Equipment has been developed for testing the strength of adhesive bonds between ceramics and metals and of the ceramics themselves, under the dynamic conditions which prevail in transducers. A longitudinal half-wave resonator with the ceramic sample located at its center is used to develop the dynamic stress in the adhesive and ceramic. The stress level is raised until destruction occurs. A number of methods for measuring the stress were evaluated, including capacitive probes, strain gauges, piezoelectric gauges, motional impedance methods, and an optical interferometer. The bonding of piezoceramic disks was investigated with a solid rod resonator, and piezoceramic rings were similarly investigated in a metal tube resonator. Several epoxy cements and a cyanoacrylate monomer were included in the adhesive tests. The epoxy bonds were often stronger than the ceramic, and the ceramic commonly failed in the stress range 2000 to 4000 psi. Other variables investigated included the adherence of silver electrodes, cleaning procedures, and the effect of cement thickness and ceramic thickness.