposed on carbon steel using a direct tinning process that involved a power mixture of Sn—4% Zn alloy along with a flux mixture. Regular coating and interface structures were achieved by individual Al2O3 and both NiO and Al2O3 nanoparticle combined additions in the Sn-Zn coating. The maximum coating thickness of 70 ± 1.8 µm was achieved for Al2O3 nanoparticles in the Sn-Zn coating. Interfacial intermetallic layer thickness decreased with all used nanoparticle additions in individual and hybrid conditions. The minimum intermetallic layer thickness of about 2.29 ± 0.28 µm was achieved for Al2O3 nanoparticles in the Sn—Zn coating. Polarization and impedance measurements were used to investigate the influence of the incorporated Al2O3, NiO, and hybrid Al2O3/NiO nanoparticles on the passivation of the low-carbon steel (LCS) corrosion and the coated Sn—Zn LCS in sodium chloride solution. It was found that the presence of Al2O3, NiO, and Al2O3/NiO nanoparticles remarkably improved the corrosion resistance. The corrosion measurements confirmed that the corrosion resistance of the coated Sn-Zn carbon steel was increased in the presence of these nanoparticles in the following order: Al2O3/NiO > NiO > Al2O3.

Texture evolution and corrosion behaviour of Sn–1.5 wt% Cr coatings containing Graphene oxide

ABSTRACT Sn–1.5 wt% Cr coating incorporated with varying quantity of Graphene oxide (GO) were deposited using electrodeposition technique on mild steel strip using aqueous electrolyte bath. The aqueous bath was dispersed with GO with increasing concentrations in mg/L (31.2, 62.5, 93.7, 125 and 156.2). All the coatings exhibited compact morphology and contained Sn and Cr-oxide phases (CrO2 and Cr2O3). Potentiodynamic polarisation and impedance spectroscopy techniques showed that the coating corrosion resistance increased for the initial addition of GO till Sn–Cr–GO2 coating (from 62.5 mg/L of GO) and it decreased thereafter for higher GO additions. The corrosion current density value exhibited by pristine Sn–Cr, Sn–Cr–GO2 and Sn–Cr–GO5 (from 156.2 mg/L of GO) was 1.38, 0.5 and 4.09 µA/cm2, respectively. Characterisation of the coating texture showed that between all the coatings, low angle grain boundary fraction was highest for Sn–Cr–GO2 coatings. The highest corrosion resistance was on account of special impermeable and inert properties of GO which was uniformly distributed in the coating matrix and the presence of a large fraction of low energy low angle grain boundaries. High corrosion rate in the case of Sn–Cr–GO5 coatings was attributed to the agglomeration of GO in the coating matrix which resulted in non-uniform coating morphology with high surface defects.

The Effect of Sn Addition on Zn-Al-Mg Alloy; Part II: Corrosion Behaviour.

Corrosion behaviour of Sn (0.0, 0.5, 1.0, 2.0 and 3.0 wt.%)-doped Zn 1.6 wt.% Al 1.6 wt.% Mg alloys exposed to salt spray testing was investigated. Intergranular corrosion was observed for all alloys in both as-cast and annealed states. However, due to microstructure spheroidisation in the annealed samples, potential intergranular corrosion paths are significantly reduced. Samples with 0.5 wt.% of Sn showed the best corrosion properties. The main corrosion products identified by XRD analysis for all samples were simonkolleite and hydrozincite. Occasionally, ZnO and AlO were identified in limited amounts.

Hidroklorik Asit çözeltisinde bizmut ilavesinin Sn – 3Ag – 0.5Cu lehim alaşımının korozyon dinamiklerine etkisi

This paper aims to investigate the effect of bismuth addition on the corrosion behaviour of Sn–3.0Ag–0.5Cu (SAC 305) solder alloy in 1M HCl acid solution under potentiodynamic polarization. After electrochemical tests, scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX) were used to examine the properties of the samples. Polarization studies indicated that an addition of 0.5, 1, and 2 wt.% Bi in the SAC305 solder alloy doesn't lead to significantly different corrosion potentials. Instead of a true passivation region, a pseudo-passivation region is observed in which currents are nearly constant (though high). This pseudo-passive region does not have a reactivation point within the scanning interval. Corrosion rates, on the other hand, follow a pattern in which 1 wt.% bismuth replacement of silver causes a drop-in corrosion rate. With the further replacement of silver with bismuth, however, the corrosion rate increases. Microstructure analysis reveals the existence of gaps and porosities which introduce limits on the formation and stability of protective passive corrosion products.

Electrochemical corrosion behaviour of Sn–Sb solder alloys: the roles of alloy Sb content and type of intermetallic compound

ABSTRACT Sn–Sb solder alloys (2; 5.5 and 10wt-% Sb) were directionally solidified with a view to permitting the effect of a wide range of solidification cooling rates to be related to the resulting microstructure, which is shown to be formed by a cellular Sn-rich matrix with Sn–Sb intermetallic particles (IMCs) randomly distributed in the matrix The corrosion resistance of these alloys is investigated by electrochemical impedance spectroscopy (EIS), equivalent circuit and linear polarisation and the results correlated with microstructural features. The increase in the alloy Sb content is shown to change the nature/morphology of the Sn–Sb IMCs, consequently affecting the corrosion resistance. The EIS data indicated that the Sn–10wt-%Sb alloy has the best corrosion resistance because of the high resistance of its oxide barrier layer. The polarisation curves also indicate lowest corrosion rate and nobler potential related to the Sn–10wt-%Sb alloy, which has also been confirmed by calculations of polarisation resistance.

Investigations on the Corrosion Properties of Sn–0.5Cu–Bi–xAg Lead Free Solder Alloys in 3.5% NaCl Solution

Various environment legislations lead to the ban of Pb in solder alloy making. Solder alloy is an integral part of electronic packaging industry. As a result of this researchers were searching for new combinations without lead which can replace Sn–Pb solder alloy. The new lead free solder joint should possess good mechanical properties, good wetting properties and good corrosion resistance properties. Many lead free solder alloys were discovered. Sn–0.5Cu–3Bi is a good candidate for replacing the Sn–Pb alloy with good properties. The addition of Ag into the alloy enhanced the properties, especially 1% by wt. Ag. In this paper, investigations on the corrosion behavior of Sn–0.5Cu–3Bi–xAg (x = 0, 0.5, 1% by wt.) in 3.5% NaCl is carried out using weight loss method. Microstructure and EDAX analysis were also conducted in the analysis. It is found that the corrosion rate is minimum with 1% by wt. addition of Ag. Corrosion rate is less when compared with the SAC (Sn–Ag–Cu). Sn–0.5Cu–3Bi–1Ag can be considered as a potential lead free solder joint with good corrosion resistance.

Effect of relative humidity on the corrosion behavior of Sn–0.7Cu solder under polyvinyl chloride fire smoke atmosphere

AbstractThe effect of environment relative humidity (RH) on the corrosion behavior of Sn–0.7Cu solder was investigated by the weight loss method and surface characterization techniques. In this study, RH ranging from 50% to 98% was researched. The results show that the corrosion degree is getting worse from 50% RH to 90% RH. However, the corrosion rate at 98% RH is lower than that at 90% RH, which may be ascribed to the degree of oxygen diffusion in electrolyte layers of different thicknesses. The microstructure characterization proved that the corrosion products exhibit a superimposed growth and present the same corrosion degree variation trend as the corrosion kinetics. The compositions of corrosion products are examined, and Sn21Cl16(OH)14O6, SnO, and SnO2 are the main corrosion products.

Electrochemical migration and corrosion behaviours of SAC305 reinforced by NiO, Fe2O3, TiO2 nanoparticles in NaCl solution

Pb-free solders incorporated with nano-sized particles have been identified, as potential Pb-free nanocomposite solders that could provide higher microstructure stability and better mechanical properties than the conventional solders. Nowadays, the miniaturizations of electronic devices increase in their usage have increased the risk of failure due to ion migration and corrosion phenomena. This research investigates the effects the electrochemical migration (ECM) and corrosion behaviour of Sn- 3.0Ag-0.5Cu (SAC305) reinforced by NiO, Fe2O3 and TiO2 nanoparticles in 0.1M NaCl solution. The SAC305 solder alloys were doped with different percentages of NiO, Fe2O3 and TiO2 at nominal percentages of 0.01, 0.05 and 0.15 wt% in producing nanocomposite solder paste. Then, the solder paste has flowed in the reflow oven at the temperature of 240°C. After that, the Water Drop Test (WDT) was performed using 0.1 M NaCl solution to investigate the ion migration behaviour and Potentiodyamic Tafel Polarization technique to determine the corrosion behaviour on the solder alloys. In general, the results showed the mean-time-to-failure (MTTF) of SAC305 solder alloy increased when added of the nanoparticles of NiO, Fe2O3 and TiO2. Besides, SAC305-TiO2 has the longest MTTF in 0.1 M NaCl solution followed by SAC305-Fe2O3 and SAC305-NiO nanoparticles. This results is believed due to the presence of nanoparticles as the alloying element in the solder that hinder the process of ECM to suppress the growth of the dendrites accelerating for the short circuit occurs and causes the failure of the IPC-24 test board. The potentiodynamic polarization curve results exhibit the SAC305 with nanoparticles decreased the corrosion rate compared with SAC305 solder alloy only. SAC305 with NiO and TiO2 have slightly lower corrosion rates compared with Fe2O3 nanoparticles. Therefore, SAC305 reinforced by TiO2, Fe2O3 and NiO nanoparticles exhibited excellent ECM and corrosion resistance behaviours in the 0.1 M NaCl solution.

Effect of graphene nano-sheets additions on the density, hardness, conductivity, and corrosion behavior of Sn–0.7Cu solder alloy

Graphene nano-sheets (GNSs) are considered a functional (excellent/good) material at solder alloy modification. In this study, GNSs were doped into Sn–0.7Cu solder by powder metallurgy to form Sn–0.7Cu–xGNSs (x = 0.025, 0.05, 0.075, 0.1 wt%) composite solders. The density, hardness, and electrical conductivity of the composite solders were investigated. At the same time, Potentiodynamic polarization method, X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and scanning electron microscopy (SEM) were applied to analyze the electrochemical corrosion behavior of composite solders in the 3.5 wt% NaCl solution. The results revealed that as the content of GNSs increased, the hardness of composite solders decreased, but the density enhanced when compared with original Sn–0.7Cu. Simultaneously, the conductivity reached highest as the GNSs content was 0.025 wt%. Potentiodynamic polarization showed that GNSs affected the anodic reaction of the solders. The corrosion resistance of Sn–0.7Cu–0.075GNSs was better than that of other alloys. Sn3O(OH)2Cl2 and Tin oxides were the formation of the corrosion product by XPS and XRD analysis. SEM analysis confirmed that when the GNSs content was 0.075 wt%, the corrosion products were dense and the corrosion resistance of the alloy was improved.

Effect of trace Mn modification on the microstructure and corrosion behavior of Sn−9Zn solder alloy

The effect of trace Mn modification (0.05–0.1 wt%) on the microstructure and corrosion behavior of Sn–9Zn solder alloy in 0.5 M NaCl solution (pH 5.8) was evaluated by electrochemical techniques complemented with surface characterization. Mn could refine the Zn‐rich precipitates and facilitate forming of a new ternary precipitation phase containing higher amount of Mn element. Impedance results reveal that trace Mn modification improves the corrosion resistance of Sn–9Zn alloy in the solution. As a result, both cathodic and anodic reaction rates were reduced. Moreover, Mn notably enhances the stability of the passive films formed on the modified alloys with respect to a lower passive current density to maintain the passive state. Mott–Schottky analysis shows that the passive films exhibit n‐type semiconducting properties and the donor density decreases with Mn addition. The mechanism by which Mn influences the corrosion resistance of Sn–9Zn alloy can be explained in terms of the differences in both microstructure of the alloy and in semiconducting properties of the passive films.

Effects of Phosphorus Addition on the Corrosion Resistance of Sn–0.7Cu Lead-Free Solder Alloy

The corrosion behavior of Sn–0.7Cu–xP (x = 0, 0.1, 0.3, 0.5) solder alloy in the aggressive environment was investigated by potentiodynamic polarization and weight loss method. Scanning electron microscope (SEM) was used to observe the morphology of Sn–0.7Cu–xP solder alloys and X-ray diffraction (XRD) was applied to characterize the phases formed on the surface after corrosion. The results indicate that phosphorus (P) can enhance the corrosion resistance of Sn–0.7Cu solder alloy whether in acidic or in alkaline solution, and its corrosion resistance increases with increasing P. The corrosion resistance of the solder alloy is better in alkaline solution compared to that in acidic solution. The morphology observation also shows that the incorporation of P into Sn–0.7Cu alloy can obviously decrease the damage extent of the solder alloys. XRD analysis reveals that the corrosion products both in acidic and alkaline solution are Sn oxides.

Correction: Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder

Correction for ‘Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder’ by N. I. M. Nordin et al., RSC Adv., 2015, 5, 99058–99064.

Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder

(a) Al provides an enhanced passivation capability over SAC105 solder alloy. (b) Corrosion products on the surface consist of Al2CuO4, Al2O3, SnO and SnO2. (c) Al-added SAC105 is less susceptible to corrosion.

Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder

In this paper, the effects of microstructure on the corrosion behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder were investigated by potentiodynamic polarization and atmospheric corrosion test. Scanning electron microscopy and X-ray diffraction were used to characterize the samples after the electrochemical and atmospheric corrosion tests. Results showed that commercial SAC305 solder exhibits better corrosion resistance than air-cooled and furnace-cooled SAC305 solders both in 3.5 wt% NaCl solution and at 60 °C/100 % relative humidity condition.

Electrodeposition of Sn and NiSn alloys coatings using choline chloride based ionic liquids—Evaluation of corrosion behavior

Abstract The present paper presents several experimental results regarding the electrodeposition and corrosion behavior of Sn and NiSn alloy coatings from some choline chloride based ionic liquids, applied onto various metallic substrates including Cu and steel. There are discussed electrolytes containing Sn and Ni salts in choline chloride–ethylene glycol and choline chloride–malonic acid eutectic mixtures. The obtained Sn and Ni–Sn alloy deposits are adherent and uniform onto metallic substrates The Ni–Sn alloys contained about 62–72 wt% Sn according to EDX analysis, with a very slight variation against the applied current density domain. According to XRD investigations both electrochemical coatings showed a nanocrystalline structure, with average sizes of the crystallites between 50 and 80 nm for Sn and around 11–14.5 nm for NiSn alloy. To evaluate corrosion resistance of Sn and Ni–Sn alloy coatings, potentiodynamic polarization curves and electrochemical impedance spectra (at open circuit potential) in 0.5 M NaCl solution have been recorded after different immersion times of coated specimens. Different corrosion performances are discussed taking into account the used electrodeposition procedures.

Effects of microstructure and temperature on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder

The heterogeneous microstructure of solder could be obtained when cooling rate of the solder joint was not even, which would affect the corrosion behavior of solder during service. The ambient temperature would also affect the corrosion behavior of solder joint. In this paper, the effects of microstructure and temperature on the corrosion behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder were investigated. The various microstructures of SAC305 lead-free solder were obtained by cooling specimens in air and furnace. Compared to the fine-fibrous Ag3Sn phase inside the commercial SAC305 solder, platelet-like Ag3Sn formed as cooling speed decreasing. The polarization behavior of SAC305 solders in 3.5 wt.% NaCl solution was not significantly affected by various microstructures, but sensitive to temperature.