The current density distribution during lead and copper electrodeposition on to stationary copper wire electrodes was investigated by inspection of the morphology of the deposit. It was shown that the tip current density was much larger than that on the rest of the electrode during deposition from low conductive solutions. In contrast, the current densities are practically the same for the deposition from solutions characterized by large conductivity. A mechanism of transformation of Ohmic potential drop in the homogeneous current field in electrochemical overpotential at the edge of a plane and the tip of a wire electrode is proposed by considering the current line dissipation between the cathode edge, tip, anode and cell walls. There are a large number of current lines between two symmetrically-positioned points on the edges (assumed as lines) of the anode and cathode making the Ohmic drop along each of them negligible. Because of this the electrochemical overpotentials and current densities at these points must increase in order to compensate the Ohmic drop between two symmetrical points in a homogeneous field on the anode and cathode. The above reasoning is obviously valid for the tip of a wire electrode (assumed as a point) because the dissipation of current lines in this case takes place through space while in the parallel plane electrode arrangements it takes place in one plane normal to the electrodes to which two symmetrically-positioned points belong.