Tribological properties at the polishing interface during chemical mechanical polishing (CMP) in different slurry chemical environments need to be studied in greater detail, to understand the mechanism and science of CMP. The chemical reactions in different environments significantly affect the actual tribological behavior at the interface. In the present research, slurry temperature, oxidizer percentage and complexing agent concentrations in the slurry are varied and their effect on the tribology at the interface on polyurethane pads has been studied. Specifically, the main goal of this research is to develop fundamental understanding about the role of coefficient of friction in CMP and the effect of slurry characteristics on the tribology at the interface. From the results the effect of slurry temperature was found to be very weak when compared to the other process parameters such as pressure and velocity.