1. IntroductionGe has been received much interest as a CMOS channel material and a near-infrared optical material due to its superior characteristics [1,2]. For application use, Ge-on-Insulator (GOI) structure is necessary to suppress large leakage current originated from the narrow bandgap. A method combined wafer bonding and layer splitting by hydrogen ion (H+) implantation, known as Smart-CutTM and realized for Si-on-Insulator fabrication, has been tried to apply for GOI with large diameter, uniform thickness, and single crystal [3-5]. In this study, we fabricated GOI by Smart-CutTM technique and demonstrated electronic and optoelectronic devices on the GOI. Besides, we combined the epitaxial growth method to improve the quality of GOI.2. Experimental, Results, and DiscussionsGOI fabrication procedure by conventional Smar-CutTM method is shown in Fig. 1 [5]. H+ implantation with the dose of 4×1016 cm-2 and energy of 120 keV into Ge was performed through 100 nm-thick SiO2. After SiO2 removal, 3 nm-Al2O3 and 50 nm-SiO2 were formed on the Ge and Si substrates, respectively. Then, the Al2O3/Ge and the SiO2/Si were manually bonded. After annealing in N2 ambient at 300 °C to enhance bonding strength [6], layer splitting was carried out by annealing at 400 °C. GOI thinning by wet etching and surface flatten by chemical mechanical polishing (CMP) were performed. We fabricated both p- and n-MOSFETs with metal source/drain (S/D) on the GOI. The p-MOSFET is an accumulation mode device with ohmic PtGe/Ge S/D. On the other hand, n-MOSFET is an inversion mode device with rectifying TiN/Ge S/D. Both devices work successfully as shown in Fig. 2. We also demonstrate asymmetric metal/Ge/metal photodiode on the GOI. PtGe and TiN are also used as electrodes for hole and electron injection, respectively. Figure 3 shows electroluminescence (EL) spectra for the photodiodes fabricated on the GOI and the bulk Ge. The GOI device shows higher EL intensity than that of bulk Ge. It is considered carrier confinement effect by thin Ge crystal.However, the MOSFETs show a large leakage current at the high drain voltage region. Also, the photodiode on GOI has a broader spectra peak. Figure 4 is the cross-sectional TEM image of the GOI before GOI thinning. There are many defects as black dots near both the split surface and the buried oxide (BOX) interface. The defects near the BOX are serious because this region will be kept after GOI thinning, and cause the degradation of device characteristics (leakage current and broad PL peak). They may be introduced by H+ implantation.To avoid the introduction of the defect during GOI fabrication, we propose an alternative method which is epitaxial growth of a new Ge layer on H+ implanted surface, as shown in Fig. 5. In this method, all defective layer was removed after layer splitting and only epi-Ge layer remains on the handle Si. Figure 5 also shows electron concentrations and mobilities of the GOIs evaluated by Hall effect. The conduction type of the GOI by conventional Smart-CutTM changes from n-type to p-type due to defect introduction. On the other hand, the proposed method successfully keeps the original conduction type (n-type). Although electrical characteristics should be improved more, it is clarified that defect elimination before bonding is important for GOI fabrication by Smart-CutTM.3. ConclusionWe fabricated GOI by Smart-CutTM and demonstrated MOSFETs and photodiode on the GOI. Although both devices successfully work, TEM analysis clarified there are lots of defects near the GOI/BOX interface. Alternative way combined epitaxial growth to eliminate the defects succeeded to improve the electrical characteristics of the GOI.AcknowledgmentThis work is supported by JSPS KAKENHI (No. 19K15028 and 19H05616) and the Research Institute of Electrical Communication, Tohoku University.