Difference In Thermal Expansion Coefficients Research Articles

Strain accumulation and relaxation on crack formation in epitaxial AlN film on Si (111) substrate

The formation of cracks is often observed in the epitaxial growth of ultrawide-bandgap aluminum nitride (AlN) semiconductor films on economical and versatile silicon (Si) substrates due to the significant differences in in-plane lattice parameters and thermal expansion coefficients between the film and the substrate, which hampers the development of template, buffer layer, and device structure with a relatively thick AlN layer for devices. The present study aims to elucidate the conditions of crack formation through a simple but comprehensive estimation of strain energy accumulation and relaxation by lattice strain, misfit dislocation density, and crack formation. Strain energy in the epitaxial film from lattice and thermal mismatches is evaluated by an elastic strain equation tailored to the epitaxy of the hexagonal crystal structure. The effects of temperature, thickness, and dislocation density on the lattice and dislocation strain energies of the film are also considered. Finally, the comparison in the changes in the total strain energy and cleavage energy with decreasing temperature shows that cleavage energy is higher than strain energy if the film is thinner than 400 nm but becomes lower than the strain energy if the film is thicker than 400 nm during cooldown, suggesting the crack formation, which matches well with experimental observations.

Promoted aging precipitation behavior of TC4/GZ151K magnesium matrix composites

The precipitation behavior of TC4/GZ151K composite (Ti–6Al–4V reinforced Mg-15Gd-1Zn-0.4Zr) after solution and aging heat treatment (T6-treated) has been investigated. Quantitative measurements of precipitates revealed that nano-β′ phase in T6-treated TC4/GZ151K composite was denser and thinner than that in T6-treated GZ151K matrix, generating higher ultimate tensile strength of composite than that of matrix (410 MPa vs. 373 MPa). it was disclosed by geometric phase analysis that there were more geometrically necessary dislocations in solution-treated composite than that in the matrix, which was caused by different coefficient of thermal expansion between TC4 and Mg. High-density dislocations are beneficial to precipitate fine and dense β′ phase in the composite while low-density dislocations result in coarse and loose β′ phase in the matrix after aging process. This work confirmed the accelerating effect of TC4 particles on Mg-matrix's aging precipitation, which was of great significance to regulate the precipitation behavior of Mg alloy and produce high strength-ductile Mg materials.

Large‐Scale Synthesis of Flexible Cermet Interdigital Electrodes with Stable Ceramic‐Metal Contact for Fire‐Resistant Pressure Tactile Sensors

AbstractCermet has broad applications in electronics, but achieving stable ceramic‐metal contact has always been a challenge, particularly at hot temperature and large deformation conditions, due to the significant differences in thermal expansion coefficient and stiffness of ceramics and metals. Here, stress matching and strong interphase bonding at the heterogenous ceramic‐metal contact are realized by using flexible ceramics, leading to stable applications in flexible fire‐resistant pressure tactile sensors. Cu/Au nanolayers are deposited first onto the toughened flexible SiO2 nanofibers with a chemical plating method to form sensitive interdigital electrode sensors, then use an in situ thermal reaction strategy to form conformal and interlocked Au3Cu and CuSiO3 interphases, which enhance the mechanical thermal stability of the ceramic‐metal contact. With deep learning technique, the as‐fabricated intelligent pressure tactile gloves can accurately recognize the human body parts in low‐visible burning environments and show a long‐term stability over 1000 cycles with a high sensitivity of 112.18 kPa−1, which is important for developing intelligent firefighting.

Effect of composition and architecture on the thermodynamic behavior of AuCu nanoparticles.

The chemical and physical properties of nanomaterials ultimately rely on their crystal structures, chemical compositions and distributions. In this paper, a series of AuCu bimetallic nanoparticles with well-defined architectures and variable compositions has been addressed to explore their thermal stability and thermally driven behavior by molecular dynamics simulations. By combination of energy and Lindemann criteria, the solid-liquid transition and its critical temperature were accurately identified. Meanwhile, atomic diffusion, bond order, and particle morphology were examined to shed light on thermodynamic evolution of the particles. Our results reveal that composition-dependent melting point of AuCu nanoparticles significantly departs from the Vegard's law prediction. Especially, chemically disordered (ordered) alloy nanoparticles exhibited markedly low (high) melting points in comparison with their unary counterparts, which should be attributed to enhancing (decreasing) atomic diffusivity in alloys. Furthermore, core-shell structures and heterostructures demonstrated a mode transition between the ordinary melting and the two-stage melting with varying Au content. AuCu alloyed nanoparticles presented the evolution tendency of chemical ordering from disorder to order before melting and then to disorder during melting. Additionally, as the temperature increases, the shape transformation was observed in AuCu nanoparticles with heterostructure or L10 structure owing to the difference in thermal expansion coefficients of elements and/or of crystalline orientations. Our findings advance the fundamental understanding on thermodynamic behavior and stability of metallic nanoparticles, offering theoretical insights for design and application of nanosized particles with tunable properties.

THERMAL SHOCK BEHAVIOR OF LANTHANUM ZIRCONATE-BASED THERMAL BARRIER COATINGS

In this study, La2Zr2O7, Yb2O3 and Gd2O3-doped La[Formula: see text](Gd, Yb)[Formula: see text]Zr2O7 thermal barrier coatings have been manufactured from the crystalline and amorphous feedstock by plasma spraying. The thickness of the bond coat is 100±25 [Formula: see text]m and the thickness of the top coat is 250±25 [Formula: see text]m. Thermal shock tests were carried out in furnace temperature of 1200∘C. The thermal shock tests indicate that lifetime of the La[Formula: see text]Gd[Formula: see text]Zr2O7 coating has 55 cycles which is the highest thermal shock lifetime compared to other coatings in this study. The type of feedstock, amorphous or crystalline, strongly affects the thermal shock lifetime of La2Zr2O7 coatings. Coating damage after thermal shock tests was investigated using scanning electron microscope to observe the microstructure and X-ray diffraction techniques to analyze the phase composition. The failure of coatings is mainly in consequence of the accumulation of stress between bond coat–ceramic coat interface due to thermal expansion coefficient differences and thermally grown oxide layer formation during thermal shock cycling tests.

Induced formation of nano precipitates and improve microstructure and mechanical properties by ultrasonic wave in the solid-liquid two-phase area of as-cast Ti48Al2Cr2Nb 2.5 C alloy

To refine the microstructure and form Ti3Al2 and C14 nano particles, and then improve strength and strain simultaneously, the Ti48Al2Cr2Nb 2.5 C alloy has been prepared under ultrasonic wave. Size of lamellar colony, lamellar spacing, phase composition, compressive properties and the related mechanisms have been studied. Results show that size of lamellar colony decreases from 40.7 to 33.0 µm and lamellar spacing decreases from 1.5 to 0.8 µm. Average length-diameter ratio of Ti2AlC decreases from 5.4 to 1.9 with increasing the ultrasonic treatment time from 20 to 100 s. Two kinds of nanoparticles form. One is hexagonal Ti3Al2 phase, which has incoherent relationship with γ phase. Another is Ti(Al, Cr)2 phase with C14 structure. The Ti2AlC and α grain are refined by undercooling nucleation and dendrite fragmentation in solid-liquid two-phase area. The active dislocations and vacancy under ultrasonic promote the diffusion of Ti and Cr, and then induce the Ti3Al2 and Ti(Al, Cr)2 formed during solid-phase transformation. Compressive results show that the strength increases from 1901 to 2532 MPa, and the strain simultaneously increases from 27 to 34% with increasing the time from 0 to 100 s. The lattice distortion caused by the difference in thermal expansion coefficient between the Ti3Al2, Ti(Al, Cr)2 and matrix and the microstructure refined by ultrasonic jointly hinder dislocation slip to strengthen the alloy. The refinement and uniform distribution of Ti2AlC hinder crack propagation to improve toughness.

A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis

Au-Au thermosonic flip chip joints are regarded as a promising chip-substrate interconnect structures and their reliability has been a concern. Compressing the top of Au stud bumps during the coining process would result in plastic deformation of Au; During the bonding process, plastic deformation took place at the interface of Au stud bump and substrate under the impact of ultrasonic vibration, elevated temperature, and bonding pressure; additionally, due to different Coefficient of Thermal Expansion (CTE) between various components of the joint, the mismatch of CTE caused by the thermal cycling process would also result in plastic deformation. For Au element with extraordinary ductility, plastic deformation would inevitably lead to various material defects. This research first performed thermal cycling tests on Au-Au thermosonic flip chip joints, and found that a crack developed after 500 cycles and it propagated along the interface to the entire width of the joint, which seriously injured the joint. Here, for the first time, this research characterized all types of material defects (dislocations, stacking fault, twin, and amorphization) at the bonding interface of the Au-Au flip chip joint which underwent 500 thermal cycles. Their causes and effects on cracking were investigated individually, finally a novel failure mechanism was proposed from the perspective of material defects and a technique to prevent cracking was proposed. This research is anticipated to provide an in-depth study of the microstructure at the bonding interface of Au-Au flip chip joints and the impact of various defects on their reliability.

Crack-free tungsten coating on ODS plate via a modified laser-based additive technique: Offset laser cladding

A modified laser-based additive manufacturing technique, offset laser cladding was introduced to achieve dense tungsten coating on an oxide dispersion-strengthened (ODS) substrate as a plasma facing material (PFM). Different from ordinary direct energy deposition (DED) which leads to incomplete melting of tungsten and excessive melting of ODS substrate, the offset laser cladding technique can achieve complete melting of tungsten while substrate melting is suppressed. Experimental conditions (i.e., laser power, scanning speed, powder size, offset distance and injection powder nozzle setting) were carefully calculated using two validated simulation models to minimize the consumption of valuable experimental resources. Tungsten coating using the offset laser cladding in an open chamber condition showed that dense coating was achieved with a pore size of 1–2 μm. The result is comparable to that of vacuum plasma spray (VPS) tungsten coating which requires a high-level vacuum chamber. A thin interface layer (2–5 μm) was formed between the tungsten coating and ODS substrate that can alleviate thermal damage due to a large thermal expansion coefficient difference. While a small amount of surface melting was involved, the microhardness test revealed that the ODS substrate was insignificantly affected by laser heating during the offset laser cladding.

Thermally matched chalcogenide glasses with high refractive index contrast for infrared graded‐index lenses

AbstractInfrared graded‐index (GRIN) lenses are desirable for realizing miniaturization and lightweight of infrared imaging systems. Chalcogenide glasses have excellent infrared transparency, good rheological property, and large refractive index range, making them preferred materials for infrared GRIN lenses. In this work, aiming to find thermally matched chalcogenide compositions with high refractive index contrast for preparing GRIN glasses by the stacking diffusion approach, we investigated characteristic temperature, thermal expansion coefficient and refractive index of Ge‐As‐Se and Ge‐As‐Se‐Te glasses, optimized the glass compositions, and evaluated the feasibility of preparing GRIN glass using the optimized chalcogenide glass powders. It is found that Ge20As20Se20Te40 and Ge12As22Se66 glasses have similar softening temperature (247°C vs. 249°C), reasonably difference of thermal expansion coefficient (3.8 ppm/K), and large refractive index contrast (∼.48). The glass powders with composition xGe20As20Se20Te40‐(1‐x) Ge12As22Se66 can be hot‐pressed into glass disks with good transmittance at the same temperature and pressure. Graded refractive index profile is formed near the interface between the layers after the co‐pressed glass is thermally treated. These results demonstrate the prospect of the compositions for preparing infrared GRIN glasses.

WC-18Co reinforced Iron matrix composites: Microstructure and interface characteristics

Particle reinforced iron matrix composites have gained considerable attention as advanced structural materials. In this study, large-sized WC-18Co reinforced iron matrix composites were prepared using the casting infiltration method. We investigated the microstructure and interface characteristics of WC-18Co/FMC, analyzed the stress state at the interface, and tested the mechanical and tribological properties of the composite material. The research findings reveal that WC-18Co/FMC is a multiphase system composed of WC, M3W3C (M = Fe, Co), and precipitates. The strong interface reaction results in the formation of a thick transition layer between WC-18Co and the matrix. Grain refinement occurs around the reinforcing particles. During solidification, the difference in thermal expansion coefficients between WC-18Co and FMC induces thermal stress, leading to compressive residual stress on both sides of the interface. The compressive stress state inhibits crack initiation and propagation, enhancing the bonding strength. Alternating stresses at the interface enhance dislocation motion, grain slip, and twinning phenomena in the transition layer. Nanoscale compounds embedded in the transition layer impede dislocation slip, resulting in dislocation entanglement and pile-up. WC-18Co/FMC exhibits a 60.66% increase in hardness compared to FMC. Under impact energies of 1 J, 3 J, and 5 J, the wear resistance improves by factors of 2.985, 2.358, and 2.072, respectively. The significant improvement in the composite material's performance is attributed to strengthening mechanisms such as the multiphase system, grain refinement, nanoscale precipitates, and residual stress strengthening.

Investigation of the influence of process parameters on crack formation and mechanisms in Ti-48Al-2Cr-2Nb alloy via laser directed energy deposition

The Ti-48Al-2Cr-2Nb alloy was fabricated using laser directed energy deposition(LDED), and the impact of various process parameters on the macroscopic crack morphology was analyzed. The mechanism of crack formation was investigated through the analysis of crack microstructure, phase composition, crystal orientation, and elemental composition. The process parameters were optimized by response surface methodology(RSM) and the laser remelting method was used to suppress the crack formation. The results showed that the cracks were mainly caused by lack of fusion, residual stress during LDED and stress between different phases of TiAl alloy. The mismatch of process parameters results in insufficient energy for powder melting, ultimately leading to lack of fusion occurrence. To minimize crack formation, the response surface method was employed to optimize process parameters and reduce crack generation. The higher temperature gradient led to the existence of residual stress in the sample, and the higher stress between α 2 phase and B2 phase formed in the deposition process due to the difference of thermal expansion coefficients. The region where the two phases converge was the region with the highest crack sensitivity, and cracks occured in the region where α 2 phase and B2 phase converge in the form of excellent transgranular fracture. The samples prepared by using the optimized parameters can effectively restrain the cracks caused by lack of fusion, but can not restrain the cracks caused by the stress between phases. Laser remelting after LDED can not only reduce the temperature gradient and residual stress, but also remelt the unmelted powder on the surface of the as-deposited samples, effectively inhibiting the generation of cracks, and preparing crack-free samples.

Releasing the residual stress of Al2O3/304 stainless steel joint by introducing BN into Ag‐Cu‐Ti filler metal

AbstractOwing to the native character of the coefficient of thermal expansion (CTE) mismatch between Al2O3 and 304 stainless steel, obtaining high strength for Al2O3/304 stainless steel joints remains challenging. In this study, the residual stress of an Al2O3/304 stainless steel brazed joint was relieved using the Ag‐Cu‐Ti + boron nitride (BN) composite filler. The results indicated that the elements between the filler and base metals on both sides were mutually diffused. Moreover, reaction layers formed at the interface, connecting the Al2O3 ceramic and 304 stainless steel. The microstructure of the joint was as follows: Al2O3/Cu3Ti3O + TiCu/Ag (s, s) + Cu (s, s) + TiN + TiB2 + TiCu/Cu0.8Fe0.2Ti/TiFe2/Fe‐Cr/304 stainless steel. When the .1 wt% BN was added, the average strength of the joint reached 151 ± 10 MPa, 15% higher than the average strength of the joint only using Ag‐Cu‐Ti filler (131 ± 9 MPa). The improvement in the shear strength and reduction in the residual stress was attributed to the formation of TiN and TiB2, reducing the CTE difference and refining the microstructure.

Thermomechanic behavior of epitaxial GeTe ferroelectric films

A key development toward new electronic devices integrating memory and processing capabilities could be based on the electric control of the spin texture of charge carriers in semiconductors. In that respect, GeTe has been recently recognized as a promising ferroelectric Rashba semiconductor, with giant spin splitting of the band structure, due to the inversion symmetry breaking arising from ferroelectric polarization. Here, we address the temperature dependence of the ferroelectric structure of GeTe thin films grown on Si(111). We demonstrate the hysteretic behavior of the ferroelectric domain density upon heating/cooling cycles by low energy electron microscopy. This behavior is associated with an abnormal evolution of the GeTe lattice parameter as shown by x-ray diffraction. We explain these thermomechanical phenomena by a large difference of thermal expansion coefficients between the film and the substrate and to the pinning of the GeTe/Si interface. The accumulated elastic energy by the GeTe thin film during sample cooling is released by the formation of a-nanodomains with in-plane ferroelectric polarization components.

Experiment and numerical simulation study of thermal fatigue of an aluminum alloy piston

AbstractIn this study, a magneto‐thermo‐structural coupling finite element method was proposed to calculate the electromagnetic field, temperature field, stress field, and strain field of an aluminum alloy piston during thermal shock process. The computed temperature results at the measurement points of T3 and T4 agree well with the measured data. The concept of tensile strain energy density was proposed as a thermal fatigue damage parameter, and the thermal fatigue life of the piston was predicted on the basis of the calculated results by magneto‐thermo‐structural coupling analysis and tensile strain energy density‐life equation; the discrepancy between the predicted life and the experimental one is 16%. The thermal fatigue failure mechanism of the piston was also clarified. High cyclic stresses occur on the edge of Si due to the difference in thermal expansion coefficient of Al and Si; micro cracks first originate on the edge of Si, then grow through combining other micro cracks, and eventually form macro cracks.

Design of surface with integrated properties of sterilization and desorption

As might be one of the hottest topics in public health research, the war against bacteria has been going on some thousands of years. Unfortunately, we too are threatened by bacterial adhesion and contamination as the ancients even though the health and well-being of populations has been dramatically improved owing to the advances in human medicine and environmental sanitation. In this study, we designed a double-layer coating that consisted of polymethyl methacrylate (PMMA) and carbon nanotube (CNT)-loaded polydimethylsiloxane (PDMS) and introduced antibacterial molecule chains (AMCs), which can repeatedly release and replenish reactive oxygen species (ROS), on the coating surface. Benefiting from the characteristics of releasing ROS after the AMCs were irradiated by NIR and wrinkle structure originated from the difference in thermal expansion coefficients between PMMA and PDMS, as revealed by Uv-visible absorption spectrum and morphological characterization, the performance of sterilization and desorption would be integrated into the coating surface by irradiating the coating surface with near-infrared (NIR) repeatedly. The results of antimicrobial experiments confirmed that all of the bacteria on the coating surface were terminated and deported after the coating was irradiated six times by NIR. Additionally, after bacteria were killed and desorbed, the coating would return to its original form and AMC could be re-endowed with the ability to release ROS through treatment, showing potential of being applied in the modification of biomaterials.

Expansivity of Fused Quartz Glass Measured with 6 x 10-10/K

Thermal expansion sometimes dominates uncertainty in a precision measurement. A cell-based refractometer has been designed at NIST which targets 10−6 relative uncertainty in the measurement of helium refractivity; in terms of absolute refractive index at ambient conditions, the accuracy goal is 3 × 10−11. To achieve this level of accuracy, the length of a 0.5 m gas cell would need to be known within 100 nm. This is achievable when cell length is measured by coordinate-measuring machine at 20 °C. However, the refractometer will operate at the thermodynamically known fixed-points of water and gallium, near 0 °C and 30 °C, respectively. The cell is made from fused quartz glass, which has a nominal thermal expansion coefficient of 0.4 (μm/m)/K. Therefore, to scale the accuracy of the dimensional metrology across 20 °C to the triple-point of water requires that the thermal expansion coefficient of fused quartz glass is known within 10 (nm/m)/K, or 2.5 %. A method is described to measure the thermal expansion coefficient of fused quartz glass. The measurement principle is to monitor the change in resonance frequency of a Fabry–Perot cavity as its temperature changes; the Fabry–Perot cavity is made from fused quartz glass. The standard uncertainty in the measurement was less than 0.6 (nm/m)/K, or 0.15 %. The limit on performance is arguably uncertainty in the reflection phase-shift temperature dependence, because neither thermooptic nor thermal expansion coefficients of thinfilm coatings are reliably known. However, several other uncertainty contributors are at the same level of magnitude, and so any improvement in performance would entail significant effort. Furthermore, measurements of three different samples revealed that material inhomogeneity leads to differences in the effective thermal expansion coefficient of fused quartz; inhomogeneity in thermal expansion among samples is 24 times larger than the measurement uncertainty in a single sample.

Thermal strain relaxation of GaAs overgrown on nanovoid based Ge/Si substrate

The integration of high quality III-V materials-based devices on the Si platform is considered as an enabling path towards achieving the long-standing goal of creating low-cost/high-performance devices. However, the heteroepitaxy of III-V compounds on a Si substrate generates high stress due to the difference in thermal expansion coefficient leading notably to crack generation. Here, we report on the reduction of the thermal strain of GaAs and Ge deposited on a Si substrate. The method is based on the formation of buried high density nanovoids by electrochemical etching of Ge/Si virtual substrate followed by direct epitaxial growth of Ge and GaAs. The thermal strain has been investigated for GaAs epilayer by High-Resolution X-Ray Diffraction and Raman spectroscopy showing a 30% decrease in strain. The strain reduction relies on the nanovoids-mediated thermal strain accommodation. Furthermore, photoluminescence measurements showed a 10-fold increase of the intensity, resulting in an improved optical and crystalline quality, making this virtual substrate promising for III-V based devices on Silicon.

Design and analysis of an optical planar waveguide using Invar as core and silicon nitride as cladding layer to control birefringence

Abstract The main problem with optical planar waveguide is thermal stress which arises when layers inside the planar waveguide get fused together with different coefficient of thermal expansion (CTE) and due to variation in thermal properties, the problem of thermally induced strain and birefringence occurs inside the waveguide glass layer. In proposed work, the mathematical analysis of thermal induced stress and the thermal strain in waveguide glass layer is calculated. ‘C’ software is used for analysis of an optical planar waveguide to calculate the thermal stress. By using material properties of Invar (64 % iron-36 % nickel alloy) and silicon nitride (Si3N4) an optical planar waveguide is designed. Here when silicon nitride (Si3N4) is used as a cladding layer and Invar (64 % iron-36 % nickel alloy) as a core layer in an optical planar waveguide, the problem of birefringence get eradicated as zero thermal stress was achieved.

In-Situ Observation and Analysis of the Evolution of Copper Aluminum Composite Interface

To study the micromorphology and dynamic evolution law of copper aluminum composite interface evolution, ultra-high temperature laser Confocal microscopy (CLSM) was used to observe and analyze the evolution of copper aluminum interface in situ, and then SEM, EDS and other advanced material analysis methods were used to observe the micromorphology of the composite layer, and study the composition of the interface layer and the formation process of the copper aluminum composite interface. The results indicate that the formation of the copper aluminum composite interface layer is mainly related to the mutual diffusion of copper aluminum atoms and the interface reaction between copper and aluminum. The bonding of the copper aluminum composite interface is mainly related to the melting of the metal surface of the interface layer and the mutual diffusion of copper aluminum atoms, which is the main mechanism of the copper aluminum composite interface bonding. The intermetallic compound is mainly Al2Cu. In situ, observation of copper aluminum composite interface shows that there is a clear and relatively flat boundary between copper and the interface layer, while the boundary between aluminum and the interface layer is not straight, which is caused by the difference in thermal expansion coefficient, Lattice constant and hardness between intermetallic compounds and matrix and between intermetallic compounds. At the same time, it was found that there is a certain relationship between the visual changes of the copper aluminum composite interface image and reaction-diffusion migration during in-situ observation using a confocal laser scanning high-temperature microscope. Moreover, under no pressure, the oxide layer and interface inclusions can seriously affect the interface bonding.

Finite element analysis and experimental verification of residual stress in brazed diamond with Ni-Cr filler alloy

Residual stress is the main factor affecting the processing performance and service life of brazed diamond tools. Due to the high melting point of Ni-Cr filler alloy, the difference in thermal expansion coefficient between diamond and brazing layer is large during high brazing temperature, and excessive residual stress tends to be generated at the brazed joint. The existing process parameters are difficult to meet the demand for the lower residual stress under high brazing temperature. Suppressing effectively excessive residual stress has become the focus of current researches for process optimization of brazed diamond. In this paper, the conventional spherical finite element model of diamond is replaced by a six-octahedral finite element model of diamond, and a 3D finite element model of brazed diamond is established. The effects of brazing temperature, brazing layer thickness and holding time on the residual stresses in brazed diamond are analyzed. The results show that higher brazing temperatures result in larger differences in thermal expansion coefficients between the diamond and brazing layer, resulting in larger residual stress. The higher brazing layer thickness will enlarge the stress affected area inside diamond and thus generate higher stress. The residual stress decreases with rising holding time, however, the subsequent thermal damage to the diamond increases. Experimental measured tendency of residual stress for brazed diamond through Raman spectroscopy is well consistent with that of calculated results. After observing of the surface morphology for brazed diamond through super-depth of field microscope, the brazed diamond presents the low residual stress, weak graphitization and excellent processing performance at the condition of brazing temperature of 1010 °C, brazing layer thickness of 0.3 mm and holding time of 5 min.