Measuring and controlling the condition of the plating bath on the production line is important to achieve high quality plating and automation of the manufacturing process. Proper evaluation of plating solution degradation is one of the most pressing challenges in the copper sulfate electroplating process. However, constant monitoring and evaluation on the production line is difficult, and periodic sampling is used for evaluation. Optical measurement would be a simple and accurate method with which to achieve on-time and in-situ evaluation.We have developed a method to optically measure monovalent copper (Cu(I)) in a copper sulfate electroplating solution to evaluate the deterioration of the solution. Bathocuproinedisulfonic acid, disodium salt (BCS) specifically reacts with Cu(I) and forms an absorption band in the visible light region. By measuring its absorbance, it becomes possible to quantify the Cu(I) concentration in the aqueous solution. Absorbance measurement using BCS is a technology that can easily quantify Cu(I), making immediate measurement possible at production sites.Color reaction measurements are simple and suitable for production line applications, but like other methods, sampling is required. Furthermore, we proposed a method to evaluate plating solutions using fluorescence. This measurement detects the generation of fluorescence due to the decomposition of additives originally contained in the plating solution. There is no need to add special chemicals, and the state of the solution can be measured on the spot without sampling. However, this fluorescence is only effective when using Janus Green B (JGB) as an additive.On the other hand, light scattering can detect the formation of microparticles in solution. It is known that the accumulation of copper fine particles due to disproportionation reactions affects the quality of copper sulfate electroplated films. This suggests that the production of copper fine particles in the plating solution increases the light scattering intensity and can serve as an indicator of the degree of turbidity of the solution.In this study, we used a fluorometer to measure the intensity of light scattered in the direction perpendicular to the incident light as an indicator of the turbidity of the plating solution, and verified the relationship between the formation of fine particles due to energization and the increase in turbidity. This is equivalent to measuring turbidity using nephelometry. Furthermore, we will clarify the relationship between turbidity and Cu(I) accumulation and its effect on plating film quality, and consider its application to plating solution evaluation. Figure 1
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