PurposeThe purpose of this paper is to review possibilities of implementing ceramic additive manufacturing (AM) into electronic device production, which can enable great new possibilities.Design/methodology/approachA short introduction into additive techniques is included, as well as primary characterization of structuring capabilities, dielectric performance and applicability in the electronic manufacturing process.FindingsCeramic stereolithography (SLA) is suitable for microchannel manufacturing, even using a relatively inexpensive system. This method is suitable for implementation into the electronic manufacturing process; however, a search for better materials is desired, especially for improved dielectric parameters, lowered sintering temperature and decreased porosity.Practical implicationsRelatively inexpensive ceramic SLA, which is now available, could make ceramic electronics, currently restricted to specific applications, more available.Originality/valueCeramic AM is in the beginning phase of implementation in electronic technology, and only a few reports are currently available, the most significant of which is mentioned in this paper.