CSW’2022 continued the tradition of bringing together the compound semiconductor community to discuss the most recent advances in the field. After the successful meetings in Stockholm, Sweden in 2021 (held virtually due to Covid-19), Nara, Japan (2019), and Boston, USA in 2018, CSW came back to the US, to the beautiful college town of Ann Arbor, Michigan, a perfect setting to reunite the semiconductor community. As in previous years, CSW combined both the International Symposium on Compound Semiconductors (ISCS, now in its 48t year) and International Conference on Indium Phosphide and Related Materials (IPRM, in its 33rd year) conferences into a single integrated event. ISCS, established in 1966, is the preeminent international conference in the field of III–V, II–VI, and IV–IV semiconductors, whereas IPRM is, since 1989, a major worldwide conference on indium phosphide and related materials, from physics to applications. CSW’2022 was successfully organized during June 1–3, 2022, presenting 4 plenary talks, 2 tutorials, 37 invited talks, 94 contributed talks and 107 posters among an audience spread over Europe, Asia, and North America. In order that these contributions may meet even a wider audience, Wiley offered the authors an opportunity to publish their papers in physica status solidi (a). This resulted in this special issue of physica status solidi (a) containing 12 papers related to applications and materials science of compound semiconductors. The conference abundantly covered topics from “Materials Characterization” and “Device technologies”, to “Physics of Emerging Devices”, allowing the community to engage in fruitful discussions. This year CSW launched a special event to welcome “New Faces” in compound semiconductors and continued the tradition of rump sessions. Overall, we had about 252 registrants, their participation showing a healthy sign of return to in-person events! We gratefully acknowledge the substantial support received from individuals and organizations that helped us to make CSW’2022 a successful event: the technical program committee for efficiently evaluating all the submitted abstracts; the IEEE Electron Devices Society, IEEE conference management team, and all our industrial sponsors and exhibitors for their financial support; the local organizing committee as well as the ISCS and IPRM steering committees for practical support and guidance. Thanks to Ann Stals (University of Michigan) for all her help in the event management. Finally, our special appreciation goes to Drs. Stefan Hildebrandt and Marc Zastrow, and their team at Wiley for bringing out this special issue. Guest Editors: Grace Xing, Zetian Mi, and Srabanti Chowdhury
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