Abstract
This work investigated the microstructure evolution of Cu-cored Sn solder joints under high temperature and high current density. The Cu6Sn5 phase formed at both the Cu core/Sn interface and Cu wire/Sn interface right after reflow and grew with increasing annealing time, while the Cu3Sn phase formed and grew at the Cu/Cu6Sn5 interfaces. Intermetallic compound (IMC) growth followed a linear relationship with the square root of annealing time due to a diffusion-controlled mechanism. Under high current density, the thickness of the interfacial IMCs of the Cu core/Sn interface at the cathode side increased and the Cu core/Sn interface at the anode side exhibited an irregular and serrated morphology with prolonged current stressing time. Finite-element simulation was carried out to obtain the distribution of current density in the solder joint. Since Cu has lower resistivity, the electrical current primarily selected the Cu core as its electrical path, resulting in current crowding at the Cu core and the region between the Cu core and Cu wire. Compared with the conventional solder joint, the electromigration (EM) lifetime of the Cu-cored solder joint was much longer.
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