Bonding Layer Thickness Research Articles

Shear and bonding performances between Fe-SMA and steel for strengthening of steel structures

Iron-based shape memory alloy (Fe-SMA) has been employed in China and the Czech Republic to reinforce steel bridges due to its outstanding self-prestressing characteristics. Nevertheless, the lack of theoretical guidelines necessitates this study to align with the practical Fe-SMA-reinforced applications in civil engineering. This study experimentally investigates the shear performance and load-transfer mechanism of 45 Fe-SMA/steel adhesive joints. Specifically, the shear characteristics of the adhesive joints affected by the various parameters of bonding layer thickness, steel plate thickness, bonding length and adhesive type are explored, the failure mode and load-displacement relationship are assessed, and some suggestions for optimization design are proposed. The experimental results demonstrate that the Fe-SMA/steel adhesive joints experiencing interface failure exhibit a linear load-displacement relationship. Contrarily, the load-displacement relationship of the adhesive joints under cohesive failure modes contains a yield segment. Longer bonding length results in more considerable failure evolution distances for Sika S02 and LPdur 03 specimens with cohesive failure, indicating better ductility of these specimens. Additionally, the epoxy adhesives of Sika S02 and LPdur 03 are preferred while employing Fe-SMA plates for bonding reinforcement of steel structures, which can maximize the characteristics of Fe-SMA to obtain stable and superior reinforcement performance. The experimental achievements have remarkable potentials for improving the in-service performance of old and damaged steel structures and other infrastructures.

Mechanical Characteristics of Cracked Lining Reinforced with Steel Plate–UHPC Subjected to Vertical Load

The steel plate reinforcement method is widely used for strengthening damaged linings. Nevertheless, low durability is one of the disadvantages of the steel plate reinforcement method, which uses epoxy resin as the interface binder. To enhance the load-bearing performance and strengthening effect of steel-plate-reinforced structures, this study introduced ultra-high performance concrete (UHPC) as the reinforcing bonding layer and proposed a novel method for steel plate–UHPC reinforcement of cracked linings. A mechanical performance model test was conducted on a 1/5 scale lining model using a loading test device to evaluate the load-bearing performance and stress deformation of both conventional steel plate and steel plate–UHPC reinforced cracked linings. The characteristics, mechanisms of failure, and impacts of strengthening of the steel plate reinforcement method and steel plate–UHPC reinforcement method for cracked linings were compared. A numerical simulation model was developed to investigate the reinforcement effect of cracked linings using steel plate–UHPC reinforcement. The analysis included examining the influence of steel plate thickness, UHPC bonding layer thickness, and reinforcement timing. Model test results show that the overall damage mode of the steel plate–UHPC-reinforced structure had good elastic–plastic behaviour, and the deformation and damage process under the vertical concentrated load can be divided into four typical phases. Compared with the traditional steel plate reinforcement, the ultimate load-carrying capacity and ductility of the steel plate–UHPC-reinforced structure were increased by 53% and 366%, respectively, showing significantly better load-carrying capacity and deformation performance. Numerical simulation results show that the reinforced structure’s load-carrying capacity and stiffness enhancement rate increased non-linearly with the increase in UHPC layer thickness and steel plate thickness. However, reasonable reinforcement timing exists for steel plate-UHPC reinforcement, and too late reinforcement timing leads to a decrease in structural load-carrying capacity and stiffness enhancement rate.

Improved pressure sensitivity prediction of a rubber-based diaphragm FBG pressure sensor using theoretical model and finite element analysis

Rubber-based diaphragm fibre Bragg grating (FBG) pressure sensor has been widely reported for low pressure sensing with high pressure sensitivity. However, the types of adhesives use and bonding layer thickness always result in large discrepancy between predicted and experimental pressure sensitivity. To investigate this, the pressure sensitivity of the FBG pressure sensor was first calculated using theoretical modelling. The theoretical pressure sensitivity was calculated at 0.5273 nm/kPa. The theoretical modelling was then improved using finite element analysis (FEA). Adhesive strain transfer coefficient was introduced into the theoretical modelling. Experimental pressure sensitivities were obtained to verify the theoretical pressure sensitivity with and without improved method. Experimental pressure sensitivities were obtained to verify the theoretical pressure sensitivity, both with and without the implementation of an improved method. The results revealed a significant discrepancy of more than 78% when comparing the experimental pressure sensitivities with the initially calculated theoretical pressure sensitivity. The introduction of an adhesive strain transfer coefficient has improved the theoretical pressure sensitivity reducing the discrepancy to within 10%. In addition, the results demonstrated that cyanoacrylate adhesive with minimal possible thickness is the best option for achieving the highest achievable pressure sensitivity.

Analysis of Interlayer Crack Propagation and Strength Prediction of Steel Bridge Deck Asphalt Pavement Based on Extended Finite Element Method and Cohesive Zone Model (XFEM–CZM) Coupling

The extended finite element method (XFEM) was employed for the computational modeling of internal defects within a bond layer. Furthermore, a cohesive zone model (CZM) was implemented to characterize the behavior of the bond layer in response to interactions at both the bond layer/steel plate and bond layer/asphalt paving layer interfaces. The coupling of XFEM and CZM was used for a comprehensive analysis of crack propagation within the bond layer as well as the assessment of phenomena associated with interfacial debonding and delamination. The feasibility and accuracy of the XFEM–CZM coupling method were verified by comparing it with the virtual crack closure technique (VCCT), CZM, XFEM–VCCT, and experiments. A double cantilever beam experimental model was established to simulate the process of interlayer-type cracks expanding from the inside of the bond layer to the interface between the bond layer and the upper and lower layers, causing debonding. This was undertaken to analyze the damage failure mechanism of interlayer-type cracks in asphalt paving layers of steel bridge decks; to discuss the impacts of the initial crack length, the interface stiffness, the interface strength, and the thickness of the bond layer on the performance of the overall interlayer bond strength; and to carry out the significance analysis. The results showed that the initial crack length, interface stiffness, and bond layer thickness had different effects on the expansion path of interlayer cracks. The interlayer strength decreased with an increase in the initial crack length and interface stiffness, increased with an increase in the interface strength, and decreased with an increase in the thickness of the bond layer. The interface stiffness had the most significant effect on the strength.

Study on layer formation behavior of Ag joints sintered with pressureless sintering process

This study focuses on investigating the relationship between sintering performance and bond layer thickness for the hybrid Ag paste consisting of micrometer-sized Ag particles and sub-micrometer Ag spherical particles. The surface morphology showed that the sub-micrometer Ag particles would contribute to improving the densification and bonding strength of the sintered Ag joint. The x-ray results indicated that the bonding quality was achieved when the bonding layer thickness was 50 μm, whereas a thinner or thicker bonding layer would lead to cracks or voids. Moreover, the microstructure of sintered Ag joints with different bonding layer thicknesses was found to be in good agreement with the results of x-ray by SEM observations. There are many cracks in the sintering structure due to the insufficient Ag paste when the bonding layer thickness is below 50 μm, while more voids appeared in sintered Ag joints when the thickness reached 120 μm, which was caused by the organic solvent volatilization. In addition, the poor densifications lead to low strengths of 7.6 MPa and 23.42 MPa for 15 μm and 30 μm thickness, respectively. The shear test results revealed that the highest shear strength was achieved on the bonding layer with a 50 μm-thick bonding layer. However, the bonding strength would decrease to 24.67 MPa and 18.64 MPa when the bonding layer thickness was 90 μm and 120 μm, respectively. The SEM observations indicated that many dimples were formed on the fracture surface with a thickness of 50 μm, which was the reason for the enhancement of bonding strength in the sintered Ag joint.

Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste

To confirm the possibility of simultaneous bonding between Si chip and multilayer ceramic capacitors (MLCCs), vacuum reflow soldering is performed between a Si chip and each of 2012, 1608, 1005, 0603, and 0402 MLCCs using Type-7 Sn-3.0Ag-0.5Cu (SAC305) and Sn-0.7Cu solder pastes. To enable an unbiased comparison with the vacuum reflow process, the Si chip and MLCCs are bonded via thermo-compression (TC) bonding and hot air reflow soldering, respectively. The maximum void content of Si chip solder joints bonded via vacuum reflow is 8%. At the MLCC solder joints, the void content yielded by vacuum reflow is lower than that yielded by hot air reflow. The bonding strength of the MLCC solder joint afforded by vacuum reflow is higher than that afforded by hot air reflow. Vacuum reflow is superior to hot air reflow in terms of the void content and bonding strength of the MLCC solder joint. After performing a thermal cycle test (TCT), a crack appeared at the Si chip solder joint bonded by TC bonding. The Cu pillar/Sn-2.5Ag bump is susceptible to cracks after the TCT owing to the insufficient bonding layer thickness yielded; however, the SAC305 sample from vacuum reflow is stable. Meanwhile, (Cu,Ni)6Sn5, Ni3P, and Ag3Sn intermetallic compounds are formed at the MLCC solder joints and then further developed after the TCT. The results of this study indicate the possibility of co-bonding Si chip with MLCCs for semiconductor packaging.

Finite element modeling and analysis of adhesive layer effects in surface-bonded piezoelectric sensors and actuators including non-uniform thickness

A finite element model for multi-functional structures containing surface-bonded piezoelectric patches is proposed with two main objectives: to reduce the computational cost of detailed and accurate analyses; and to fully account for the adhesive layer between structure and patches, including non-uniform thickness. The proposed model is verified and used to assess the effect of adhesive layer properties on the performance of piezoelectric sensors and actuators, based on frequency responses and effective electromechanical coupling coefficient. Results indicate that increases of bonding layer thickness and thickness non-uniformity are not always detrimental to the actuation/sensing performance and could be explored as design parameters.

Effect of Electromagnetic field on Rayleigh-Taylor instability in a power-law fluid in presence of boundary roughness

In the present study, the linear analysis of electrodynamic Rayleigh-Taylor instability(ERTI) in a thin layer of an incompressible two fluids with a poor conducting fluid confined above by an interface with heavier fluid and below with a rigid boundary subjected to boundary roughness is analyzed. A dispersion that accounts for the growth rate is derived using the approximations defined by Rudraiah et al.,[(1996) and stability is discussed theoretically as well as numerically. The influence of the combined effect of electromagnetic fields, surface tension, power-law fluid, boundary roughness and layer thickness on the ERTI is investigated and shown graphically for above various physical parameters on the stability of the system. It is observed that electric field, magnetic field, power-law fluid, porous parameter and boundary roughness have stabilizing effect on the system whereas Bond number and layer thickness destabilizes the interface.

Electrical and Microstructural Reliability of Pressureless Silver-Sintered Joints on Silicon Carbide Power Modules Under Thermal Cycling and High-Temperature Storage

Low-temperature and pressureless silver (Ag) sintering was applied to a 1200 V/200 A silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module with a Ag-finished silicon nitride active metal-brazed substrate, and the results were evaluated for applicability in electric and hybrid electric vehicles. The sintering was performed at 220–240°C, 90 min in vacuum under nitrogen gas conditions; the bonding strength, bonding layer thickness (BLT), void content, and densification of the as-sintered Ag joints were 39 MPa, 71.4 µm, 2%, and 90.5%, respectively. The shear strength, BLT, densification, and microstructure of the Ag-sintered joints were compared before and after the thermal cycling test (− 50–150°C, 1100 cycles, TCT) and high temperature storage test (200°C, 1000 h, HTST). To simultaneously compare the electrical properties of the SiC power module with lead (Pb)-free solder joints, the same SiC MOSFET power module was manufactured using a Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder. The shear strength and densification after TCT and HTST were 35.5 MPa and 39.7 MPa, as well as 92.8% and 94.8%, respectively. The on-resistance and total switching efficiency of the SiC power module with the Ag-sintered joint were also compared to those of the SAC305 solder joint module, which evinced maximum values of 7.3 mΩ and 10.7 mJ that were superior to those of 8.5 mΩ and 11.3 mJ for the SAC305 solder joint, respectively. Under the same measurement conditions, the maximum generated current and voltage values are lower than those of the solder joint module, so it is envisaged that stable power module operation is realizable for long-term use. The Ag-sintered joint surpassed the SAC305 solder interconnects in terms of the electrical and mechanical reliability of the power module. When a SiC wide band gap device was used, it was discovered that Ag sintering was superior to Pb-free solder interconnects to increase the power conversion efficiency of the power module.

An investigation into the challenges of the point grinding machining process

Point grinding is an abrasive machining process that utilises miniature single layer superabrasive tools to remove material. The use of such small diameter tools offers advantages in the manufacturing of small or difficult to access complex 3D geometries, however, in their current state, these tools suffer from several critical challenges preventing their successful implementation. An investigation into the use of a typical commercially available point grinding tool for machining of hardened steel components has been carried out, with the aim of identifying the critical process challenges. The requirement for high rotational speeds, high tool deflection, variation in grit protrusion heights and bond layer thickness, accelerated tool wear, increased sensitivity to runout, zero cutting speed at tooltip and high tool loading have been identified as the main issues affecting the point grinding process. It is crucial that these challenges are correctly understood to facilitate future tool development.

Laser Debonding of Ultrathin Wafers and Packages: A Technology for the New Generation of Electronic Devices

The continuous shrinkage of the device wafers thickness is driving the current mature debonding technologies to their limits. The challenging form factor demands for memory (≤ 30 µm) or new generations of power devices applications are just two examples for the need of lowering the device thickness.Slide-off as well as mechanical debonding are methods currently in use in high volume production, but these two technologies are not capable to support the new requirements in terms of thermal and mechanical stability, handling, throughput (affecting the cost of ownership - CoO), and process margin. Therefore, device manufactures are looking for a more versatile, universal debonding technology. State of the art UV laser debonding is a very promising candidate which can help bringing the required process margin and flexibility. By combining laser debonding and thermoset materials with a high thermal budget the process window can be significantly enhanced.Most of the thermoset materials of interest which are used to form a bond and to embed the device topography cannot be stimulated directly with UV light. In order to enable a debonding process for these materials, an additional layer is commonly deposited on the carrier. The post bond uniformity (quantified typically by the total thickness variation - TTV) of the used bulk layer of thermoset adhesive has to be very well controlled in order to enable a defect free thinning of the device wafer: this becomes crucial particularly when the final device layer has to be thinned down below 10 µm. Besides the optimization of the bond layer thickness uniformity, suitable carriers for different devices and applications were evaluated. Due to the significant variety of the available glass carriers, a customized temporary bonding process can be developed by selecting the most appropriate adhesive and carrier combinations suitable even for very challenging substrates, like reconstituted wafers.Reconstituted wafers consist of a number of different layers and materials with different thermal expansion coefficients, which makes the stress management and the handling of such substrates extremely difficult. However, the choice of the suitable carrier enables the processing independent of the chosen integration process flow (RDL first; Chip first). Even a carrier flip flop to enable the processing of the back side of the very thin package is possible and this is enabling the creation of ultra-thin and smart packages.The scope of the current work was to address the post bond adhesive thickness uniformity as well as the stress management. Experimental results will be presented for the process optimization: figure 1 shows two bow measurement results for two different carrier materials and figure 2 shows an example of post-bonding thermoset adhesive uniformity measurement Figure 1

The two-phase flow simulation and experimental research on the formation of solder voids in power module

This paper focuses on the formation of solder voids in the large-area die-attach (DA) in power modules. The finite volume simulation method was used to study the motion behaviors of bubbles in molten liquid solder. The experiments were carried out by changing the reflow atmosphere. The voids distribution in DA was characterized by X-Ray detection. Results suggest that vacuuming the molten solder can significantly reduce the void rate of the DA. The bubbles only need a short stroke to escape from the molten solder under the influence of negative pressure. From a mechanical point of view, the collapse of the solder during the phase change is one of the main forces for driving the bubble to coalesce and move horizontally, but it may also lead to an increase in void ratio due to the reduction of BLT (Bond Layer Thickness). Solders with larger wall contact angles tend to have a larger void rate due to the increase in viscous resistance. The nitrogen atmosphere has a positive effect on reducing the void rate by reducing the wall contact angle of liquid solder. Besides, the wall adhesion plays a leading role in the movement of the bubble, and the influence of the buoyancy is small.

Pressureless Silver Sintering of Silicon-Carbide Power Modules for Electric Vehicles

Pressureless silver (Ag) sintering was optimized at 250°C in vacuum and nitrogen gas atmosphere with silicon carbide (SiC) chips, and silicon nitride active metal-brazed substrates (AMB). A 1200-V/200-A power module was developed using a pressureless Ag-sintered live SiC metal–oxide–semiconductor field-effect transistor (MOSFET) device and a Si3N4 AMB substrate module, and diverse reliability tests were performed. The void content and the bonding layer thickness of the Ag sinter joints were 1.2–3.4% and 68.5 µm. The bonding strength of the Ag sinter joints after thermal cycling testing (TCT) were slightly decreased due to the crack generation. In contrast, high-temperature storage testing (HTST) was carried out for a long time at high temperature, the sintering process occurred continuously, and the shear strength increased by 31% after HTST. The drain–source on-resistance (RDS(ON)) of a SiC MOSFET power module before and after the TCT and power cycle test was similar to the as-sintered state without change.

Silver Sintered Joint Property Between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module

Highly reliable sintering technologies operating in extreme conditions are being extensively researched nowadays to improve the efficiency of power modules based on silicon carbide (SiC) devices for use in electric vehicles. In this study, the strength of silver (Ag) sintered joints used in SiC/direct bonded copper (DBC) was recorded at 21.9–23 MPa, at a pressure of 0.2 MPa and zero pressure, at 210°C using 83 wt.% and 88 wt.% Ag paste. Al2O3 and AlN DBCs with copper and Ag finishes were used. The inter-diffusion of the Cu-Ag and the Ag-Ag sintered interfaces contributed to increasing bonding strength. Based on the relationship between bonding layer thickness and densification in the pressurized and pressureless sintering conditions, if densification was at least 93%, the strength of the Ag joint strength was as high as 23.8 MPa. From the results of a simulation of thermal deformation based on the mismatch in the coefficients of thermal expansion of materials without considering heat transfer, the Al2O3 DBC material (rather than AlN) exhibited a small and dispersed deformation of the SiC/DBC sintered module. We also observed that Al2O3 DBC was favorable in terms of warpage.

Effect of bond layer thickness on behaviour of steel-concrete composite connections

The performance of steel–concrete composite structural members depends on the connection at the steel–concrete interface. Structural adhesives are gaining rapid recognition as the bonding material between steel and concrete interfaces. The thickness of adhesive layer in a composite connection plays a key role in maximising the bond capacity. In this paper, the effect of the change in thickness of adhesive layer on the capacity of connection, ultimate slip at the interface, and the shear stiffness of connection have been studied. Twenty-five test specimens were cast and tested under direct shear to achieve the optimum thickness of adhesive layer. The ultimate strength and relative slip of all five adhesive layer thicknesses of steel–concrete specimens, obtained through experimental studies, were verified using finite element analysis. The failure patterns of bonded connection were also critically observed and found to be varying with adhesive layer thickness. It changes from adhesive failure to mixed (adhesive and cohesive) failure, and from mixed failure to cohesive mode of failure, with increasing thickness. At the optimum thickness, the composite interface experiences a mixed mode of failure. The effectiveness of bonded connections over mechanical shear stud connections was outlined through a comparison of the load-slip behaviour of both.

Material Selection for Interfacial Bond Layer in Electronic Packaging

In electronic packaging, typically two or more thin dissimilar plates or layers are bonded together by an extremely thin adhesive bond layer. Electronic assemblies are usually operated under high power conditions which predictably produces a high temperature environment in the electronic devices. Therefore, thermal mismatch shear and peeling stress inevitably arise at the interfaces of the bonded dissimilar materials due to differences in Coefficient of Thermal Expansion (CTE) typically during the high temperature change in the bond process. As a result, delamination failure may occur during manufacturing, machining, and field use. As such, these thermo-mechanical stresses play a very significant role in the design and reliability of the electronic packaging assembly. Consequently, critical investigations of interfacial stresses under variable load conditions in composite structure can result in a better design of electronic packaging with higher reliability and minimize or eliminate the risk of functional failure. In order to formulize bond material selection, analytical studies are carried out in order to study the influence of bond layer parameters on interfacial thermal stresses of a given package. These parameters include Coefficient of thermal expansion (CTE), poison’s ratio, temperature, thickness, and stiffness (compliant and stiff) of the bond layer. From the study, stiffness and bond layer thickness are identified as the key parameters influencing interfacial shearing and peeling stresses. The other parameters namely CTE, poisons ratio has shown insignificant influence on interfacial stresses due to the very thin section of bond layer compared to the top and bottom layers. The results also show that the interfacial stresses increases proportionally with the increase of temperature in the layers. Therefore, it is very important that the temperature is maintained as low as possible during the chip manufacturing and operating stages. Since only two parameters namely stiffness and bond layer thickness are identified as the key parameters, the interface thermal mismatch stresses can be reduced or eliminated by controlling these two parameters only. Therefore the identification of suitable bond layer parameters selection with reasonable accuracy is possible even without performing optimization process. Finally, this paper proposes a Metal Matrix Composite (MMC) bond material selection approach using rule of mixture material design. The outcome of this research can be seen in the forms of practical and beneficial tools for interfacial stress evaluation and physical design and fabrication of layered assemblies. The Engineers can utilize this research outcome in conjunction with guidelines for electronic packaging under variable thermal properties of layered composites.

Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging

The flip chip bonding technology is widely used in electronic packaging as a result of improvements towards mechanical performance of layered structures. However, thermal mismatch shear and peeling stress are often induced by the differences of the material properties and geometries of bond layer during the high temperature change at operating stage. Intrinsically, these thermo-mechanical stresses play a very significant role in the design and reliability of the flip chip package. Therefore, this project aims to develop a methodology to find optimized bonding material thermo-mechanical properties and geometries in relation to the packaging layers in order to eliminate or reduce thermal mismatch stresses that occur in multi-layered structures in electronic packaging. The closed-form solution of thermo-mechanical analysis of bi-material assembly with bond layer is provided. Parametric study will be carried out in order to study the influence of bond layer parameters on interfacial thermal stresses of a flip chip assembly. These parameters include Young modulus, Coefficient of Thermal Expansion (CTE), Poisson’s ratio and thickness of the bond layer. It is found that the shearing stresses and peeling stresses decreased considerably at the interface with the increase of bond layer Young Modulus and thickness. On the other side, bond layer CTE and Poisson ratio show almost no significant effect on the interfacial shearing stress and peeling stress along the interface in a bi-material assembly.

Capacitive sensing of local bond layer thickness and coverage in thermal interface materials

An instrumentation technique is developed using embedded capacitive sensors to measure the thickness and evenness of coverage of a thin layer of dielectric thermal interface material (TIM) between two substrates. The technique requires an array of sensors embedded into one substrate, with an electrically conductive opposing substrate. Local capacitance measurements are sensitive to both local bond layer thickness and local voiding. We propose a means for using an array of capacitance measurements to interpret both bond layer thickness and local voiding at every sensor location. An algorithm is developed which reveals both characteristics from a single set of capacitance measurements. Experiments are conducted with thermal grease layers of different bond layer thicknesses and void distributions using a prototype system constructed on printed circuit boards. The thickness and void distribution are successfully mapped across the bond layer using the algorithm developed. The technique offers a sensing approach for in situ instrumentation of layers of thermal grease in a thermal test vehicle.

Investigation of interfacial stiffnesses of a tri-layer using Zero-Group Velocity Lamb modes.

Zero-Group Velocity (ZGV) Lamb waves are studied in a structure composed of two plates bonded by an adhesive layer. The dispersion curves are calculated for a Duralumin/epoxy/Duralumin sample, where the adhesion is modeled by a normal and a tangential spring at both interfaces. Several ZGV modes are identified and their frequency dependence on interfacial stiffnesses and on the bonding layer thickness is numerically studied. Then, experiments achieved with laser ultrasonic techniques are presented. Local resonances are measured using a superimposed source and probe. Knowing the thicknesses and elastic constants of the Duralumin and epoxy layers, the comparison between theoretical and experimental ZGV resonances leads to an evaluation of the interfacial stiffnesses. A good agreement with theoretical dispersion curves confirms the identification of the resonances and the parameter estimations. This non-contact technique is promising for the local evaluation of bonded structures.

The measurement and analysis of micro bonding force for electroplated CBN grinding wheels based on response surface methodology

The superabrasive (e.g. CBN or diamond) grain dislodgement occurrence on the wheel surface due to insufficient bonding force is the major failure phenomena in the grinding process with electroplated grinding tools. This failure leads to the abrupt increase of load on the immediate grains, accelerating more grain dislodgement on wheel surface. Ultimately, the aggregated grain dislodgement causes the workpiece profile accuracy degradation and catastrophic wheel sharpness loss. Therefore, the provision of sufficient and uniform micro bonding force all through the wheel surface is the critical task in electroplated superabrasive grinding wheel design. Considering the complexity in the micro bonding force enabling factors, e.g. the grain shape, dimensional size, spatial orientation, and bond layer thickness, it is vital to establish the quantitative and comprehensive relationship between these factors with the micro bonding force for optimal electroplated grinding wheel design. In this paper, an inclined micro-thread turning test is developed to measure the single grain micro bonding force. In addition, the finite element model of single CBN grain bonding force is established and validated to simulate the grain dislodgement. Finally, the response surface methodology (RSM) is applied to build the comprehensive correlation of the bonding force with its dimensional size, spatial orientation, and bond layer thickness. Therefore, the optimal bonding condition through regressed prediction model is identified to provide the quantitative basis for the electroplated CBN grinding wheels design, which indicates that the bonding force can be predicted for specific wheel manufacturing parameters and improved by related variable adjustment.