Average Shear Strength Research Articles

Solid-phase transient soldering method based on Au/Ni–W multilayer thin-film-modified copper-based structures

The copper crystal cone-shaped micro-nanostructure is used as the substrate, and the Ni–W alloy layer and Au nanolayer are plated sequentially. Instantaneous soldering with lead-free solder is realized under ultrasonic assistance at room temperature. This solves the residual stress and thermal damage caused by high melting point lead-free solder on thin chips and thermal components, and ensures the safety and reliability of electronic components. Copper-based microstructures are deposited by electrochemical methods. An amorphous Ni–W alloy layer with a thickness of 180 nm is deposited on the Cu-based microstructures by adjusting the atomic ratio of the plating solution. The Ni–W layer is further coated with a 50 nm Au layer to prevent oxidation. Solid-phase transient soldering is realized by combining the Au/Ni–W multilayer thin-film-modified Cu substructures with commercial solder (SAC305) for a holding time of 3 s at a soldering pressure of 10,000 gf (20 MPa) while ultrasonically assisted. The soldered samples are aged at 180 °C for 10 min, 30 min, and 60 min, respectively. Copper substructures with different surface modifications are subjected to destructive shear experiments with solder balls. Scanning electron microscope and X-ray fluorescence thickness gauge are used to study the microstructure, intermetallic compound (IMC) composition thickness and properties of the soldered interface and section. The cone height of the Cu-based structure is 2–4 μm, and the diameter of the bottom is 800 nm–1200 nm, which has a sharp tip and an excellent L/D ratio. The interface between the Au/Ni–W modified Cu substructure and the solder ball is almost free of holes. The average shear strength at the soldering interface is about 43.06 MPa. The fracture surface after the shear experiment basically occurs inside the solder ball matrix, which belongs to the pure toughness fracture. The interface between the Au/Ni–W-modified Cu-based structure and the solder ball is subjected to long aging treatment at 180 °C. The soldering interface showed a “bright layer”. New phases are generated on the solder side above the “bright layer”, while no new phases appear on the Cu substructure side below the “bright layer”. The copper-based microstructure is inserted into the inside of the solder ball to form an inlay and produce mechanical interlocking. Au/Ni–W alloy modification layer can effectively improve the surface hardness of copper-based structures. This creates a large hardness difference with soft solder and enables the formation of fewer holes in the insertion solder. Amorphous Ni–W alloys are prone to form dense oxide films during ultrasonication. The Au film modification prevents oxide generation and increases the average shear strength of the soldering interface. The Ni–W alloy layer retards the interdiffusion between Cu–Sn, blocks the excessive growth of Cu–Sn IMCs, and reduces the reliability problems caused by interface failure.

92‐5: Late‐News Paper: Development of a Full‐Color MicroLED Display Utilizing Novel Simultaneous Transfer and Bonding (SITRAB) Process and SITRAB Film Technology

In this study, we introduce the world's first development of a full‐color micro‐LED display utilizing a Simultaneous Transfer and Bonding (SITRAB) process and a novel SITRAB film. Developed micro‐LED display involves R/G/B micro‐LED chips measuring 35 × 20 µm 2, arranged into a display resolution of 32 × 32, with a pixel pitch of 324 µm and a subpixel pitch of 50 µm. The micro‐LED display utilizes a glass substrate and aluminum wiring. A key innovation in our process is the use of indium solder for low‐temperature bonding, significantly enhancing the assembly process's efficiency and reliability. The SITRAB film, a specially developed material by ourselves, removes the surface oxide of indium solders, facilitating effective bonding between the micro‐LEDs and the display electrodes. Post‐curing of this SITRAB film further enhances the shear strength of the micro‐LEDs. An average shear strength of approximately 5.45 gf (about 32 MPa), significantly surpassing the tensile strength of indium. These advancements not only demonstrate the feasibility of the SITRAB process and the new film material in creating high‐quality micro‐LED displays but also significantly boost the reliability of these displays.

Interface enhancement mechanism of rolled Mg/Al clad plate with particle interface control

In this study, the cold-spraying process was utilized to deposit Al particles onto an Al slab, an Mg slab, and both Al and Mg slabs to form an ultra-thin interlayer, and then the clad slabs were rolled at 400 °C, developing three roll-bonding processes: the roll-bonding process with cold-sprayed Al powder on the Al slab (CS-Al), the roll-bonding process with cold-sprayed Al powder on the Mg slab (CS-Mg), and the roll-bonding process with cold-sprayed Al powder on both the Al slab and the Mg slab (CS-Both). The effects of three different cold-sprayed Al particle interlayer processes on the mechanical properties of rolled Mg/Al clad plates were investigated to improve the mechanical properties. The microstructure, texture evolution, intermetallic compound formation, mechanical properties, and mechanisms involved in the Mg/Al clad plate rolling were systematically investigated. The results showed that the pre-bonding between the particles and the substrates through cold-spraying had a significant impact on the bonding strength of the Mg/Al clad plates, and the CS-Both process can increase the average shear strength of the Mg/Al clad plates to 49.24 MPa at a medium reduction rate of 37.5 %, 2.5 times that of the conventional rolling process. The CS-Both process constructed more evident dual microscopic three-dimensional interfaces and promoted more thorough atomic diffusion at the interface through the double-sided cold-spraying process. Meanwhile, the dual cold-sprayed Al coatings on both the Mg slab and Al slab underwent dynamic recrystallization during rolling to form a homogeneous unit with no additional coating interfaces. Fine grain strengthening and dislocation strengthening were judged to be important mechanisms for improving the mechanical performance of the interfacial layer.

A comprehensive review of experimental studies on shear behavior of bolted rock joints with varying rock joint and bolt parameters and normal stress

AbstractThe shear characteristics of bolted rock joints are crucial for the stability of tunneling and mining, particularly in deep underground engineering, where rock bolt materials are exposed to high stress, water pressure, and engineering disturbance. However, due to the complex interaction between bolted rock joints and various geological contexts, many challenges and unsolved problems arise. Therefore, more investigation is needed to understand the shear performance of bolted joints in the field of deep underground engineering. This study presents a comprehensive review of research findings on the responses of bolted joints subjected to shearing under different conditions. As is revealed, the average shear strength of bolted rock joints increases linearly with the normal stress and increases with the compressive strength of rock until it reaches a stable value. The joint roughness coefficient (JRC) affects the contact area, friction force, shear strength, bending angle, and axial force of bolted rock joints. A mathematical function is proposed to model the relationship between JRC, normal load, and shear strength. The normal stress level also influences the deformation model, load‐carrying capacity, and energy absorption ratio of bolts within bolted rock joints, and can be effectively characterized by a two‐phase exponential equation. Additionally, the angle of the bolts affects the ratio of tensile and shear strength of the bolts, as well as the mechanical behavior of both bolted rock joints and surrounding rock, which favors smaller angles. This comprehensive review of experimental data on the shear behavior of bolted rock joints offers valuable theoretical insights for the development of advanced shear devices and further pertinent investigations.

Infrared Radiation-Assisted Non-Pressure Sintering of Micron-Sized Silver for Power Electronic Packaging

In recent years, silver sintering has gained increasing attention in high-power density electronic packaging due to its characteristics such as a high melting point and excellent thermal and electrical conductivity. Micron-sized silver sintering offers a lower cost, but requires a longer processing time and additional pressure, which constrains its application. This paper presents a low-cost sintering process using infrared radiation (IR) as a heat source. By leveraging the unique properties of IR, the process achieves selective heating. The thermal energy can be mainly absorbed by the specific areas requiring sintering. This innovative approach eliminates the need for external pressure during the sintering process. This feature not only simplifies the overall process but also reduces the processing time required for sintering. The silver joints obtained from IR sintering process for 45 min achieved an average chip shear strength of 38 MPa at a temperature of 225 °C, which is higher than the strength of silver joints obtained from a traditional sintering process for 2 h. Additionally, the IR-sintered silver joints have a resistivity of 9.83 × 10−5 Ω·cm and scanning electron microscope (SEM) images of the joints reveal that the sintered joints obtained through the IR sintering process exhibit less porosity compared to joints obtained through a traditional sintering process. The porosity of the IR silver joints at 225 °C is 6.4% and does not change even after 3000 cycles of thermal shock testing, showing outstanding reliability. A GaN power device using IR silver joint also performed better in thermal and electrical performance testing, showing promising potential for the application of micro-silver paste in power electronic devices.

Effect of anodic oxide layer on friction stir spot welding between anodized A5052 and CFRTP

Dissimilar joining between carbon fiber reinforced thermoplastic (CFRTP) and metal has attracted attention of transportation equipment industry for reduction of weight and cost by multi-material structure. Friction stir spot welding (FSSW) between anodized A5052 (AO-A5052) and carbon fiber reinforced thermoplastic (CFRTP) was investigated for the improvement of joining strength. Average tensile shear strength of AO-A5052/CFRTP joint was 2505 N and more than 500 N higher than that of untreated-A5052/CFRTP joint. In the AO-A5052/CFRTP joint, probe plunge induced cracks and microwrinkles in the anodic oxide layer on the weld surface. Matrix resin was immersed into the cracks and the microwrinkles underneath of the shoulder of the welding tool. Reinforced carbon fiber and matrix resin was immersed into large crack at the outer peripheral corner of probe. Thus, those increased the joining strength by mechanical anchoring effect. Thermal stress test and machining stress test were performed for revealing the mechanism of cracking of anodic oxide layer. Although thermal stress did not generate cracks in the anodic oxide layer, machining stress by probe plunge generated cracks in the anodic oxide layer. The generated cracks in anodic oxide layer underneath of the shoulder were distorted to the rotating direction of welding tool by the friction stirring.

Research on calculation model for ultimate bearing capacity of tensile type anchor cables and the shape of internal fracture surface in anchorage segment

AbstractThe generalized model and parameter equation for the internal fracture surface of tensile type anchor cable anchorage section are constructed, and the calculation model of ultimate bearing capacity is derived based on the principle of limit equilibrium. The shape of the internal fracture surface in the anchorage section and the expression of its parameter equation are experimentally studied, and the variation law of the parameter equation and fracture range with the diameter of the anchor cable and confining pressure is analyzed. The parameter equation is substituted into the calculation model to realize the calculation and verification of the model. Through theoretical derivation, a calculation model of ultimate bearing capacity of anchor cable is obtained, which comprehensively considers the average shear strength of anchorage section, the shape of fracture surface, fracture range and confining pressure. The tests show that according to the magnitude of the confining pressure on the anchorage section, the internal fracture surface takes on two shapes: cylindrical and trumpet‐shaped, the parameter equation of trumpet‐shaped fracture surface obeys logarithmic distribution approximately. The coefficient a decreases with the increase of confining pressure but increases with the increase of anchor cable diameter, the constant b increases with the increase of confining pressure but decreases with the increase of anchor cable diameter. The ranges of horizontal and vertical fracture decrease with the increase of confining pressure, and increase with the increase of anchor cable diameter. The deviations between the theoretical calculation and the experimental results are less than 6.5%.

Low temperature soldering technology based on superhydrophobic copper microlayer

Cu–Cu soldering is realized under certain pressure and low temperature conditions by using a surface silver film to modify the copper microlayer structure, thus solving the problems of high thermal stress and signal delay aggravation caused by high temperature in the traditional reflow soldering process. The copper microlayer modified with silver film is obtained by electrodeposition. The surface substructure of the Cu microlayer is a nano cone-shaped protrusion. The diameter of the bottom of the cone is 500 nm∼1 μm, and the height of the cone is 1∼2 μm. The thickness of the silver film is about 320 nm, and the modification of the copper layer with silver film can effectively prevent the oxidation of the copper layer. Two silver-modified copper microlayers are placed in face-to-face contact as a soldering couple. A certain pressure and low temperature are applied to the contact area to realize the soldering and interconnection.The morphology of the soldered interface and the average shear strength of the soldered joints are analyzed by scanning electron microscopy, transmission electron microscopy and solder joint tester. It is found that under the optimal soldering parameters of soldering temperature 220 °C, soldering pressure 20 MPa and soldering time 20 min, the nano-conical projections of the Cu micrometer layer are inserted into each other to produce a physical blocking effect. The highly surface-meltable silver film effectively connects the surrounding copper layer as an intermediate buffer layer. The average shear strength of soldering joints is significantly increased. Heat treatment experiments have shown that the average shear strength can be effectively increased by heat treatment for an appropriate period of time. Prolonged exposure to heat has little effect on the average shear strength. With the special morphology of the copper microlayer structure and the nano-size effect of the silver layer, soldering can be done at low temperatures. The quality of the soldering interface is good and small soldering dimensions can be obtained.

Laser-directed energy deposition of Ti6Al4V/AA2024 alloy component based on interweaving structure

The presence of brittle intermetallic compounds (IMCs) can easily lead to cracks at the interface of titanium/aluminum alloy components. A novel interweaving structure was proposed and a Ti6Al4V/AA2024 dissimilar alloy component was prepared. The interlocking between Ti6Al4V and AA2024 mitigates the adverse effects of brittle IMCs on the Ti/Al interface, while the interweaving of Ti6Al4V and AA2024 avoids the generation of continuous IMCs. The average compressive shear strength of the Ti6Al4V/AA2024 alloy component is 86.1 MPa, which is 79 % of that of as-deposited AA2024. The fracture occurred in the interweaving layer in shear tests.

Analysis on Shear Resistance of Joint and Structural Mechanical Response of Assembled Composite Beam Joints

This article systematically studies the shear characteristics and structural mechanical response characteristics of composite beam joints. The results indicate that the shear stiffness of the connector is between 1000 N/mm and 2500 N/mm, with high stiffness performance. Meanwhile, as the stiffness increases, the frequency of the structure shows a significant increasing trend, indicating that high stiffness helps to improve the stability of the structure. In the trend chart of shear characteristics and performance of connectors over time, the shear characteristics of connectors significantly increased between 2018 and 2023, with an average shear strength increasing from 1500 N to 2100 N, an increase of 40%. By studying the static and dynamic response characteristics, as well as the bearing capacity, stability, and fatigue performance of composite beams. The results indicate that the response characteristics of the new connector are significantly better than those of traditional connectors. Based on the research results, this article proposes strategies and suggestions for optimizing connector design and improving overall structural performance, providing important theoretical support and practical guidance for practical engineering applications. This study not only enriches the theoretical system of composite beams, but also has important significance in promoting technological progress in related fields.

Improving the wettability of oxide layers to enhance the bonding strength of shot-blasting steel substrates by using simple resin pre-coating method

This study reveals the micro-structure of the naturally oxidized shot-blasting steel substrate surface and uses a simple resin pre-coating (RPC) approach to fully wet the substrate surface for a stronger adhesive bonding effect. RPC solutions are made of around 90% acetone and 10% resin without hardener, which can be sprayed or brushed onto the steel substrate surface. To demonstrate the wetting effect of RPC treatment on the oxide layer, a single lap shear (SLS) test is conducted to measure the shear strength of grit-blasting and naturally oxidized shot-blasting steel substrates under six different concentrations of RPC solutions. Results showed that after being treated with a 5 wt% RPC solution, the average shear strength of grit-blasting and naturally oxidized shot-blasting specimens increased by 27% and 20% respectively. Meanwhile, it has been observed that the average shear strength of naturally oxidized shot-blasting specimens treated with a 5 wt% RPC solution (15.53 MPa) is slightly higher than that of grit-blasting specimens without RPC treatment (15.45 MPa). This finding indicated that RPC treatment could effectively wet the oxide layer on the surface of shot-blasting steel substrates, removing the need of grit-blasting for steel substrates. Consequently, RPC treatment can simplify on-site processes and reduce environmental pollution.

Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate

The aim of this study was to characterize a Zn-Mg type soldering alloy and direct soldering of SiC ceramics with a copper substrate. The Zn1.5Mg solder exerts a wider melting interval. The temperature of the eutectic reaction was 365 °C, and the liquidus temperature was 405 °C. The microstructure of the soldering alloy is comprised of a zinc matrix. Segregation of binary eutectics in the form of (Zn) + Mg2Zn11 lamellas occurred on the boundaries of Zn grains. Additionally, the presence of a MgZn2 magnesium phase was observed in the solder matrix. The SiC/solder bond was formed due to magnesium distribution from solder to the boundary with SiC ceramics, where magnesium reacts with silicon, which is infiltered in SiC ceramics. By a mutual interaction, a new Mg2Si phase is formed. An interaction between the molten zinc solder and Cu substrate occurred on the boundary of the Cu/substrate joint at the formation of a transition zone composed of two new phases, namely the γCu (Cu5Zn8) non-wettable phase type, approximately 30 µm wide, and a wettable (CuZn4) phase type ε, approximately 12 µm wide. The average shear strength of a combined SiC/Cu joint fabricated using Zn1.5Mg solder was 44 MPa.

Experimental investigation of the compressive and shear behaviours of grouted and hollow masonry constructed with PVA fibre-reinforced mortar and grout

Polyvinyl alcohol (PVA) fibres are ultra-high-performance fibres that can be used to reinforce cementitious composites. This study experimentally investigated the compression and shear behaviours of grouted and hollow masonry constructed with fibre-reinforced mortar (FRM) used for the joints and/or PVA fibre-reinforced grout (FRG). In this regard, the effect of increasing the fibre content of 6 mm PVA fibres in the FRM on the behaviour of masonry was investigated. Moreover, the effect of changing the fibre length (8 mm and 13 mm PVA fibres) and the fibre content of 13 mm PVA fibres in the FRG on the behaviour of masonry was investigated. This was accomplished by constructing and testing 31 masonry prisms and 29 masonry assemblages. The behaviour of PVA-reinforced masonry was evaluated based on compressive strength, shear strength, modulus of elasticity, modulus of rigidity, compressive strain at peak compressive stress, shear strain at peak shear stress, compression ductility index and compression toughness. In addition, the compression and shear stress-strain curves, failure modes and crack propagation of PVA-reinforced masonry were compared with unreinforced masonry. It was concluded that using PVA fibres in the grout minimized the masonry face shell spalling, and most of the post-peak deterioration appeared in the form of masonry cracks and less face shell spalling compared with unreinforced masonry. In addition, using PVA-FRM only or PVA-FRM with PVA-FRG could increase the compressive strength of grouted masonry. In contrast, using PVA-FRM did not change the compressive strength of hollow masonry. Furthermore, all grouted assemblages with PVA-FRM and PVA-FRG (except for assemblages with 13 mm PVA-FRG with a fibre content of 0.10% by weight of grout) have similar average shear strength compared with unreinforced assemblages. Finally, As the fibre content of 6 mm PVA fibres in the FRM of hollow assemblages increased, the shear strength and the modulus of rigidity decreased. This study highlights the improvements and drawbacks of using PVA Fibres in mortar and grout on the compressive and shear performances of hollow and grouted masonry.

Enhanced fracture properties of continuous Cf/ZrB2-based composites with polydopamine-derived carbon boundary layer

Continuous carbon fiber-toughened ZrB2-based composites (Cf/ZrB2-based composites) are potential thermo-structural materials suitable for ultra-high temperature applications. To improve the fracture properties, polydopamine-derived carbon (PDC) was deposited on carbon fibers and used as a boundary layer of Cf/ZrB2-based composite (Cf/PDC/ZrB2). Results indicated that PDC was applied uniformly to fibers, with no instances of cross-sticking observed among adjacent fibers. The matrix could effectively infiltrate into the intra-bundle region, resulting in the formation of a highly dense Cf/PDC/ZrB2 composite. PDC can effectively modulate the interface of Cf/ZrB2-based composite. Using polydopamine-derived carbon (PDC) as a boundary layer, the average interfacial shear strength of the composite was decreased from 369 MPa to 133 MPa. The fracture toughness of Cf/PDC/ZrB2 composite was 8.4 MPa·m1/2, representing a 19 % enhancement in comparison with the composite without a PDC layer. The work of fracture of Cf/PDC/ZrB2 composite was 8.5 kJ·m−2, significantly surpassing that of the composite without a PDC layer (1.7 kJ·m−2). The outstanding fracture properties can be attributed to the beneficial interfacial bonding established by PDC layer between fiber and matrix, which promotes the activation of toughening mechanisms including crack branching/deflection and fiber bridging/pull-out.

Harnessing the synergy of grout and adhesive: Numerical prediction of load capacity in hybrid composite joints

This study examines grouted joints for offshore wind turbine systems, where gaps between steel pipes are filled with grout, relying on adhesion, friction and compression struts formed by shear keys. Concerns about the limited load carrying capacity of large diameter grouted joints in offshore structures have prompted investigation. Whilst adhesive bonds are recognized for load transfer in structural steel, the complete replacement of grouting with bonding alone is proving impractical for large gaps in offshore structures, posing challenges in terms of cost and handling. To address these challenges, the study presents an innovative hybrid grouted joint for steel structures that combines grout and adhesive layers. This novel approach replaces traditional large shear keys with distributed micro-shear keys — small granules embedded in the grout material. Under axial loading, the hybrid joint demonstrates robust performance, with a maximum nominal shear stress on the inner pipe of 30.1 MPa and consistent load capacity across tests. Average shear strength is in line with, and occasionally exceeds, expectations. Notably, the hybrid joint shows resilience in different configurations and maintains a low coefficient of variation of 5.5%, indicating consistent performance. When the influence of the adhesive material on the hybrid joint is examined, the effect on the joint stiffness is minimal, despite variations in adhesive stiffness. Sikadur 370, which has a higher modulus of elasticity than DuploTEC, shows similar deformation curves in the elastic region, emphasizing the robustness of the joint. Differences in the maximum loads are attributed to the thickness of the adhesive layer and the lower modulus of DuploTEC, resulting in different shear strengths. The proposed hybrid joint offers a promising solution to improve the performance of conventional grouts and adhesives in offshore structures. The study also formulates a failure criterion, performs numerical stress analysis, and models the effect of geometric dimensions, eccentricity, and misalignment on load capacity. The methodology’s accuracy in predicting load capacity, supported by numerical analysis and large-scale joint simulations, contributes to a comprehensive understanding of hybrid joint performance in engineering applications.

Probabilistic analysis of georisk from capping of contaminated sediment in Gunneklev Fjord, Norway

The seabed of the Gunneklev Fjord in south-eastern Norway is covered with exceptionally soft contaminated sediment containing mercury and dioxins. The sediments have an undrained shear strength less than 1 kPa and a variable thickness of up to 2.5 m. To reduce the potential for leaching of contaminants from these sediments, Hydro Energy AS developed a remediation plan involving capping of the sediment. Significant uncertainties are associated with the sediment's undrained shear strength and the cap thickness. An unfortunate combination of low shear strength and thick cap could cause slope failure (e.g. translational sliding of the sediment and/or bearing capacity failure (e.g. punching through). Failure, particularly slope failure, can cause spreading of the contaminants in the fjord causing serious consequences. This paper presents an assessment of the probability of slope failure associated with the contaminated sediment before and after the cap placement. Probability of bearing capacity failure is considered to have more local effect and is also discussed briefly. The study used the Monte Carlo method with random undrained shear strength and sediment thickness. The simulations show high slope failure probability when the seabed inclination was ≥ 1:50 combined with an average undrained shear strength ≤ 0.4 kPa. Based on the probabilistic analyses, a pilot field testing campaign was carried out (after this study) with 20-cm thickness cap in the “gentle” sloping area and 5-cm thickness in the “steep” areas to avoid causing a failure. The analyses were used to support evidence-based decision-making on the cap design and implementation for further field testing.

Hybrid grouted joints: Load bearing and failure behaviour under static, axial loading

The hybrid grout joint is a new type of joint to structurally connect circular hollow sections (CHS). It combines the two joining processes adhesive bonding and mineral grouting. While the adhesive bonding process is performed under controlled environmental conditions, the grouting is conducted on-site. Of particular interest is its ability to compensate tolerances, which makes it very interesting in various areas of steel construction. In the present paper, the influence of different factors on the load-bearing behaviour under quasi-static, axial loading is investigated. In general, the connection is characterised by high stiffness and load-bearing capacity. With increasing overlap length, the capacity increases, although because of the stress concentrations average shear strength decreases. The radial stiffness of the adherends is identified as a second considerable influence factor for the load-bearing capacity. With increasing radial stiffness (decreasing diameter/thickness ratio), bond strength increases. The load capacity under compression is about 10% lower than under tension. Two investigated imperfections, misalignment and eccentricity, exerted no negative influence on the load-bearing behaviour. While changing the adhesive influences the load-bearing behaviour, a change of grout has negligible influence. Additional tests on hybrid grouted joints with reinforced grout layer show, that reinforcing the grout layer is not necessary.

Research of joining the SiC and Cu combination by use of SnTi solder filled with SiC nanoparticles and with active ultrasound assistance

<p>The aim of this study was to characterize a Sn-Ti solder alloy containing 6 wt.% SiC nanoparticles and evaluate its use for direct soldering of SiC ceramics to a copper (Cu) substrate. Soldering was performed with direct ultrasound activation. The average tensile strength of the solder alloy was 17.1 MPa. Differential Thermal Analysis (DTA) analysis revealed an apparent transition at 234 ℃, corresponding to a eutectic reaction within the Sn-Ti binary system, indicating structural changes in the solder. The solder matrix consisted primarily of pure tin, while titanium combined with SiC nanoparticles to form a TiC phase. The existence of this phase was confirmed by energy dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD) analysis of the solder. The bond at the interface between the SiC ceramic substrate and the solder was formed through diffusion and chemical reactions. The XRD analysis of the fractured surface from the SiC side confirmed the formation of phases such as TiC, Ti<sub>2</sub>Sn, CTi<sub>2</sub>, CuSn, SiC, and Cu<sub>6</sub>Sn<sub>5</sub>; the TiC and CTi<sub>2</sub> phases resulted from the interaction of active Ti in the solder with the SiC ceramic surface. The bond at the Cu substrate interface formed due to the high solubility of tin in the solder and the formation of probable CuSnTi and CuSnTi3<sub>5</sub> phases, along with a mixture of Sn + η Cu<sub>6</sub>Sn<sub>5</sub> solid solution. The average shear strength of the SiC/Cu joint, fabricated using SnTi3 solder with 6 wt.% SiC nanoparticles, was 21.5 MPa.</p>

Reaction mechanism and mechanical properties of SiC joint brazed by in-situ formation of Ti3SiC2

This study undertakes vacuum pressureless brazing of SiC ceramics with TiSi2 powder, achieving MAX bonding. Microscopic characterization elucidates the microstructural evolution of the joined seam across various brazing temperatures and durations. The formation process of Ti3SiC2 is detailed through thermodynamic and kinetic analyses. At 1550 ℃ for 30 min or 1600 ℃ for 15 min, the filler undergoes in-situ reaction with SiC, yielding a dense, continuous Ti3SiC2 (MAX) phase, with no other phases observed. This suggests that increased temperature reduces MAX synthesis time. However, prolonged brazing causes voids in the center of the joined seam. Si volatilization was key for Ti3SiC2 in-situ formation, and this reaction equation was proposed. Maximum average shear strength at room temperature is 127.15 MPa at 1550 ℃ for 30 min and 118.15 MPa at 1600 ℃ for 15 min.

Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bonding

With the recent rapid development of IT technology, the demand for multifunctional semiconductor devices capable of high performance has increased rapidly, and the miniaturization of such devices has also faced limitations. To overcome these limitations, various studies have investigated three-dimensional packaging methods of stacking devices, and among them, hybrid bonding is being actively conducted during the bonding process. studies of hybrid bonding during the bonding process are active. In this study, Cu bonding using a nano passivation layer was carried out for Cu/SiO2 hybrid bonding applications, with Au and Ag deposited on Cu at the nano level and used as a protective layer to prevent Cu oxidation and to achieve low-temperature Cu bonding. Au was deposited at about 12 nm, and Ag was deposited at about 15 nm, with Cu bonding carried out at 180 °C for 30 min, after which an annealing process was conducted at 200 °C for one hour. After bonding, the specimen was diced into a 1 cm × 1 cm chip, and the bonding interface was analyzed using SEM and TEM. Additionally, the 1 cm × 1 cm chip was diced into 2 mm × 2 mm specimens to measure the shear strength of the bonded chip, and the average shear strength of Au and Ag was found to be 5.4 and 6.6 MPa, respectively. The degree of diffusion between Au-Cu and Ag-Cu was then investigated; the diffusion activation energy when Au diffuses to Cu was 6369.52 J/mol, and the diffusion activation energy when Ag diffuses to Cu was 17,933.21 J/mol.