A non-conventional approach for depth profiling of thin film systems with enhanced depth resolution has been developed using standard Auger microprobe instruments. For the preparation of an in situ low angle cross-section, the sample is partly covered by an appropriate mask. Utilising the edge of this mask, the sample is sputtered in the Auger microprobe with ions at nearly grazing incidence. In the shadow of the mask, this produces a low angle cross-section through the thin film system. Then, a conventional depth profile is measured at the point of interest where part of the thin film system is covered only by a thin top layer. As demonstrated a considerable improvement of depth resolution Δ z/ z can be obtained by this method.