Copper Films Research Articles

Optically Transparent Honeycomb Mesh Antenna Integrated into OLED Light Source

The co-integration of antennas with lighting sources appears as an effective way to distribute broadband networks closer to users, lowering interference and transmitted power, as well as to reduce energy consumption in future lighting systems. We here present an original contribution to the implementation of transparent and invisible antennas with OLED light sources. To validate the proposed approach, the honeycomb mesh technique was used, and an optical transparency of 75.4% was reached. The transparent mesh antenna was compared with the non-transparent full-metal antenna in terms of radio-electrical parameters. Our prototype was designed using copper films deposited on a glass substrate. The simulation results of the S-parameters and the radiation patterns were validated against measurements performed in an anechoic chamber. The directivity and gain obtained were 6.67 dBi and 4.86 dBi at 5.16GHz, respectively. To study the effect of antenna integration with OLEDs, optical and photometric characterizations with and without the antenna were measured, and the colorimetric parameters were then treated using the IES TM-30-18 standard.

BME-Assisted Fabrication of Porous Copper Films with Adjustable Porosity and Ligament Width for Microelectronic Interconnects

Monolithic porous Cu films are synthesized through the use of bicontinuous microemulsion (BME) to serve as a flexible template. The BME system is made up of a series of interconnected linked water and hydrocarbon phases. This one-of-a-kind structure enables precision Cu electrodeposition only in the aqueous phase, avoiding undesirable electrodeposition in the oil phase. We can fine-tune the porosity and ligament width of the resultant copper film by altering the oil phase proportion in the soft template. This Sn-plated porous Cu is capable of both low-temperature reflow and high-temperature service. The flexible template approach shows great potential for creating porous Cu with changeable porosity, allowing for more control over compositions. This approach has potential applications in advanced packaging technologies.

Electrodeposition of copper on niobium for cryocooler application

The electrodeposition of copper onto niobium using commercial acidic and alkaline electrolytes was tested. The continuous dense polycrystalline copper films were successfully obtained in aqueous alkaline-type bath containing copper sulphate, sodium hydroxide and sodium gluconate. The effect of benzotriazole and sodium lauryl sulphate additives on the morphology and crystal structure of the deposited copper was investigated by optical and scanning electron microscopy, and X-ray diffraction. No copper oxides were found in the grown films. Copper films had moderate adhesion properties that would be insufficient for cryocooler application. We are currently exploring different compositions of electrolyte baths for obtaining the coatings on niobium with improved adhesion.

A self-powered droplet sensor based on a triboelectric nanogenerator toward the concentration of green tea polyphenols.

Self-powered liquid droplet sensors based on triboelectric nanogenerators have attracted extensive attention in the field of biochemical sensing applications. Numerous research studies have investigated the effects of factors such as molecular species, molecular concentration, molecular charge, and molecular dipole moment in solution on the output electrical signals of the sensor. In this study, we prepared a self-powered droplet sensor using conductive copper film tape, polytetrafluoroethylene, and conductive aluminum foil tape. The sensor can continuously output pulsed electrical signals with minimal environmental impact. In comparison with other types of sensors, this sensor boasts a rapid response time of 10 ms and excellent sensitivity. The relationship between the friction-induced output current and voltage of the droplets and the concentration of green tea polyphenols (GTPs) was studied using the self-powered liquid droplet sensor with five different green tea samples. It was found that GTPs were the main factor contributing to the changes in output electrical signals in green tea water droplets. Fluorescence spectroscopy was used to reveal that the magnitude of the output current was inversely proportional to the concentration of GTPs in green tea. These results demonstrate the potential application of self-powered liquid droplet sensors in biochemical sensing applications based on concentration-dependent output signals.

Significantly Enhanced Conformal Contact by the Functional Layers on a Copper Film for Thermal Interface Materials

Low‐cost thermal interface materials with high thermal conductivity (κ) and low total thermal resistance (Rt) receive considerable attention for thermal management. A copper film (CuFilm) is an excellent candidate due to the high κ (364 Wm−1 K−1) it possesses. However, the practical implementation is hindered by its high elastic modulus (Es = 70.8 GPa), inducing a high contact thermal resistance (Rc = 91.6 mm2 K W−1). Herein, the selective construction of electrically conducting or insulating layers on CuFilm to dramatically decrease Es, Rc, and Rt is reported. The highly electrically and thermally conducting layer is synthesized by incorporating in situ reduced copper nanoparticles (CuNPs, 35 vol%) and multiwalled carbon nanotubes embellished with CuNPs (1.5 vol%) in polyethylene glycol. The high effective κ (92.7 Wm−1 K−1) still maintains a low specimen thermal resistance (Rs = 4.9 mm2 K W−1), while the dramatically softened surface (Es = 5.7 GPa) decreases Rc (8.3 mm2 K W−1), resulting in a very small Rt (13.2 mm2 K W−1). Alternatively, the electrically insulating but thermally conducting layer is constructed using aluminum nitride particles. The κ is still high (72.1 Wm−1 K−1) with a small Rt (47.5 mm2 K W−1). The facile fabrication based on a CuFilm enables cost‐effective thermal interface materials with tunable electrical and thermal properties.

Microstructural Characterization of Hot Shortness in Steels

Hot shortness in steels is a macro crack on the steel surface especially on the slab edges of hot rolled steels produced by recycling. Hot shortness in steels is characterized by intergranular cracking of steel on the surface during hot rolling process. The hot shortness damage can be seen by naked eye due to macro cracks on steel surface, after the hot rolling of slab. Although macro cracks can occur due to various parameters such as excessive force or deformed rolls, hot shortness is directly linked to residual elements in the steel composition. Most common and effective residual element for hot shortness is copper. Copper in steel originates from the used scrap in Electric Arc Furnace (EAF) steelmaking. Decreased primary sources and environmental concerns with increased scrap output in the world make the recycling of steel inevitable. Copper segregates in the austenite grain boundaries during the annealing of steel prior to hot rolling. Liquified copper film decreases the grain cohesion between austenite grains and results in intergranular cracking by the force applied during the rolling. Detection of copper in microstructure is vital to understand mechanism of hot shortness. Common knowledge in the literature of hot shortness suggests that hot shortness mechanism consists of oxidation-segregation-decreased grain cohesion-crack route. In this study, detailed microstructure images of steel surfaces are discussed with optical and scanning electron microscopy examinations. Examined samples of hot shortness are collected from scientific experiments and industrial practice examples. Helpful techniques and etching agents for copper revelation in microstructure are evaluated and explained in this paper.

N-Heterocyclic Carbene Based Nanolayer for Copper Film Oxidation Mitigation

The wide use of copper is limited by its rapid oxidation. Main oxidation mitigation approaches involve alloying or surface passivation technologies. However, surface alloying often modifies the physical properties of copper, while surface passivation is characterized by limited thermal and chemical stability. Herein, we demonstrate an electrochemical approach for surface-anchoring of an N-heterocyclic carbene (NHC) nanolayer on a copper electrode by electro-deposition of alkyne-functionalized imidazolium cations. Water reduction reaction generated a high concentration of hydroxide ions that induced deprotonation of imidazolium cations and self-assembly of NHCs on the copper electrode. In addition, alkyne group deprotonation enabled on-surface polymerization by coupling surface-anchored and solvated NHCs, which resulted in a 2 nm thick NHC-nanolayer. Copper film coated with a NHC-nanolayer demonstrated high oxidation resistance at elevated temperatures and under alkaline conditions.The ease of preparation and well-controlled growth process of electrochemically-induced NHC nanolayer make it an easily-applicable method for large-scale coating to provide thin and effective passivation layer for copper surfaces. Moreover, the electro-induced mechanism of NHC-nanolayer formation makes it possible to selectively deposit the protective layer on conducting copper wires without changing the optical properties of the entire device. These advantages make the presented technology highly suitable for applications that require high transparency, such as solar cells and electroluminescence devices.

Fabrication of PS-DVB@Cu core-shell microsphere for anisotropic conductive adhesives by electroless plating with copper nanoparticles as seeds

Polymer@metal core-shell microspheres are widely used in anisotropic conductive adhesives (ACAs). Styrene-divinylbenzene copolymer (PS-DVB) copper core-shell microspheres (PS-DVB@Cu) with high conductivity and anti-oxidation performance were successfully prepared by combining copper nanoparticles (Cu NPs) and electroless plating copper. The Cu NPs served as catalytic seeds, substituting noble metals to promote electroless deposition. Using environmentally benign ammonia borane as the reductant to replace toxic formaldehyde, the dense copper film was deposited on the surface of PS-DVB microspheres. The thickness of the Cu layer and bulk electrical resistivity of PS-DVB@Cu were tuned by controlling the concentration of the reducing agent. The minimum resistivity of PS-DVB@Cu was 3.27×10−6 Ω·m and merely slightly changed in the air for two months. The prepared PS-DVB@Cu-based ACAs could be effectively applied to anisotropic conductive connections in small-scale circuits with satisfactory anisotropic conductivity.

(Invited) Gravitational Level Effects on Electrochemical Interfacial Phenomena

Electrochemical copper refining technology invented in Niagara area made a great progress over more than 100 years through better understanding of natural convection phenomena. Ionic mass-transfer rate enhanced by natural convection developing along 1m high vertical electrode surfaces has been unconsciously utilized by trial-and-error method. As the local electrolyte composition is partly stratified in an electrolytic cell (roughly 5m long x 1.3m wide x 1.3m depth). The industrial electrolytic tank house is composed of about 1000 cells through which the electrolyte is continuously supplied. Thus, the electrolyte circulation is a key technology in industrial copper refining processes as well as appropriate selection of effective additive and stable sedimentation of anode slime containing precious metals on the electrolytic tank bottom.On the other hand, Cu nanowire arrays were electrodeposited potentiostatically with PC filter template in two kinds of electrolytic cell configurations: cathode over anode (C/A) and anode over cathode (A/C). The effect of gravitational level on the coupling phenomena between the morphological variation and the ionic mass transfer rate in nanosized pores(a mesoscopic scale of a fewμm high and 30nm in diameter) was also found. Hitherto, the coupling phenomena accompanied with the electrochemical interfacial reactions confined in such a mesoscopic space has not been studies in spite of the great technological interest for the production of micro- or meso-scale fabrication techniques encountered in microelectronics and energy conversion & storage technology field. The initial stage including nucleation and growth process during electrochemical phase transformation reactions must be at first focused to profoundly comprehend the present subject in order to reasonably design such an advanced device technology.Fundamental aspects in electrochemical processes in microgravity environments have not been frequently reported. However, Artemis projects may provide the large opportunities on the energy storage and power generation, as well as materials processing. The effects of gravitational level and magnetic field gradient on the electrochemical interfacial phenomena should be understood. The drop tower facility surely offers the appropriate & “unique” experimental opportunities to propose such research program in the future space engineering fields. Electrocrystallization of metals is selected as a good subject for starting direction of research. Its reaction mechanism is relatively simple, the deposition rate can be easily varied by changing the current density or potential, and a smooth copper film is deposited so long as it is not too thick.By the way, the damascene process has been introduced to copper wiring process in ULSI field by IBM almost 25 years ago. It is important to control the nucleation and crystal growth in the initial stages of electrodeposition process. For this purpose, many effects of additive have been intensively examined. However, few quantitative examinations have been reported on the coupling phenomena of ionic mass transfer and nucleation and crystal growth. In the present work, we introduce various gravitational levels as new parameters into the nonequilibrium electrochemical processing in order to create or tailor the unique physical properties in nano space field. It is fruitful in terms of physicochemical hydrodynamics that the experiments are done under various gravitational levels. In fact, it has been confirmed that the gravitational levels as well as the magnetic field introduce the intensified effects from that under 1 G normal environment. Here is a report to analyze the effect of gravitational level on the initial stages of Cu electrodeposition on TaN or TiN substrate.

Investigating the Electrochemical CO2 Reduction Mechanism on Oxide-Derived Copper Using in Situ FTIR Spectroscopy

Oxide-derived copper (OD-Cu) electrocatalysts have been extensively used for CO2 reduction reaction (CO2RR) applications in recent years due to their capability to selectively produce valuable C2 compounds. The mechanism of CO2 reduction on these surfaces, however, is still not clearly understood. Using in situ attenuated total reflection surface-enhanced infrared absorption spectroscopy (ATR-SEIRAS), we show how the copper pre-oxidation process can significantly influence the adsorption of various CO2RR intermediates. Upon mildly anodizing a Cu thin film, we observed a redshift on the *CO2 – band, indicating that the initial CO2 adsorption and activation step is promoted on the oxide-derived surface. Additionally, we observed a faster growth of the *COatop band for the anodized copper film at low overpotentials, which demonstrates how a high *CO coverage can be achieved on OD-Cu. Finally, for the first time, we observed the simultaneous formation of two bands at 1327 cm–1 and 1425 cm–1 on the anodized Cu thin film. Using DFT calculations, we show that these bands match the theoretical vibrational frequencies of the *COCHO dimer, a key intermediate of the C2 pathway. Furthermore, our calculations show that the thermodynamics of *CO and *CHO coupling can be improved in the presence of the subsurface oxygen sites in OD-Cu. Our findings reveal the different aspects through which the CO2 reduction mechanism can be improved on OD-Cu electrocatalysts as compared to metallic copper.This work was financially supported by the Research Grants Council (16310419, 16309418, and 16304821) and the Innovation and Technology Commission (grant no. ITC-CNERC14EG03).

Electrodeposition of Cu Nanocubes in the Presence of Cl- and Br-

Electrodeposition is one of the simple methods for fabricating metal and alloy thin films. Electrodeposition is performed by applying external electrical energy to conductive substrates immersing in electrolytes containing metal precursors. Metal ions or complexes are reduced on a substrate surface and form metal films. The properties of metal thin films and surface morphology of the electrodeposit can be modulated by the parameters of electrodeposition, the composition of electrolytes, i.e., the concentrations of metal precursors and additives. Furthermore, the atomic composition of alloy films can also be easily controlled by electrochemical parameters in the electrodeposition process.1 As explained, the electrodeposition process has various advantages in producing metal thin films with desired properties. However, creating nanostructures with precisely controlling their shapes in the nm scale is relatively difficult. In colloidal syntheses, various nanocrystals, including nanowires, nanospheres, octahedrons, nanocubes, and nanoplates, can be obtained by introducing shape-directing agents.2-4 In the case of electrodeposition, the template-assisted electrodeposition method is the most common to form nanostructures,5,6 and relatively few examples of shape controlling by additives have been reported. Although the formation of metal nanowires in the presence of 3,5-diamino-1,2,4-triazole (DAT) has been recently reported,7 shape control of metal deposits by additives during the electrodeposition process is still limited to few nanostructures. Electrodeposition induces metal growth relatively faster than colloidal synthesis, and a precise nucleation step is not involved in the electrodeposition, which is critical in colloidal syntheses. In this study, we have adopted pulse-reverse electrodeposition to modulate metal nucleation at the initial stage of electrodeposition and also maximize the effects of additives. Pulse-reverse electrodeposition has been researched for controlling the properties of metal thin films and changing the adsorption of additives.8,9 Therefore, pulse-reverse electrodeposition can catch up with the shape control in colloidal syntheses. This presentation will introduce how the parameters in pulse-reverse electrodeposition and additives (halide ions) affect the shape of Cu nanocrystals. References 1) T. P. Moffat, J. J. Mallett, and S. M. Hwang, “Oxygen Reduction Kinetics on Electrodeposited Pt, Pt100− x Nix , and Pt100−xCox” J. Electrochem. Soc. 156, B238 (2009)2) Y. Xia, Y. Xiong, B. Lim, and S. E. Skrabalak, “Shape-Controlled Synthesis of Metal Nanocrystals: Simple Chemistry Meets Complex Physics?” Angew. Chem. Int. Ed. 48, 60 (2009)3) K. A. Fichthorn, Z. Chen, Z. Chen, R. M. Rioux, M. J. Kim, and B. J. Wiley, “Understanding the Solution-Phase Growth of Cu and Ag Nanowires and Nanocubes from First Principles” Langmuir 37, 4419 (2021)4) D. Huo, M. J. Kim, Z. Lyu, Y. Shi, B. J. Wiley, and Y. Xia, “One-Dimensional Metal Nanostructures: From Colloidal Syntheses to Applications” Chem. Rev. 119, 8972 (2019)5) K. R. Yeo, J. Y. Eo, M. J. Kim and S.-K. Kim, “Shape Control of Metal Nanostructures by Electrodeposition and their Applications in Electrocatalysis” J. Electrochem. Soc. 169, 112502 (2022)6) C. Liu, Z. Li, P. Yu, H. W. Wong, and Z. Gu, “Vertically Aligned and Surface Roughed Pt Nanostructured Wire Array as High Performance Electrocatalysts for Methanol Oxidation” ACS Appl. Energy Mater. 1, 3973 (2018)7) T. T. H. Hoang, S. Ma, J. I. Gold, P. J. A. Kenis, and A. A. Gewirth “Nanoporous Copper Films by Additive-Controlled Electrodeposition: CO2 Reduction Catalysis” ACS Catal. 7, 3313 (2017)8) M. J. Kim, T. Lim, K. J. Park, S. K. Cho, S.-K. Kim, and J. J. Kim “Characteristics of Pulse-Reverse Electrodeposited Cu Thin Films: I. Effects of the Anodic Step in the Absence of an Organic Additive” J. Electrochem. Soc. 159, D538 (2012)9) M. J. Kim, T. Lim, K. J. Park, O. J. Kwon, S.-K. Kim, and J. J. Kim “Characteristics of Pulse-Reverse Electrodeposited Cu Thin Film: II. Effects of Organic Additives” J. Electrochem. Soc. 159, D544 (2012) Figure 1

Thermal Efficiency Evaluation after Thermocompression of Copper Layer Obtained By Dynamic Hydrogen Bubble

With the increase in engines electrification, especially in aircraft future developments, there is a need of extremely high-power converters in the power electric chain, interfacing the electrical network and the electric motors. The COPPERPACK project (COPPER based PACKaging for direct cooled power module ANR-19-CE05-0011) aims to module assembling by thermocompression, which requests the elaboration of thin nanoporous copper films to be placed between chips and metallized ceramic substrates. Different possibilities exist and have been tested all along the project, such as copper-zinc or copper-manganese electrodeposition followed by an anodic dissolution, but the faster and simpler way resides in electroforming deposition made by Dynamic Hydrogen Bubble Template (DHBT) [1]. This process works in unusual potentials and current densities where the competition between hydrogen discharge (commonly avoided) and copper reduction is very high. In this case, this method achieves thick deposits in very short time (few seconds) with high currents allowing a very fast growth of copper around hydrogen bubbles. Pores and ligaments sizes can be controlled by several operating parameters i.e. current densities, temperature, deposit time, chemical additives [2] as well by pulsed currents. Films were tested for chips assembling by thermocompression, and present excellent behavior’s. Several conditions have been tested, in different configurations, varying the size and the height of the chips.Eventually, this system has been extended to cooling systems, favoring the assembling of copper foams and complex copper shapes, designed for cooling fluid circulation. Once again, the copper layers obtained by DHBT allow to build compact and efficient systems.[1] Abdel-Karim, R.; El-Raghy, S. Chap 4 in Advanced materials and their applications - micro to nano scale. One Central Press, United Kingdom, pp 69–91, 2017[2] Shin, H.-C.; Liu, M. Chem. Mater. 2004, 16, 25, 5460–5464 doi.org/10.1021/cm048887b

Electrodeposition of stress-relaxation-induced (111)-oriented nanotwin copper film by direct current in additive-free electrolyte

In this study, we investigated the electrodeposition of stress-induced (111)-oriented nanotwin copper films using direct current in an additive-free electrolyte. We aimed to explore the effects of temperature, current density, and agitation on the formation of nanotwins. At lower temperatures, (111) orientation was induced due to the decrease in adatom surface diffusion. Additionally, higher current densities, which induced high initial residual stress, promoted the formation of (111)-oriented nanotwins, resulting in stress relaxation and a reduction in residual stress. Agitation had a negligible effect on nanotwin formation in our experiments, which were conducted in the additive-free electrolyte. Our findings provide valuable insights into the controlled formation of (111)-oriented nanotwin Cu films and their potential applications in fields requiring Cu films with superior mechanical and electrical properties, which are improved by the formation of nanotwins. By comprehending the fundamental mechanisms involved, it becomes possible to optimize electrodeposition processes for (111)-oriented nanotwin copper films.

Design and Analysis of Fabric Antenna for Medical and Wireless Applications

This study aimed toward the wearability of the antenna by inspecting the probability of designing and fabricating a wearable microstrip antenna operating from 2 to 6 GHz, centered at 2.5 GHz and 5.3 GHz. The antenna is fabricated from jeans material with dielectric constant εr = 1.7 and a thickness of 1 mm. The proposed design is simulated on High-Frequency Simulation Software (HFSS) version 2015, followed by fabrication using a 50-µm copper film on a jeans substrate. Anritsu MS2038C VNA Master then tests the fabricated design. Also, specific absorption rate (SAR) values are computed for medical applications to account for tumor detection in human breast tissue.

Random crystal orientation and tensile strength of nanocrystalline dumbbell-shaped copper thick films electrodeposited from acidic aqueous solutions containing polyethylene glycol

Nanocrystalline thick copper films with the thickness of ∼250 μm were electrochemically synthesized from an acidic aqueous solution containing polyethylene glycol (PEG) with the average molecular weight of 3,000 to investigate the preferential crystal orientation and mechanical properties such as microhardness and tensile strength. By addition of PEG to the electrolytic bath, the cathode potential was shifted to a less noble direction during the electrodeposition and the average crystallite size of electrodeposited copper thick films was decreased. The copper thick films electrodeposited from the solution without PEG exhibited a preferentially orientation in (220) texture while that obtained from the solution containing PEG was composed of nanocrystals with random crystal orientation that containing (111) and (200) textures. The micro-Vickers hardness, tensile strength, and elongation of the electrodeposited copper thick films reached up to 133 HV, 234 MPa, and 13.1%, respectively. These improvements in mechanical properties can be explained by the grain refinement effect and the random crystal orientation effect.

The Energy Flux to the Substrate in the High-Power Impulse Magnetron Sputtering of Copper Films

The Energy Flux to the Substrate in the High-Power Impulse Magnetron Sputtering of Copper Films

Nano-Sized Copper Films Prepared by Magnetron Sputtering

Nano-Sized Copper Films Prepared by Magnetron Sputtering

Micro-Vickers Hardness of Cu and Cu2O Dual Phase Composite Films Electrodeposited from Acidic Aqueous Solutions Containing Polyethylene Glycol

Metallic copper (Cu) and copper oxide (Cu2O) dual phase composite films were fabricated via a cathodic reduction process in an acidic aqueous solution dissolving polyethylene glycol (PEG) to investigate the structure and micro-Vickers hardness. By dissolving PEG in an aqueous electrolyte, the cathode potential was depolarized to the noble region during the electrodeposition, and the average crystallite size of electrodeposited Cu/Cu2O composite films was decreased down to around 40 nm. The metallic copper films electrodeposited from the solution without PEG was preferentially orientated in (220), while that containing PEG was composed of Cu and Cu2O dual phase composite films with random crystal orientation. The micro-Vickers hardness of the Cu/Cu2O composite films that were electrodeposited from the solution containing PEG was achieved up to 2.53 GPa. This improvement in mechanical performance can be explained by the grain refinement effect and the electrochemical phase transformation effect from a copper metallic state to the oxide.

Tilting behaviors of metal microjet in laser-induced forward transfer

Abstract Laser-induced forward transfer (LIFT) is proposed as a highly efficient and high-resolution printing technique. Tilting of the microjet in the LIFT process affects the deposition deviation, lowing the printing resolution. We investigate the tilting behaviors of the metal microjet in the nanosecond LIFT process based on high-speed observation. Experiments were conducted on the copper film under different laser fluences. Observations based on the pump-probe method were performed to capture the ejection behavior of microjets. We find that the tilting direction is isotropic and the tilting angle follows Gaussian distribution. The tilting behavior originates from the disturbance of residual stress within the film during jet generation because the statistical results of the tilting angle hardly vary with the propagation time. In addition, the tilting angle is found to decrease linearly with the laser fluence due to the ejection velocity increasing at a higher rate than the lateral velocity. The lateral offset of the tilting microjet at different flight distances matches well with the position deviations, verifying the tilting behavior of the microjet. This study provides essential comprehension of the tilting behavior of metal microjet in the LIFT process.

Characterization of Nanoporous Copper Using Scanning Probe Techniques

This study explores the mechanical and optical properties of nanoporous copper (NPC) films dealloyed in acid and base using qualitative and quantitative measurements. Two types of NPC films (NPC 1 and NPC 2) were prepared by dealloying precursor films in different corrosive solutions. The films were characterized using atomic force microscopy (AFM) and scattering scanning near-field optical microscopy (s-SNOM). The AFM analysis revealed distinct nanoporous structures in both films, with NPC 2 showing larger pore sizes and the presence of copper aggregations on the surface. Rugosity measures showed that NPC 2 had higher rugosity than NPC 1 and indicated fundamental differences in the height distributions of the surface nano-topography. The Minkowski connectivity analysis highlighted differences in connectedness and topological characteristics between the two samples. The analysis of the GLCM features showed clear distinctions in ASM, Contrast, Dissimilarity, Energy, and Homogeneity between NPC 1 and NPC 2. The s-SNOM results demonstrated altered optical properties, with NPC 1 showing higher contrast at 1550 nm, while NPC 2 exhibited reversed-phase contrast at 561 nm. The phase contrast at 638 nm indicated a red-shifted optical absorption peak in NPC 2 compared to NPC 1.