In recent years, considerable progress has been made on the study of the machinability of fragile materials as crystalline semiconductors because of the demand for faster fabrication processes of complex surface shapes for optoelectronic applications. The most-studied machined semiconductors are silicon and germanium [1– 3]. Some studies indicate that ductility could be related to the high-pressure metallization (brittle-to-ductile) transformation that occurs when these materials are subjected to high hydrostatic pressures [4–7]. Because of this, most of the studies reported previously are devoted mainly to microindented or microcut Si and Ge. Among the experimental techniques used to probe their effects, Raman scattering has been successfully employed, mainly to exploit the presence of residual stresses around the indentations and grooves made by indenters [8]. It is well known that, due to the machining (or to the polishing or lapping) process, semiconductor surfaces can undergo structural damage [9]. Raman scattering is a powerful characterization technique in these cases because the vibrational spectrum of the material is greatly influenced by disorder and residual strains: These lead to changes in phonon frequencies, broadening of Raman peaks and breakdown of Raman selection rules [10]. For bulk crystalline Si (c-Si), the triple degenerate optical phonons display in the first-order Raman spectrum one sharp peak at 521 cm−1. Due to the positive phonon deformation potentials of Si, compressive (tensile) strains lead to positive (or negative) frequency shifts. On the other hand, due to the loss of phonon correlation length and the consequent breakdown of the q = 0 Raman selection rules (q is the phonon wave vector), disorder effects can lead to an asymmetric broadening and shifting of Raman peaks compatible to the dispersion relation of the material [11]. In the silicon case, the frequency and asymmetry point to lower values because the dispersion relationship presents decreasing optical frequencies, increasing phonon wave vectors. At maximum disorder (amorphous material, aSi), the first-order Raman spectrum reflects the phonon density of states: It presents two broad bands centered at about 100 cm−1 (acoustic band) and 470 cm−1 (optical band) [12]. In this letter, an original (macro-) Raman investigation of single-point-diamond-turned silicon samples machined in ductile and brittle modes is presented. To probe the depth profile of disorder effects, the 457.9, 488.0 and 514.5 nm lines of an argon ion laser were used as exciting light. For these lines, the penetration depth of the light is about 140, 270 and 340 nm for c-Si, respectively. For a-Si, the optical absorption coefficient can reach one order of magnitude higher, leading to penetration depths of about tenths of nanometers, depending on the degree of amorphization [13, 14]. All measurements were performed at room temperature, with special care taken taken to avoid overheating the samples. Cutting tests were performed on Si samples on the (1 0 0) surface. The samples were single-pointdiamond-turned using a facing operation on a RankPneumo ASG 2500 diamond-turning machine. Alkalisol 900 coolant cutting fluid was continuously sprayed onto the workpiece during machining to avoid overheating the sample. A 0 (−25) degree rake angle diamond tool with nose radius R= 1.52 mm and a clearance angle of 12◦ was used in all tests. The feed rate used was 12.5 (1.25) μm rev−1 and the nominal depth of cut was 10 (1)μm. These conditions provide brittle (ductile) mode during machining, with an opaque (mirrorlike) surface. The finished surfaces were observed using scanning electron microscopy (SEM). Fig. 1 shows a