Micro-optics offers the ability to realize massively parallel, surface-normal interconnects at the chip scale. In this context, we investigate the integration of a 10-Gbytes/s, 850-nm vertical-cavity surface-emitting laser (VCSEL) with a 2×2 array of continuous surface profile, diffractive optical elements to demonstrate a prototype system that incorporates 3-D, highly dense, parallel optical interconnects. The integration is achieved using a novel conductive polymer-based flip-chip process, which is implemented using conventional fabrication techniques. We present experimental results from the design, fabrication, integration, and characterization of the prototype system.