Complementary Metal-oxide-semiconductor Logic Circuits Research Articles

Design and Validation of a V-Gate n-MOSFET-Based RH CMOS Logic Circuit with Tolerance to the TID Effect

This study designed a radiation-hardened (RH) complementary metal oxide semiconductor (CMOS) logic circuit based on an RH variable-gate (V-gate) n-MOSFET that was resistant to the total ionizing dose (TID) effect and evaluated its tolerance to radiation. Among the different CMOS logic circuits, NOT, NAND, and NOR gates were designed using V-gate n-MOSFETs by employing layout transformation techniques and standard p-MOSFETs. Before the process design, we predicted the radiation damage using modeling and simulation techniques and validated the tolerance by conducting actual radiation tests after the process design. Furthermore, we implemented the CMOS logic circuit process design in a 0.18 µm CMOS bulk process. The actual radiation test applied a total cumulative radiation dose of 25 kGy at 5 kGy per hour in a high-level gamma-ray irradiation facility. Consequently, the resistance of the RH CMOS logic circuit based on the RH V-gate n-MOSFET to the TID effect was validated through experiments.

(Invited) Achieving Lower Power Logic Using P-Type Metal Oxide Thin Film Transistors

Thin film transistors (TFTs) have enabled the active matrix displays that are a ubiquitous part of everyday life, from mobile phones and tablets through to desktop monitors and home televisions. They are used in the circuit at each pixel over the display as they can be fabricated for relatively low cost with excellent uniformity at low temperatures over large areas on glass substrates. These pixel circuits only require either n-channel or p-channel enhancement mode TFTs. However, there has long been a desire to integrate the display driver electronics onto the display panel as an alternative to connecting silicon-based integrated circuits using complementary metal oxide semiconductor (CMOS) field effect transistors (FETs) to displays. More recently, there has been an increasing interest in producing other logic circuits using TFTs on glass and plastic substrates as this could enable a new generation of products with embedded electronics. However, both of these applications need low power logic circuits. CMOS is an inherently low power technology, but it requires both n-channel and p-channel transistors. Whilst this can be realised in silicon CMOS FETs, it has not yet been achieved using TFTs because it has proved difficult to realise both n-channel and p-channel devices using one material system at low cost. For example, hydrogenated amorphous silicon can be used to make reasonable n-type material but not p-type.Thin film oxide semiconductors such as amorphous indium gallium zinc oxide have been successfully commercialised in the pixel circuits of active matrix displays as they possess high field effect mobility, low threshold voltage, low off-state current and a high switching ratio. There is therefore a lot of interest in finding a suitable complementary p-type metal oxide thin film material to allow CMOS-type logic to be realised using this material system.Cuprous oxide is one such promising candidate material as the top of the valence band is dominated by states which form as a result of hybridisation of the completely filled Cu 3d orbitals and the O 2p orbitals. These hybridised states are less localised and have a higher dispersion with a resulting decrease in the effective mass of holes in these states and a higher carrier mobility. The results of an extensive study of this material shows that the grain structure is of critical importance with [100] oriented films resulting in a higher mobility. Furthermore, the impact of grain boundaries on conduction must be controlled. Although this allows TFTs with reasonable on-state current to be fabricated, it is found that there is a significant residual off-state current which is a result of electron accumulation in the channel. This is consistent with the high off-state current that has been observed widely in TFTs using p-type metal oxide thin film materials.The low off-state current in silicon MOSFETs means that the geometric transistor design in low power CMOS logic circuits only needs to focus on the effect of the on-state current in the p-channel and n-channel transistors. However, in TFTs, the much larger off-state current also becomes important as it can end up being a significant parameter when calculating the power consumption of CMOS logic circuits. An alternative geometric design parameter for TFT logic circuits is presented. This compares the maximum switching current with the static currents allowing optimisation based on both the noise margin and static power consumption. The result is improved performance of TFT-based CMOS logic circuits using the n- and p-type thin film oxide semiconductors that are currently available.

Polarity Control and Weak Fermi-Level Pinning in PdSe2 Transistors.

Two-dimensional (2D) materials have been considered key materials for the future logic devices due to the excellent electrostatic integrity originating from their ultrathin nature. However, the carrier polarity control of 2D material field-effect transistors (FETs) still remains a challenging issue, hindering the realization of complementary logic function in the 2D material platform. Here, we report a comprehensive study on the electrical characteristics of PdSe2 FETs with different metal contacts. It is found that the carrier polarity in PdSe2 FETs can be modulated simply by changing the metal contact due to the weak Fermi-level pinning in PdSe2. We demonstrate a complementary metal-oxide-semiconductor (CMOS) inverter using the same channel material PdSe2 for n- and p-MOSFETs but with different metal contacts, suggesting the possible realization of PdSe2-based CMOS logic circuits.

Thread-Like CMOS Logic Circuits Enabled by Reel-Processed Single-Walled Carbon Nanotube Transistors via Selective Doping.

The realization of large-area electronics with full integration of 1D thread-like devices may open up a new era for ultraflexible and human adaptable electronic systems because of their potential advantages in demonstrating scalable complex circuitry by a simply integrated weaving technology. More importantly, the thread-like fiber electronic devices can be achieved using a simple reel-to-reel process, which is strongly required for low-cost and scalable manufacturing technology. Here, high-performance reel-processed complementary metal-oxide-semiconductor (CMOS) integrated circuits are reported on 1D fiber substrates by using selectively chemical-doped single-walled carbon nanotube (SWCNT) transistors. With the introduction of selective n-type doping and a nonrelief photochemical patterning process, p- and n-type SWCNT transistors are successfully implemented on cylindrical fiber substrates under air ambient, enabling high-performance and reliable thread-like CMOS inverter circuits. In addition, it is noteworthy that the optimized reel-coating process can facilitate improvement in the arrangement of SWCNTs, building uniformly well-aligned SWCNT channels, and enhancement of the electrical performance of the devices. The p- and n-type SWCNT transistors exhibit field-effect mobility of 4.03 and 2.15 cm2 V-1 s-1 , respectively, with relatively narrow distribution. Moreover, the SWCNT CMOS inverter circuits demonstrate a gain of 6.76 and relatively good dynamic operation at a supply voltage of 5.0 V.

Microwave Imaging Using CMOS Integrated Circuits with Rotating 4 × 4 Antenna Array on a Breast Phantom

A digital breast cancer detection system using 65 nm technology complementary metal oxide semiconductor (CMOS) integrated circuits with rotating 4 × 4 antenna array is presented. Gaussian monocycle pulses are generated by CMOS logic circuits and transmitted by a 4 × 4 matrix antenna array via two CMOS single-pole-eight-throw (SP8T) switching matrices. Radar signals are received and converted to digital signals by CMOS equivalent time sampling circuits. By rotating the 4 × 4 antenna array, the reference signal is obtained by averaging the waveforms from various positions to extract the breast phantom target response. A signal alignment algorithm is proposed to compensate the phase shift of the signals caused by the system jitter. After extracting the scattered signal from the target, a bandpass filter is applied to reduce the noise caused by imperfect subtraction between original and the reference signals. The confocal imaging algorithm for rotating antennas is utilized to reconstruct the breast image. A 1 cm3 bacon block as a cancer phantom target in a rubber substrate as a breast fat phantom can be detected with reduced artifacts.

Mechanically Flexible and High-Performance CMOS Logic Circuits.

Low-power flexible logic circuits are key components required by the next generation of flexible electronic devices. For stable device operation, such components require a high degree of mechanical flexibility and reliability. Here, the mechanical properties of low-power flexible complementary metal–oxide–semiconductor (CMOS) logic circuits including inverter, NAND, and NOR are investigated. To fabricate CMOS circuits on flexible polyimide substrates, carbon nanotube (CNT) network films are used for p-type transistors, whereas amorphous InGaZnO films are used for the n-type transistors. The power consumption and voltage gain of CMOS inverters are <500 pW/mm at Vin = 0 V (<7.5 nW/mm at Vin = 5 V) and >45, respectively. Importantly, bending of the substrate is not found to cause significant changes in the device characteristics. This is also observed to be the case for more complex flexible NAND and NOR logic circuits for bending states with a curvature radius of 2.6 mm. The mechanical stability of these CMOS logic circuits makes them ideal candidates for use in flexible integrated devices.

5-Gb/s and 10-GHz Center-Frequency Gaussian Monocycle Pulse Transmission Using 65-nm Logic CMOS With On-Chip Dipole Antenna and High-&lt;inline-formula&gt; &lt;tex-math notation="TeX"&gt;\(\kappa \) &lt;/tex-math&gt;&lt;/inline-formula&gt; Interposer

Interchip data transmission was demonstrated using impulse radio ultrawideband complementary metal- oxide-semiconductor (CMOS) transmitter integrate circuits with on-chip dipole antennas. A differential pseudorandom binary sequence of 2 7 data of Gaussian monocycle pulse (GMP) was formed by 65-nm CMOS logic circuits using upand downpulses with certain gate delays. The CMOS transmitter generated 5-Gb/s GMP with the center frequency of 10 GHz. To improve transmission gains, an interposer with the high dielectric constant (e r = 38) and optimized thickness was inserted under the CMOS chips as a dielectric slab waveguide. 2-Gb/s GMP signals were transmitted and received in the distance of 10 mm by use of the CMOS on-chip antennas and the high-κ interposer.

Air-Stable Conversion of Separated Carbon Nanotube Thin-Film Transistors from p-Type to n-Type Using Atomic Layer Deposition of High-κ Oxide and Its Application in CMOS Logic Circuits

Due to extraordinary electrical properties, preseparated, high purity semiconducting carbon nanotubes hold great potential for thin-film transistors (TFTs) and integrated circuit applications. One of the main challenges it still faces is the fabrication of air-stable n-type nanotube TFTs with industry-compatible techniques. Here in this paper, we report a novel and highly reliable method of converting the as-made p-type TFTs using preseparated semiconducting nanotubes into air-stable n-type transistors by adding a high-κ oxide passivation layer using atomic layer deposition (ALD). The n-type devices exhibit symmetric electrical performance compared with the p-type devices in terms of on-current, on/off ratio, and device mobility. Various factors affecting the conversion process, including ALD temperature, metal contact material, and channel length, have also been systematically studied by a series of designed experiments. A complementary metal-oxide-semiconductor (CMOS) inverter with rail-to-rail output, symmetric input/output behavior, and large noise margin has been further demonstrated. The excellent performance gives us the feasibility of cascading multiple stages of logic blocks and larger scale integration. Our approach can serve as the critical foundation for future nanotube-based thin-film macroelectronics.

Threshold voltage control of oxide nanowire transistors using nitrogen plasma treatment

In developing complementary metal-oxide semiconductor logic circuits using N-type semiconducting nanowires, threshold voltage (Vth) control is crucial because the driving voltage should be established in relation to the Vth dispersion of transistors. In this study, using N2 plasma treatment, positive shifts of SnO2 nanowire transistor (NWT) devices were produced as desired without degrading the nanowire surfaces. The NWT devices exhibited positive Vth shifts of ∼0.9 and ∼1.5 V and decreases in on-currents of ∼20% and ∼40% at plasma source powers of 200 and 400 W, respectively, without any changes in subthreshold slope or off-current. The positive Vth shifts and decreases in on-current can be explained by assuming that nitrogen ions (N3−) filled in for the existing oxygen vacancies (Vo, Vo+, and Vo++) and that consequently, the amount of oxygen vacancies playing a role in electron-trapping decreased.

New non‐volatile logic based on spin‐MTJ

AbstractAs the minimum dimensions of complementary metal oxide semiconductor (CMOS) transistors shrink down to 90 nm and below, some physical obstacles have been observed which prevent rigidly this miniaturization. For example, high transistor leakage currents lead to an important increase of the ‘idle’ power consumption of CMOS memory arrays. Many nanodevices are therefore the subject of research and development to help CMOS technology continue to downscale by Moore's law. Among them, the magnetic tunnel junction (MTJ) is one of the most promising candidates, because its non‐volatility offers the possibility to power off the chip to greatly reduce the ‘idle’ energy dissipation of conventional CMOS circuits. Moreover, its resistance value property (several kΩ), compatible with CMOS transistor conductivity, allows its states to be sensed easily with CMOS circuits. The novel spin transfer torque (STT) writing approach, which has been recently introduced and developed, reduces significantly the switching energy and data disturbance when compared with the conventional MTJ writing approach. It makes the MTJ technology much more suitable than other nanodevices for commercial applications. In this paper, hybrid STT‐based MTJ (spin‐MTJ)/CMOS logic circuits and some design techniques are proposed based on STMicroelectronics 90 nm CMOS technology and the published Hitachi spin‐MTJ technology. A first prototype has been simulated and evaluated. (© 2008 WILEY‐VCH Verlag GmbH &amp; Co. KGaA, Weinheim)

A minimum total power methodology for projecting limits on CMOS GSI

A circuit design methodology minimizing total power drain of a static complementary metal-oxide-semiconductor (CMOS) random logic network for a prescribed performance, operating temperature range, and short channel threshold voltage rolloff is investigated. Physical, continuous, smooth, and compact "transregional" MOSFET drain current models that consider high-field effects in scaled devices and permit tradeoffs between saturation drive current and subthreshold leakage current are employed to model CMOS circuit performance and power dissipation at low voltages. Transregional models are used in conjunction with physical short channel MOSFET threshold voltage rolloff models and stochastic interconnect distributions to project optimal supply voltages, threshold voltages, and device channel widths minimizing total power dissipated by CMOS logic circuits for each National Technology Roadmap for Semiconductors (NTRS) technology generation. Optimum supply voltage, corresponding to minimum total power dissipation, is projected to scale to 510 mV for the 50-nm 10-GHz CMOS generation in the year 2012. Techniques exploiting datapath parallelism to further scale the supply voltage are shown to offer decreasing reductions in power dissipation with technology scaling.

Simultaneous power supply, threshold voltage, and transistor size optimization for low-power operation of CMOS circuits

This paper demonstrates a new approach for minimizing the total of the static and the dynamic power dissipation components in a complementary metal-oxide-semiconductor (CMOS) logic network required to operate at a specified clock frequency. The algorithms presented can be used to design ultralow-power CMOS logic circuits by joint optimization of supply voltage, threshold voltage and device widths. The static, dynamic and short-circuit energy components are considered and an efficient heuristic is developed that delivers over an order of magnitude savings in power over conventional optimization methods.

SOI for digital CMOS VLSI: design considerations and advances

This paper reviews the recent advances of silicon-on-insulator (SOI) technology for complementary metal-oxide-semiconductor (CMOS) very-large-scale-integration memory and logic applications. Static random access memories (SRAMs), dynamic random access memories (DRAMs), and digital CMOS logic circuits are considered. Particular emphases are placed on the design issues and advantages resulting from the unique SOI device structure. The impact of floating-body in partially depleted devices on the circuit operation, stability, and functionality are addressed. The use of smart-body contact to improve the power and delay performance is discussed, as are global design issues.

Monolithic CMOS digital integrated circuits in 6H-SiC using an implanted p-well process

We report the first p-well Complementary Metal Oxide Semiconductor (CMOS) digital integrated circuits in 6H-SiC. Enhancement mode NMOSFET's and PMOSFET's are fabricated on implanted p-wells and n-type epilayers, respectively. CMOS logic circuits such as inverters, NAND, NOR, XOR, flip-flops, half adders, and 11-stage ring oscillators are implemented using these devices and operated at room temperature, The inverters show stable operation at room temperature and 300/spl deg/C with V/sub dd/=10 and 15 V.

Optocoupler made from semiconducting polymers

Optocouplers (optoisolators) were fabricated using semiconducting polymers. The input unit is a polymer light emitting diode with an external quantum efficiency of ∼1% photons/electron. The output unit is a polymer photodiode with a quantum yield of ∼35% electrons/photon at 590 nm. Both units can be operated at bias voltages sufficiently low to be compatible with TTL and complementary metal-oxide semiconductor logic circuits. Since the transfer characteristic is nearly linear, the polymer optocoupler can be used in analogue circuits as well. The current transfer ratio reaches 2 × 10−3 under-10V reverse bias, comparable to that of commercial inorganic optocouplers.