High temperature electronic systems need to operate in extreme conditions that exceed the current levels specified by the military and aerospace standards. In high temperature and wide operating temperature applications, electronics can suffer from failure modes caused by a combination of environmental and operational loadings such as temperature, vibration, humidity, pressure, external stresses, etc. This work reports the findings and observations of the investigation of the combined effects of thermal and vibrational environments on wire-bonded interconnections used in high temperature electronic components. The work is focused on combined testing at temperatures up to 250°C and vibration loading with the sine frequency swept cycles ranging from 5Hz to 2000Hz and acceleration up to 20g rms. Analysis is focusing on the wire bond connections which has shown an increasing occurrence of wire deformation at a test temperature of 250°C whilst being subjected to vibration, particularly for wires with large loop shapes. Wire bonded samples have been evaluated through visual inspection, electrical characterization and ball shear tests to identify failure mechanisms.