Conventional Solder Research Articles

Reliability investigations for high temperature interconnects

Purpose – Because of the need for electronics use at temperatures beyond 150°C, high temperature resistant interconnection technologies like transient liquid phase (TLP) soldering and silver sintering are being developed which are not only replacements of high-lead solders, but also open new opportunities in terms of temperature resistance and reliability. The paper aims to address the thermo-mechanical reliability issues that have to be considered if the new interconnection technologies will be applied. Design/methodology/approach – A TLP soldering technique is briefly introduced and new challenges concerning the thermo-mechanical reliability of power devices are worked out by numerical analysis (finite element simulation). They arise as the material properties of the interconnect materials differ substantially from those known for soft solders. The effective material responses of the new materials are determined by localized unit cell models that capture the inhomogeneous structure of the materials. Findings – It is shown that both the TLP solder layer and the Ag-sinter layer have much less ductility and show less creep than conventional soft solders. The potential failure modes of an assembly made by TLP soldering or Ag sintering change. In particular, the characteristic low cycle fatigue solder failures become unlikely and are replaced either by metallization fatigue, brittle failure of intermetallic compound, components, or interfaces. Originality/value – A variety of new failure risks, which have been analyzed theoretically, can be avoided only if they are known to the potential user of the new techniques. It is shown that an optimal reliability will be strongly dependent on the actual assembly design.

A new solder matrix nano polymer composite for thermal management applications

The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupling and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn–Ag–Cu matrix into a silver nanoparticle coated electrospun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn–Ag–Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications.

Effect of Mechanical Properties of Joining Materials for Flip Chip on Thermo-mechanical Stress at Wiring Layer under Flip Chip Pad

Lead-free solders such as SnAg or SnAgCu is widely used for flip chip joining. As a result of higher melting temperature and higher elastic modulus of the lead-free solders compared to eutectic SnPb solder, defect of crack or damage in low-k dielectric layers under bond pad for flip chip joining in the semiconductor chip became a serious issue. The crack or damage is caused by mismatch of coefficient of thermal expansion (CTE) between chip and chip carrier substrate after chip join reflow. Various low melting temperature solders have been investigated and proposed as alternatives to SnAg or SnAgCu solders. Mechanical properties including creep properties are important factors as well as melting temperature for stress relief in micro joints and low-k layers.In this paper, the authors report measurement results of creep properties with fine-diameter-specimens (0.5 mm in diameter) of two low melting temperature solders (Sn-58Bi and In-3Ag) and conventional lead-free solder (Sn-3.0Ag-0.5Cu). The measurement matrix consists of four different strain rates and three different temperatures. The stress component n and the constant A in Norton's creep law were derived for each solder alloy. Then the stress analysis was performed with flip chip plastic ball grid array (FCPBGA) to evaluate stress at low-k dielectric layer under the bond pad using the obtained mechanical properties in this study.

Strength and Reliability of High Temperature Transient Liquid Phase Sintered Joints

Low-temperature transient liquid phase sintering (LT-TLPS) can be used to form high-temperature joints between metallic interfaces at low process temperatures. In this paper, we will describe the processing and shear strength, along with the shock fatigue resistance of sintered joints made by this process. Joints made from different ratios of Ni and Cu high melting temperature constituents paired with Sn-based low melting temperature constituents have been evaluated. For the shear studies, the softening behavior of test samples joined by Ni-Sn3.5Ag and (Ni,Cu)-Sn3.5Ag sinter pastes have been assessed using a fixture designed for high temperature shear testing up to 600°C. The reliability of sinter paste joints in drop-shock environments will be discussed. It is shown that joints formed from these sinter pastes possess improved drop-shock reliability compared to Sn3.5Ag solder joints and melting temperatures considerably higher than those of conventional high temperature solders (e.g. Pb5.0Sn2.5Ag).

Revision and destabilization of acrylic-pin external skeletal fixation constructions using a conventional soldering iron

Revision and destabilization of acrylic-pin external skeletal fixation constructions using a conventional soldering iron -

Evaluation of mechanical properties of low-Ag ball grid array solder joints using a high-speed ball shear test

Solder joints of Sn–1.0Ag and Sn–1.0Ag–0.1Ce on electroless nickel/electroless palladium/immersion gold (ENEPIG) were studied and mechanically evaluated using a high-speed shear test. The effect of Pd thickness in ENEPIG on the reliability of solder joints was evaluated after multiple reflows. Microstructural observations of the solder joint interfaces and fractures after shear tests are shown. For comparison, conventional SAC305 Pb-free solder was also mechanically evaluated under the same conditions. By adding a thin Pd layer in ENEPIG surface finish, the intermetallic compound (IMC) layer’s morphology of SAC305 change from needle type (as Pd thickness=0μm) to scallop type (as Pd thickness=0.1μm). While the intermetallic compounds (IMCs) layer’s morphology of 1.0Ag solders change from facet type (as Pd thickness=0μm) to needle type (as Pd thickness=0.1μm). ENEPIG with thicker Pd layers was suitable for 1.0Ag solders during high speed shear test whereas conventional SAC305 showed the highest shear strength with an ENIG surface finish.

Review of Ni-Cu Based Front Side Metallization for c-Si Solar Cells

Given the high percentage of metal cost in cell processing and concerns due to increasing Ag prices, alternative metallization schemes are being considered. Ni-Cu based front side metallization offers potential advantages of finer grid lines, lower series resistance, and reduced costs. A brief overview of various front side patterning techniques is presented. Subsequently, working principle of various plating techniques is discussed. For electroless plated Ni seed layer, fill factor values nearing 80% and efficiencies close to 17.5% have been demonstrated, while for Light Induced Plating deposited layers, an efficiency of 19.2% has been reported. Various methods for qualifying adhesion and long term stability of metal stack are discussed. Adhesion strengths in the range of 1–2.7 N/mm have been obtained for Ni-Cu contacts tabbed with conventional soldering process. Given the significance of metallization properties, different methods for characterization are outlined. The problem of background plating for Ni-Cu based metallization along with the various methods for characterization is summarized. An economic evaluation of front side metallization indicates process cost saving of more than 50% with Ni-Cu-Sn based layers. Recent successful commercialization and demonstration of Ni-Cu based metallization on industrial scale indicate a potential major role of Ni-Cu based contacts in near future.

Ultra‐short vertically aligned carbon nanofibers transfer and application as bonding material

PurposeThe transferred carbon nanofibers (CNFs) can be applied in flip chip package as interconnect material, as an alternative to the conventional solder and conductive adhesive (CA) materials.Design/methodology/approachThe structure of CNFs was confirmed by transmission electron microscopy (TEM). The electrical performance of the vertically aligned carbon nanofibers (VACNFs) joint was measured by four points probe method and compared to conventional lead‐free solder Sn3.0Ag0.5Cu, pure indium and silver CA. A shear test was carried out in order to evaluate the mechanical performance of VACNFs joint. After the shear test, the fracture surface was analyzed by scanning electron microscopy and energy dispersive spectroscopy (SEM‐EDS).FindingsThe results showed a high success rate in the transfer of VACNFs from growth chip to target chip. The Au‐coated CNF can be wetted well with melted indium during the transfer and bonding process. In‐Au intermetallic compound (IMC) formed on the surface of CNF. The electrical and mechanical performance of VACNFs is comparable to that of the traditional interconnect materials. The fracture surface is located at the interface between VACNFs and chips. The stacked‐cone structure of CNF can be confirmed from a cross‐section of the break CNF by TEM.Originality/valueUltra‐short VACNFs were grown and first successfully transferred to the target chip using a process which required little pressure, low temperature and short time.

A Pyrenylpropyl Phosphonic Acid Surface Modifier for Mitigating the Thermal Resistance of Carbon Nanotube Contacts

Efforts to utilize the high intrinsic thermal conductivity of carbon nanotubes (CNTs) for thermal transport applications, namely for thermal interface materials (TIMs), have been encumbered by the presence of high thermal contact resistances between the CNTs and connecting materials. Here, a pyrenylpropyl‐phosphonic acid surface modifier is synthesized and applied in a straight forward and repeatable approach to reduce the thermal contact resistance between CNTs and metal oxide surfaces. When used to bond nominally vertically aligned multi‐walled CNT forests to Cu oxide surfaces, the modifier facilitates a roughly 9‐fold reduction in the thermal contact resistance over dry contact, enabling CNT‐based TIMs with thermal resistances of 4.6 ± 0.5 mm2 K W−1, comparable to conventional metallic solders. Additional experimental characterization of the modifier suggests that it may be used to reduce the electrical resistance of CNT‐metal oxide contacts by similar orders of magnitude.

Development of high strength Sn-Mg solder alloys with reasonable ductility

This study discussed the development of a series of new lead-free Sn-Mg solders by incorporating varying amounts of Mg (0.8, 1.5 and 2.5 wt. %) into pure Sn using disintegrated melt deposition technique followed by room temperature extrusion. All extruded Sn and Sn-Mg solder samples were characterized. Microstructural characterization studies revealed equiaxed grain morphology, minimal porosity and relatively uniform distribution of secondary phase. Better coefficient of thermal expansion was observed for Sn-2.5Mg sample when compared to conventional Sn-37Pb solder. Melting temperature of Sn-1.5Mg was found to be 212°C which is much lower than the conventional Sn-Ag-Cu or Sn-Cu (227°C) solders. Microhardness was increased with increasing amount of Mg in pure Sn. Room temperature tensile test results revealed that newly developed Sn-Mg solders exhibit enhanced strengths (0.2% yield strength and ultimate tensile strength) with comparable (if not better) ductility when compared to other commercially available and widely used Sn-based solder alloys.

Creep properties of low-temperature sintered nano-silver lap shear joints

As a potential alternative to conventional solders and adhesive films, low-temperature sintered nano-silver paste, as a result of its high thermal and electrical conductivity (240Wm−1K−1 and 4.1×107Sm−1, respectively) and high melting temperature (961°C), can be used for connecting chips that require high temperature operation and high heat dissipation ability. In the present work, a number of creep tests were carried out to study the effect of stress and temperature on the creep behavior of low-temperature sintered nano-silver lap shear joints. The steady-state creep flow behavior of the joints was discussed. In general, the creep shear strain rate increased as the applied stress and ambient temperature increased. When the creep strain rate was described by the Arrhenius power-law model, we found that the stress exponent and activation energy were temperature dependent and stress dependent, respectively. A modified power-law model with a temperature-dependent stress exponent and stress-dependent activation energy was proposed to describe accurately the creep flow of the sintered lap shear joints.

Microstructure Evolution of Cu-Cored Sn Solder Joints Under High Temperature and High Current Density

This work investigated the microstructure evolution of Cu-cored Sn solder joints under high temperature and high current density. The Cu6Sn5 phase formed at both the Cu core/Sn interface and Cu wire/Sn interface right after reflow and grew with increasing annealing time, while the Cu3Sn phase formed and grew at the Cu/Cu6Sn5 interfaces. Intermetallic compound (IMC) growth followed a linear relationship with the square root of annealing time due to a diffusion-controlled mechanism. Under high current density, the thickness of the interfacial IMCs of the Cu core/Sn interface at the cathode side increased and the Cu core/Sn interface at the anode side exhibited an irregular and serrated morphology with prolonged current stressing time. Finite-element simulation was carried out to obtain the distribution of current density in the solder joint. Since Cu has lower resistivity, the electrical current primarily selected the Cu core as its electrical path, resulting in current crowding at the Cu core and the region between the Cu core and Cu wire. Compared with the conventional solder joint, the electromigration (EM) lifetime of the Cu-cored solder joint was much longer.

Nickel–Tin Transient Liquid Phase Bonding Toward High-Temperature Operational Power Electronics in Electrified Vehicles

This paper presents the concept, fabrication, and evaluation for quality and reliability of nickel-tin transient liquid phase (Ni-Sn TLP) bonding that provides high reliability for high-temperature operational power electronics in electrified vehicles. The need for automotive power electronics to operate at high-temperature presents significant challenges in terms of packaging and bonding technology used. TLP bonding is one attachment approach that addresses these challenges and facilitates high remelting temperatures while allowing processing to occur at relatively low temperatures and pressures. In particular, the Ni-Sn TLP bonding process exhibits a number of desirable characteristics for power electronics, including popularity in conventional power electronics, low cost, and uniform and homogeneous alloy formation. The work herein presents Ni-Sn TLP bonding (ready for high-temperature operation) as applied to silicon power devices of relatively large size (12 mm × 9 mm). The quality and reliability of the developed bonding process was characterized using material, optical, and electrical analysis. Analysis indicates that the resulting bondline is uniformly composed of Ni <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> Sn <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sub> alloy throughout the bond area. This bonding approach has exhibited excellent reliability for bonded devices after thermal cycling from -40°C to 200°C. Electrical properties of the bonded insulated gate bipolar transistor power devices demonstrated that Ni-Sn TLP bonding exhibits electrical performance comparable with conventional solder and is reliable at high-temperature operation.

Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn–3.5 Ag–0.5 Cu (SAC355) solder alloy

Regarding to the development of Sn–Ag–Cu (SAC) lead-free solders for advance electronic components, the effect of 0.5 wt% nano-sized ZnO particles on the thermal, microstructure and tensile properties of Sn–3.5 wt% Ag–0.5 wt% Cu (SAC355) lead-free solder alloy is investigated. The results showed that addition of 0.5 wt% nano-sized ZnO particles into the conventional lead-free SAC355 solder caused a slight increase of its liquidus temperature by about 1.1 K. Metallographic observations of SAC355–0.5 wt% ZnO (composite solder) revealed an obvious refinement in the microstructure compared with the SAC355 (non-composite) solder. Consequently, addition of nano sized-ZnO particles could improve the stress–strain characteristics proof stress (σy0.2) and ultimate strength (σUTS). This was rendered to suppressing effect of ZnO on the coarsening of the intemetallic compounds (IMCs) Ag3Sn and Cu6Sn5 during the solidification process in the composite solder and subsequently dispersion strengthening is considered to be the dominating mechanism. This will allow the use of SAC355 composite lead-free solder alloy, to be consistent with the conditions of usage for conventional SAC solder alloys and to overcome the serious problem of the excessive growth of IMCs and the formation of microvoids in the SAC lead-free solder alloys.

Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging

Conventional solders cannot meet the requirements for high-temperature applications. Recently, a low-temperature sintering technique involving a nanosilver paste has been developed for attaching semiconductor chips to substrates. Sintered nanosilver joints showed high reliability in high-temperature applications. We used the nanosilver paste to attach 10 mm × 10 mm chips by introducing a pressure as low as only 1 MPa during drying at 185°C. Die-shear tests showed that shear strengths of higher than 50 MPa could be generated by applying 5 MPa at 225°C for only 10 s or 1 MPa at 150°C for 600 s, followed by sintering for only 60 s at 275°C. The sintering temperature could be reduced to 250°C in most applications with a slight reduction in shear strength. As a result of good bonding, significant plastic flow and ductile fracture of the sheared silver joint could be observed by scanning electron microscopy (SEM). SEM also showed that the fracture of the sheared silver joint was a cohesive failure.

Corrosion Behaviour of Lead-Free and Sn-Pb Solders in 3.5wt% NaCl

The current need to produce lead-free solders in the electronic industries makes it necessary for the replacing solders to have properties which are comparable if not better than the conventional Sn-Pb solders. Thus this research was conducted to compare the corrosion behaviour of lead-free solders with composition Sn-4.0Ag-0.5Cu (SAC405), and Sn-3.0Ag-0.5Cu (SAC305) with conventional Sn-37Pb solders. Corrosion tests were conducted using salt spray tests with 3.5% sodium chloride (NaCl) solutions. The samples were characterized after corrosion tests by using SEM, EDS and XRD. The results showed that the elements present in the solders contributed to galvanic corrosion mechanism that affected the overall corrosion behaviour of the solders.

Carbon nanotube thermal interfaces enhanced with sprayed on nanoscale polymer coatings

Vertical carbon nanotube (CNT) forests bonded at room temperature with sprayed on nanoscale polymer coatings are found by measurement to produce thermal resistances that are on a par with those of conventional metallic solders. These results are achieved by reducing the high contact resistance at CNT tips, which has hindered the development of high performance thermal interface materials based on CNTs. A spray coating process is developed for depositing nanoscale coatings of polystyrene and poly-3-hexylthiophene onto CNT forests, as a bonding agent that mitigates thermal resistance by enhancing the area available for heat transfer at CNT contacts. Resistances as low as 4.9 ± 0.3 mm2 K W−1 are achieved for the entire polymer coated CNT interface structure. The suitability of the spray coating process for large-scale implementation and the role of polymer and CNT forest thickness in determining the thermal resistance are also examined.

Isothermal Section of the Sn-Fe-Zn Ternary System at 270°C

With a relatively low liquidus temperature, the eutectic Sn-Zn alloy is suitable replacement for conventional eutectic Sn-Pb solder in the electronic industry. One of the most important materials as a lead-frame is Fe-42Ni alloy (Alloy 42) in the microelectronic packaging. The Sn-Fe-Zn ternary phase diagram is a powerful and useful tool to understand the interfacial reactions between Sn-Zn alloy and Alloy 42 substrate (Fe-rich alloy). The isothermal section of the Sn-Fe-Zn ternary system was experimentally investigated at 270oC in this study. Ternary Sn-Fe-Zn alloys were prepared and annealed at 270 oC to determine the isothermal section of the Sn-Fe-Zn ternary system. The experimental results revealed that no ternary intermetallic compound was formed, and noticeable Zn solubility was observed in the FeSn2 phase. The isothermal section of the Sn-Fe-Zn ternary system consists of nine single-phase areas, thirteen two-phase areas, and seven tie-triangles at 270 oC

Low Temperature Flex‐on‐Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding

In this study, solder ball incorporated polyvinylidenefluoride (PVDF) nanofiber was added into the ACF system to overcome short circuit issues of fine pitch flex‐on‐flex (FOF) assembly. Also, in order to improve the thermal mismatch of the flexible substrate which can lead to electrode misalignment during the bonding process, low melting temperature Sn58Bi solder balls were used with vertical ultrasonic (U/S) bonding method. When performing FOF assembly using PVDF nanofiber/Sn58Bi solder ACF and vertical ultrasonic bonding, PVDF nanofiber/Sn58Bi solder ACFs showed 34% higher solder capture rate on an electrode compared to conventional Ni ACFs and conventional Sn58Bi solder ACFs. Additionally, PVDF nanofiber/Sn58Bisolder ACFs showed 100% insulation between neighboring electrodes where conventional Ni ACFs and conventional Sn58Bi solder ACFs showed 75% and 87.5% insulation. Other electrical properties such as contact resistance and current handling capability as well as reliability test of PVDF nanofiber/Sn58Bi solder ACFs showed improved results compared to those of conventional Ni ACFs, which proves the formation of stable solder joint of PVDF nanofiber/Sn58Bi solder ACFs.

Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints

Sn-Ag-Cu (SAC) solder alloys, such as Sn-3.0Ag-0.5 Cu (SAC305) are the popular choices of lead-free solders replacing SnPb solders. However, SAC solders are more brittle in nature due to stiffness and excessive intermetallic compounds growth at the solder joint to pad interface. This leads to higher risk of solder joints failures. Memory module-type smaller lead-free ball grid array (BGA) packages are constantly under dynamic stresses during handling and thermal stresses during operations. It is important to understand the dynamic performance and long-term reliability of memory module lead-free BGAs. It is believed that the printed circuit board (PCB) design variations cause dynamic and long-term failure discrepancies in the fields. In this paper, different pad and trace designs are introduced to evaluate the effects of PCB design variations on the bend and accelerated thermal cycling (ATC) performance of lead-free solder joints. Pad designs with nonsolder mask defined, solder mask defined (SMD), and a unique web design are assembled and tested. Different solder alloys, including SAC305, Sn-1.0Ag-0.5Cu (SAC105) SAC105, and SnPb solders, have been evaluated in this paper. Different PCB materials have also been evaluated in the test. Four-point monotonic bend tests are performed to characterize the bending performance variations with different PCB designs and compared with conventional Sn-Pb solder. The SMD pad is shown to have the best bend performance among all other types of designs in this paper. In addition, this design also shows improvement in mitigation of PCB pad cratering with lead-free solders. Wide trace width seems to degrade the strength and is not preferred. Just as it shows superior shock resistance when compared with SAC305, the SAC105 solder alloy also shows better bend performance. There is no significant improvement in bend performance with web design. After aging treatment, bend performance of both SAC305 and SAC105 degraded by up to 34% and 29%, respectively. However, the bend performance of eutectic SnPb is actually improved after aging. ATC tests are performed to investigate the effects of design variations on the long-term reliability of lead-free solder joints; SMD design shows less reliability life than others. The implications of these results for the reliability of lead-free solder joints are discussed in this paper.