Chemical composition of four commercially available light-cured opaque resins was investigated and properties of the resins; depth of cure, amount of residual monomer eluted from these materials and shear bond strength were evaluated. Monomer part of the opaque resins consisted of methyl methacrylate (MMA), di (methacryloxyethyl) trimethylhexamethylene diurethan (UDMA), neopenthylglycol dimethacrylate (NPG), triethyleneglycol dimethacrylate (3 G), 2, 2-bis (4-methacryloxypolyethoxy phenyl) propane (2.6 E) and 2, 2-bis [4-(3-methacryloxy-2-hydroxy propoxy) phenyl] propane (Bis-GMA). Inorganic filler content of the materials were in the range of 48 to 96 wt%. Two opaque resins showed large ash content. The shape of the filler was the splinter large fillers and the size was about over 10 μm. Within the three MMA-based opaque resins, depth of cure increased with decrease in MMA content of monomer composition, while amount of residual monomer opposed. The bond strengths of three opaque resins joined to alumina-blasted and heated Au-Ag-Pd alloy were 12 to 13 MPa after 5, 000 thermocycles. However, the one resin showed 0 MPa. These results suggest that it should be necessary to improve the bond strength, photo-curability and handling properties of the opaque resins, and to examine the optimal composition of the light-cured opaque resin.