Abstract
Ceramic multilayer technologies such as LTCC (low temperature cofired ceramics) or HTCC (high temperature cofired ceramics) are applied for the fabrication of highly integrated ceramic microelectronic packages. Furthermore, ceramic multilayer technologies offer the possibility of additionally integrating 3D structures for multilayer-based microsystems. This paper presents a new machine for tape/multilayer structuring that combines micro punching tools and micro UV-laser ablation/cutting. The application for the production of different multilayer-based components is described (e.g., LTCC-based PEM fuel cell system, LTCC-based pressure sensors). Aerosol jet printing is a new technology, for example, for rapid prototyping for LTCC multilayer and 3D deposition of functional layers on LTCC. Advantages and limitations of the technology are discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Microelectronics and Electronic Packaging
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
