Convergence Of Different Technologies Research Articles

MetaBlock: A Revolutionary System for Healthcare Industry Fusing Metaverse and Blockchain

The Metaverse is like another world functioning parallel to the actual physical world. It merges physical reality with digital virtuality by the convergence of different technologies that enable interactions with virtual objects and environment. The complete immersive experience with metaverse generates huge data which comes with its own set of challenges, a major one being the security and storage of user centric data. Considerably, blockchain offers a significant solution due to its exceptional features of decentralization, immutability, and transparency. For a detailed insight into the role of blockchain in the metaverse, the paper explores its usage in the healthcare industry. The paper then proposes a healthcare system named MetaBlock that is a fusion of both the metaverse and blockchain techniques. The paper discusses the components of the system from a detailed technical interpretation, such as data acquisition, data storage, virtual object and space simulation, data sharing and data privacy protection. Finally, an important research direction in terms of distributed consensus mechanism is discussed.

Morphing concepts in the field of rotorcraft

Drawing inspiration from avian creatures, aeronautical engineers strive to create an ideal wing design that can seamlessly perform in various flight conditions. Avian creatures, as well as bats and other flying organisms, exhibit a striking aptitude to adjust the lift produced by their wings, displaying the capacity to repeatedly tailor their wing configurations to match specific environmental conditions. An example of this is when their wings are tightly tucked during dives for hunting, or fully extended during gliding to conserve energy. Moreover, these organisms can manipulate the curvature and twist of their wings to maintain precise control over their aerial maneuvers. In contrast, engineers in the aircraft industry continue to rely on the standard, robust and structured “one-point design” approach, which remains the most practical and feasible method to apply. Nonetheless, advancements in technology have emerged to address long-standing challenges in wing manufacturing that were previously deemed insurmountable. This convergence of different technologies has given significant momentum and recognition to the field of “morphing discipline”. When considering an aircraft, shape changes primarily relate to the wing of a fixed-wing aircraft or the blade of a rotorcraft. The concept of achieving a "smooth" shape change stems from the crucial need for drag reduction and improved flow quality, resulting in improved overall performance. The state-of-the-art morphing concepts applied to rotorcrafts comprise a wide range of investigations aimed at improving performance. Looking ahead, the primary challenge for morphing technology will be to persuade the industry of its tangible benefits. This encompasses enhanced aerodynamic efficiency, minimized installation footprint when contrasted with conventional control surface mechanisms, reduced overall weight, and an equivalent standard of safety. This research provides an overview of the current development of different control devices and explores the impact of previous and continuous research endeavors in this field. Numerous ideas for managing airflow have been explored with the aim of enhancing the performance abilities of rotary-wing aircraft. These include active morphing in rotorcraft such as leading edge slats, trailing edge flaps, and passive morphing in rotorcraft such as variable rpm rotorcraft. The aim of these blade modifications is to achieve various desired effects such as increasing the maximum lift coefficient, reducing drag, and minimizing vibratory loads. Convincing the industry of these advantages will play a crucial role in shaping the future of morphing technology.

PENGALAMAN GAME YANG MENYENANGKAN UNTUK MENGIDENTIFIKASI TIPE DUNIA METAVERSE SEBAGAI MODEL PEMBELAJARAN YANG INOVATIF

Metaverse aims to turn imagination into reality through the convergence of different technologies and should be seen as a means of lifelong learning that is not limited in space and time. The aim of this research is to identify the type of world in the metaverse to provide a pleasant user experience. The research method used in this research is descriptive qualitative. In this study, the data collection method used is the study of documentation and literature. Literature study is carried out by searching for various written sources, both in the form of books, archives, magazines, articles, and journals, as well as documents that can assist writers in exploring the types of games in the virtual metaverse world that support online learning. The results of this study can be used by educators to create an innovative learning environment, so that it can provide equal learning opportunities for all students.

Assembly challenges with Flip Chip multi-die and interposer-based SiP Modules

Abstract System in Package (SiP) modules provide integrated functionalities (processor, memory, power, etc.) in a small form factor as compared to PCB based individually laid out packages and passives. SiP modules face assembly related challenges as the complexity of packages increases (multi die, large number of passives, through mold via interposer for external memory, convergence of different technologies). This paper describes assembly challenges associated with a multi-die flip chip (processor, memory and power) module with plastic interposer for external Package-on-Package (PoP) memory. The prototype test package with three flip chip die was processed using different bump structures with bump height variation and differences in coplanarity. The underfill dispense pattern was optimized to eliminate underfill creep to the top of passive components that could lead to interfacial delamination. The interposer solder had no reliability risk due to the added mechanical strength of the underfill. Laser ablation formed through mold vias (TMV) on top of the interposers to connect to a package on package memory device. Partially defined TMV opening profile, adjacent solder bridging, formation of cold joint due to poor coplanarity, and foreign material contamination concerns were mitigated by tightening design and process parameters for flip chip attach (bump shorting and cold joint), underfill (interposer tilt, voids, material creep, dispense pattern, volume), interposer (tilt, warpage, solder voids), TMV laser ablation process (exposed Cu, depth, width), and mounting of passives components (topography, misalignment, cap solder volume).