Au Wire Research Articles

Wire Bond Ability Enhancement of 8 Leads Small Outline Integrated Circuit and 14 Leads Thin Shrink Small Outline Package Using AuPd Coated Cu Wire Bonding for Automotive Devices

Paper present a study enhancement of wire bonding process in the integrated circuit package with 2N AuPd coated Cu wire (2N-AuPdCu) for Automotive devices. Wire bonding is the electrical connection between pad and leadframe. In present, Au wire is recently use for interconnection while the gold price still exorbitant and caused concern to the wire bonding cost. Cu wire is a lower price and considered to be an alternative for the interconnection but still concern in term of corrosion and reliability. Recently, 4N AuPd coated Cu wire (4N-AuPdCu) material have been introduced for automotive device but still encounter the reliability problem. The 2N AuPd coated Cu wire was developed version for more reliability enhancement and consider to use for alternative wire of automotive device. In the experiment, Au wire, 4NAuPdCu wire and 2N AuPd coated Cu wire were used for wire bonding process on 8 leads Small Outline Integrated Circuit Package (8L-SOIC) and 14 leads Thin Shrink Small Outline Package (14L-TSSOP) to compare wire bond ability. Analysis, this package tested wire bond ability and reliability. The results performed well in wire bond ability and reliability for 2N AuPd coated Cu wire when comparing with Au wire and 4N AuPd coated Cu wire. Therefore, 2N AuPd coated Cu wire can enhance the quality and reliability for 8L-SOIC package and 14L-TSSOP package for automotive device.

Evolution mechanism of interfacial multi-layer intermetallic compounds and failure behavior in the Al–Au wire bonding

Evolution mechanism of interfacial multi-layer intermetallic compounds (IMCs) and their impact on failure behavior in Al–Au wire bonding after thermal storage and thermal cycle process are investigated. Microstructural analysis shows that multi-layer IMCs form between the Al wire and barrier layer. After thermal storage and thermal cycle process, the Au8Al3 layer transforms into AuAl2, and Au pad transforms to a thicker layer containing Au2Al and AuAl. Thermodynamic analysis indicates that Au8Al3, Au2Al, AuAl, and AuAl2 have increasing stability. Small-size, equiaxed AuAl2 grains form due to high stored energy, while large-size, columnar Au2Al and AuAl grains result from slower reaction rate and limited recrystallization. The stack-like formation of AuAl2 grains is attributed to the balance between driving force and interfacial energy resistance. During thermal storage, thicker IMC layers cause cracking between IMC layers and Au pad, and micro voids form near the IMC layers/barrier layer interface due to Kirkendall effect. Thermal stress results show that plastic deformation of the Al layer slightly affects the thermal stress in other layers during the thermal cycle process. The cyclic stress at the interface with initial cracks ranges from −157 MPa to 114 MPa, facilitating crack propagation. Additionally, micro void grows under cyclic thermal input, weakening interface adhesion. Therefore, bond strength decreases and frequency of bonding lift-off with cracking along the IMC layers/barrier layer interface increases after thermal storage and thermal cycle process. These results provide the guidance for regulating the interfacial IMCs and predicting the thermal stress in Al–Au wire bonding.

Enabling Ab Initio Molecular Dynamics under Bias: The CP2K+SMEAGOL Interface for Integrating Density Functional Theory and Non-Equilibrium Green Functions.

Density functional theory (DFT) combined with non-equilibrium Green's functions (NEGF) is a powerful approach to model quantum transport under external bias potentials at reasonable computational cost. In this work, we present a new interface between the popular mixed Gaussian/plane waves electronic structure package, CP2K, and the NEGF, code SMEAGOL, the most feature-rich implementation of DFT-NEGF available for CP2K to date. The CP2K+SMEAGOL interface includes the implementation of current induced forces. We verify this implementation for a variety of systems: an infinite 1D Au wire, a parallel-plate capacitor, and a Au-H2-Au junction. We find good agreement with SMEAGOL calculations performed with SIESTA for the same systems and with the example of a solvated Au wire demonstrating for the first time that DFT-NEGF can be used to perform molecular dynamics simulations under bias of large-scale condensed phase systems under realistic operating conditions.

Electrochemical redox of arsenic (III) and Cu (II) mixtures with ultraflat Au(111) thin films in water

The ability to detect trace concentrations of arsenite, As (III), in real water solutions is impacted by co-contamination of other metals and co-occurring ions. The presence of copper (II) ions are the most likely co-contaminant in natural waters to interfere with electrochemical As (III) detection, due to the close oxidation potentials of Cu (II) and As (III). The use of well-oriented ultraflat Au(111) thin film electrodes provided increased peak separation and sensitivity for electrochemical deposition and oxidation of Cu (II) and As (III) in 0.5 M sulfuric acid compared to an Au wire electrode. However, mixtures of Cu (II) and As (III) altered the oxidation peak positions during both cyclic voltammetry (CV) and linear stripping voltammetry (LSV) analysis. Calibration curves using the standard additions method in trace concentrations were conducted for Cu, As, and Cu & As solutions. Sweeping the potential at 10 mV s−1 during CV in Cu & As mixtures resulted in a sequential deposition condition where a layer of Cu inhibited co-deposition of As to the electrode. In contrast, the rapid potential stepping of LSV to a potential where Cu and As reduction simultaneously occurs produced a peak profile different from Cu or As alone. A larger oxidation peak during LSV was also observed when both Cu and As were present. X-ray photoelectron spectroscopy indicates a Cu-As alloy is formed on the surface after LSV deposition.SYNOPSIS: Analysis of Cu (II), As (III) and Cu (II) & As (III) mixtures suggests that a Cu3As intermetallic phase is formed during LSV which impacts trace As detection even in trace Cu conditions. This has important implications for the ability to determine As concentrations near the MCL of 10 µg L−1 in natural water systems which may contain Cu (II) and other co-contaminants.

Al2O3-Coated Bonding Wire with Electrical Insulation & Promoted Adhesion

Conventional bond wires composed of Au, Ag, & Cu don’t meet market demands for strong adhesion, electrical insulation, and corrosion passivation due to their conductive metallic surfaces. We propose a solution through the applications of a ceramic (Al2O3) coating at nanometer scales on these metal wires, thereby improving their adhesion to encapsulation, electrical insulation, and resistance to corrosion. We used ALD (Atomic Layer Deposition) methods to coat Au and Ag metal wires with diameters ranging from 18um to 48um (0.7mil~1.9mil) with Al2O3. Our paper details the innovative processes we used to incubate the idea of Al2O3 coating on conventional bond wires, focusing on wire bondability and dependability. Our findings demonstrate enhanced electrical insulation between crossing wires and increased reliability related to the wires’ adhesion to encapsulation.

Study of bonding parameters with Al and Au wires on Pd and Ag coatings

The process of electrical connection with gold and aluminium wires to palladium and silver electrodes is studied. Parameters of the wire bonding, such as bond force, ultrasonic power, bond time and temperature of the layers, controlled by heating the substrate are varied to explore the reliability of the bonds in terms of mechanical strength, electrical conductivity and interdiffusion of particles between the electrode and functional material at different bonding conditions. The importance of this study is due to the need of electrical connectivity at the stage of wiring and packaging of gas sensors with a novel organic nanomaterial (carbyne), requiring different types of electrodes – Ohmic or Schottky - according to the measurement principle and sensor architecture. Pd and Ag are identified as the most suitable for Ohmic and Schottky contacts, respectively, because of their favourable energy level alignment at the organic/metal interface. The chosen method for bonds testing is measurement of the pull force causing bond failure. The results show that Pd coating was bondable by Au wire, and Ag coating by Al wire, as well as Au on Pd bonds have 4 times higher strength. It is found that the bonding procedure doesn’t affect negatively on the Au/Pd/carbyne interface in terms of diffusion and redistribution of metal particles, but Al/Ag/carbyne is characterized by poor adhesion and the bonds are peeled-off. The results give new knowledge for the fabrication of advanced gas sensors and for the interaction of the carbyne with different metals, which will serve as a base for further optimization of the manufacturing technology toward their commercialization.

Investigation of the Specific Activity of Al-0.1%Au Wire for Epithermal Neutron Activation Analysis for Nirr-1 After Conversion from Heu to Leu

The significance that Epithermal Neutron Activation Analysis (ENAA) play in the field of science research, technology and innovations and how humans interact with elemental components in food chain and environment, has led to the development of ENAA protocol in research reactors. Epithermal neutrons, which have energy between 0.5 eV and 0.5 MeV, are increasingly needed by reactor clients. In this study, we have examined the activity of the flux monitor in the irradiation site of the inner channel (A1) of Nigeria Research Reactor-1 (NIRR-1) after its conversion to low enriched uranium fuel. The flux monitor (Al-0.1%Au thin wires) was washed with acetone, dried for 2 minutes, weighed to be 0.0122 g, and was thereafter placed in a 15.0 mm internal diameter polyethylene vials that has 1 mm wall thickness for irradiation. The activity of flux monitor Al-0.1%Au wire of 0.0122 g was calculated to be 5 x 108 count/s.g using A1 inner channels of the Cd line. This value obtained in this our studies found to be consistent with previous result and has shown that the epithermal channel A1 of the NIRR-1 remain suitable for ENAA after the reactor’s fuel conversion from HEU to LEU.

Effect of Die Deflection during Au Wire Bonding Process on Bonding Quality in Overhang Semiconductor Package

Effect of Die Deflection during Au Wire Bonding Process on Bonding Quality in Overhang Semiconductor Package

Influence of HCl Concentration on Corrosion Behavior between Au or Cu Bonding Wires and the Bond Pad for Semiconductor Packaging

Wire bonding, one of the methods for electrically connecting a semiconductor chip with a substrate, involves attaching thin metal wires to pads. It is the oldest electrical connection method that exhibits high compatibility with other processes. The metal wires used for electrical connection in wire bonding are mainly made of Au, Cu, and Ag. After the wire bonding, molding is performed using the epoxy molding compound (EMC). However, EMC inevitably contains ions such as halogen elements. In addition, it absorbs moisture due to its hydrophilicity, creating a corrosive environment with electrolytes. In this study, we evaluated the influence of hydrochloric acid concentration on corrosion behavior between Au or Cu bonding wires and sputtered Al bond pads. The electrochemical factors such as corrosion potential difference (ΔE), galvanic corrosion current density (ig), and anodic and cathodic Tafel slopes were found to influence galvanic corrosion behavior. Galvanic corrosion tendency in first bond and second bond areas of PCB unit specimen was confirmed.

Fusing Current Characterization of AU Wire Bonds for Hybrid Microcircuits in Aerospace Environment

Wire bonding is one of the major as well as critical processes in the realization of Hybrid microcircuits (HMCs), Microwave Integrated Circuits (MICs) and Monolithic Microwave Integrated Circuits (MMIC) where fine gold or aluminum wires are used. Selection of fine wires in wire bonding depends upon the requirement of current carrying capability of the circuit and process feasibility. This article details the experimental study and analysis of wire bonds having various diameter, length as well as thermal effects. The effect of substrate also investigated taking into Alumina (96% and 99.6%) and Aluminium Nitride apart from effect of metallisation methodology encompassing sputtering and thick film screen-printed gold.

Facile electrochemical surface-alloying and etching of Au wires to enable high-performance substrates for surface enhanced Raman scattering

Surface-enhanced Raman Spectroscopy (SERS) is a nondestructive technique for rapid detection of analytes even at the single-molecule level. However, highly sensitive and reliable SERS substrates are mostly fabricated with complex nanofabrication techniques, greatly restricting their practical applications. A convenient electrochemical method for transforming the surface of commercial gold wires/foils into silver-alloyed nanostructures is demonstrated in this report. Au substrates are treated with repetitive anodic and cathodic bias in an electrolyte of thiourea, in a one-pot one-step manner. X-rays absorption fine structure (XAFS) spectroscopy confirms that the AuAg alloy is induced at the surface. The unique AuAg alloyed surface nanostructures are particularly advantageous when served as SERS substrates, enabling a remarkably sensitive detection of Rhodamine B (a detection limit of 10−14 ​M, and uniform strong response throughout the substrates at 10−12 ​M).

Technological sustainable materials and enabling in semiconductor memory industry: A review

This paper provides an overview of current and future deployment of recyclable direct materials and sustainable materials through recycling of interconnect metals used in semiconductor assembly and packaging. Also, with the aim to study the key technical barriers, challenges of deployment and its reliability performance of impacts of sustainable materials used in semiconductor device packaging, this paper lays out the importance of noble metals and polymeric materials in terms of its materials sustainability for the next decade. This article briefly reviews key aspects of recycled materials reliability concerns, deployment of recycled gold (Au) wire, recycled copper (Cu), and other noble metals in semiconductor packaging and assembly. Frontend chip fabrication sustainability issues and their corresponding countermeasures are covered in this review article as well.

Insulated, Passivated & Adhesively-Promoted Bond Wire Using All-in-One Al2O3 Coating

Insulated, Passivated & Adhesively-Promoted Bond Wire Using All-in-One Al2O3 Coating

Hybrid neural interfacing devices based on Au wires with nanogranular Au shell and hydrogel layer for anti-inflammatory and bi-directional neural communications

Realizing a long-duration stable electrical contact with peripheral nerves in vivo is challenging due to the fragility and tubular shapes of peripheral nerves and the foreign body response caused by implanted devices at the nerve-device interface. Herein, we report the development of a hybrid neural interfacing device (HNID) based on Au wires with a nanogranular Au shell and hydrogel layer used to achieve a non-inflammatory, stable, and bi-directional bioelectronic interface with peripheral nerves. A natural hydrogel made up of genipin-crosslinked gelatin is developed to produce a three-dimensional network structure displaying excellent biocompatibility, sufficient ionic conductivity, and durable mechanical property. Neural electrodes based on Au wires with a nanogranular Au shell enable effective ionic/electrical coupling and neural communication with the nerve through the hydrogel layer. In in vivo studies involving rats, an implanted HNID suppresses the inflammatory response and fibrosis and causes negligible damage to the sciatic nerve, enabling stable stimulation of the nerve and recording of the neural signal of the sciatic nerve for 15 days after implantation. Our approach could extend the applicability of various inorganic electrode materials for the development of nerve-interfacing bioelectronics displaying high performance and long-term stability.

Temperature-dependence mechanical characteristics investigation of Cu wire and corresponding high strain rate plasticity behaviors enabled by Johnson–Cook constitutive model

Abstract The temperature-dependence mechanical characteristics of 4N Cu wire with 25, 30 and 38 μm diameters are investigated via the utilization of micro-tensile tests. Measured data revealed that the concerned mechanical characteristics, Young's modulus and yield stresses, are significantly degraded under high testing temperature, and the variation of aforementioned characteristics degradation are almost linear proportional to the temperature increment. Trapezoidal and standard triangle loop formation of Cu wire are simulated based on the finite element method, the simulated looping profiles of Cu wires are compared to the Au wires and the Cu wire is regarded as the improved solution for the high loop height wire formation. Moreover, the Johnson–Cook constitutive model is utilized to describe the plasticity of Cu wire in accordance with the experimental data under different temperature levels. Accordingly, the comprehensive mechanical characteristics’ investigation of 4N Cu wire are systemically demonstrated and explored.

A flexible and self-supported nanoporous gold wire electrode with a seamless structure for electrochemical ascorbic acid sensor

A flexible and self-supported nanoporous gold (S/NP-Au) has been produced using a simple, green, and quick approach for the electrochemical detection of l-ascorbic acid (AA). The dealloying process was used to create the main porous gold wire, and then electrochemical anodizing was adopted to construct the fine structure for nanoporous electrode. Furthermore, followed by chemical reduction with the enediol group in AA, the surface of S/NP-Au wire changed from a laminated to a scattered structure, and the preferred Au (2 0 0) high-index plane was investigated. As a result of synergistic electrocatalytic activity of Au wire skeleton towards AA, amperometric AA electrochemical sensors based on the S/NP-Au wire electrodes exhibit linear detection ranges with ultrahigh sensitivities at a low potential of 0.20 V (vs Ag. AgCl). The detection range of 0.3 μM–923.3 μM with a short response time of less than 1 s gives rise to ultralow detection limit of 26.3 nM (S/N = 3). The excellent characteristics of this sensor demonstrates it is a useful tool for accurate determination of AA in commercially available beverages such as water-soluble beverages with recoveries of 97.35 % to 110.7 %. The S/NP-Au electrode is a promising material for non-enzymatic AA detection.

Structural Evolution of Au Electrodes during Cathodic Corrosion: Initial Stages of Octahedral-Nanocrystal Growth

Cathodic corrosion of Au wires in highly concentrated NaOH (5–20 M) is systemically investigated to monitor the structural transformation as a function of applied electrode potential, polarization time, and electrolyte concentration. Current–potential curves for the restructured Au electrodes in 0.1 M H2SO4 demonstrate preferential (111)-orientation of nanofacets and an increase in electrochemically active surface area as a function of the applied parameters. SEM shows that polarizing the Au surfaces at sufficiently negative potentials leads to the growth of nanosized octahedral and triangular crystallites that can be tailored by varying NaOH concentrations. The nanocrystal growth occurs through dissolution and metal redeposition. The formation of etching pits indicates that Au dissolution is dominating during the initial stages of cathodic corrosion. The number of nanocrystals increases at more negative potentials due to the greater nucleation density induced by the higher concentration of dissolved Au species. Polarization times above 5.0 min result in fractal growth indicated by the appearance of multi-armed nanostructures. This work not only advances our understanding of the initial stages of nanocrystal formation but also offers a powerful means for controlling the shape and size of metal nanocrystals simply by the rational design of the cathodic corrosion.

Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment.

The long-term application of sensors in a high-temperature environment needs to address several challenges, such as stability at high temperatures for a long time, better wiring interconnection of sensors, and reliable and steady connection of the sensor and its external equipment. In order to systematically investigate the reliability of thin coatings at high temperatures for a long time, Au and Cr layers were deposited on silicon substrates by magnetron sputtering. Additionally, samples with different electrode thicknesses were annealed at different temperatures for a varied duration to study the effect of electrode thickness, temperature, and duration on the reliability of samples. The results of tensile and probe tests before and after heat treatment revealed that the mechanical strength and electrical properties have changed after annealing. In addition, the bonding interface was analyzed by a cross-sectional electron microscope. The analysis showed that long-term continuous high-temperature exposure would result in thinning of the electrode, formation of pores, recrystallization, and grain growth, all of which can affect the mechanical strength and electrical properties. In addition, it was observed that increasing the thickness of the gold layer will improve reliability, and the test results show that although the thin metal layer sample is in poor condition, it is still usable. The present study provides theoretical support for the application of thin coatings in high temperatures and harsh environments.

Detailed Mechanistic Studies of Electrochemical Reactions on Pt and Au Electrodes in Solid Oxide Cells Via EIS Data Analysis

In order to reduce the environmental impact of fossil fuels, a range of sustainable technologies for power generation and storage are currently being developed. In addition, efficient and low-cost methods for CO2 capture and conversion to form useful products are critically needed. One of the promising technologies towards achieving these goals involves the use of solid oxide cells (SOC), which are unique devices that can be employed in both the fuel cell mode for clean power generation and in the electrolysis mode to achieve CO2 conversion through its electrochemical reduction (‘CO2RR’).One of the burning problems that is impeding SOC implementation is catalyst selection, with many promising materials having been reported over the last 50 years, including metals and mixed ionic and electronic conducting (MIEC) metal oxide materials. However, the reasons for better or worse activity, as well as the mechanism of the CO2RR at these catalysts remains unknown and it is often unclear what factors limit the catalyst activity during cell operation and how this can be improved. This is due, in part, to the limited number of techniques that can be used to evaluate these performance metrics, especially at high operating temperatures. One of the most useful techniques is electrochemical impedance spectroscopy (EIS). However, data interpretation is often quite complex and thus other methods, such as CNLS fitting or the determination of the distribution of relaxation times (DRT), are needed.While CNLS fitting allows the fit parameters to be correlated with specific physical properties, a precise model of the system is required. Since SOC systems are relatively unexplored and good models are not yet available, this could lead to the mis-interpretation of the EIS data. DRT, on the other hand, can be a useful tool since it does not require any pre-existing models of the system. Unlike CNLS fitting, DRT can provide the correct number of time constants present (from the number of peaks obtained), as well as the associated resistance and capacitance values. According to the literature, each peak is typically related to a specific reaction step with a unique capacitance value, identified by changing conditions such as temperature, polarization or gas composition.In the present work, DRT analysis of Pt and Au electrodes on YSZ electrolytes was carried out in order to determine the origin of each resistance and to determine the effect of temperature, electrode polarization and gas composition on both the resistance and capacitance values. Here, both porous and point metal electrodes were investigated as no double phase boundary activity or chemical capacitance effects should be present, making data interpretation less complex. Furthermore, to avoid the challenges of porous electrodes, point electrodes, produced by pressing the metal wire to a flat YSZ surface by applying pressure with a spring, followed by softening at 1100 °C to achieve better contact, were used to achieve a controllable triple phase boundary (TPB) length. This allowed the true activity of the metal/YSZ TPB to be measured as a function of reactive interface length, rather than just per geometric surface area. Porous electrodes were also studied, made by depositing Pt or Au paste onto YSZ, followed by sintering at 600 °C for 20 min. Polymeric YSZ precursors were then infiltrated into the metallic backbone, then sintered at 750 °C for 2 hours. Then, a thin layer of the same metal paste was applied in order to provide better conductivity. The point electrodes were made by attaching 0.3 mm thick Pt and Au wires onto dense and flat YSZ electrolyte by a spring-loaded cell holder, then held at 1050 °C for 1 hour to soften and produce a fixed TPB length. Electrochemical testing of the porous electrodes was conducted at 750 °C in both half- full cell modes in air, CO2 and CO2/CO mixtures, while the wires were tested at 650-750°C in the same gases, but in half-cell mode.8 individual process were seen for both the porous and point electrodes, including both electrodes in each cell. The time constant with the smaller capacitors are likely related to the electrode-electrolyte interface, while the mid-range capacitors are associated with electrode surface processes, such as surface diffusion, molecular species dissociation, and adsorption. The high capacitance steps are likely related to gas-phase processes, such as gas diffusion and the possible presence of a conversion layer. More detailed analysis of polarization and gas atmosphere dependence is ongoing in order to confirm the nature of each process.

Transition Metal Doping of La0.3Ca0.7Fe0.7Cr0.3O3-δ for Nanoparticle-Enhanced Reversible CO2-CO Electrocatalysis

Fluctuations in supply and demand result in wasted energy during off-peak electric grid hours, with Reversible Solid Oxide Cells (RSOCs) potentially providing an efficient means by which such energy can be stored to create a highly sustainable grid.1 A RSOC can catalyze reactions such as the CO2 Reduction Reaction (CO2RR) by operating in the Solid Oxide Electrolysis Cell (SOEC) mode when energy supply is high, or in the Solid Oxide Fuel Cell (SOFC) mode when demand is high while oxidizing CO.1 The estimated yearly energy storage requirement is about 2-3 months per year, with RSOCs capable of achieving this goal.1 Single phase perovskite materials with the composition La0.3M0.7Fe0.7Cr0.3O3-δ (M = Sr, Ca) (LMFCr) have emerged as promising electrocatalysts for both fuel and oxygen electrodes in symmetrical RSOCs due to their phase stability in air and fuels (pO2 ~ 0.21 – 10-21 atm) and their compatibility with doped ceria-buffered yttria- and scandia-stabilized zirconia (YSZ/SSZ) electrolytes.2,3 The Ca analogue of LMFCr (LCFCr) has generally shown better performance and compatibility with other cell components,3 with significant efforts directed towards further enhancing its CO2RR activity by employing various approaches, including nanoscale modifications.4 One such technique is nanoparticle (NP) exsolution, which can greatly increase the catalytic surface area.5 This method employs B-site doping with Ni or Co followed by exposure to reducing conditions to decorate the catalyst surface with B-site metal alloy NPs.4 These are strongly anchored to the bulk material, highly resistant to coking, and stable under the harsh conditions of RSOCs.4 In our initial work, the exsolution characteristics of Fe-Ni NPs from 5% Ni-doped LCFCr (LCFCrN) were studied in H2:N2 and CO2:CO atmospheres using ex situ XRD, SEM, and STEM-EDS.4 Exsolution kinetics were rapid in H2:N2 (pO2 ~ 10-23 atm) at 800 °C with NPs assuming an average size of 45 nm and an Fe-rich Fe0.64Ni0.36 composition within 1 h exposure to 5H2:95N2. On the other hand, 70CO:30CO2 atmospheres (pO2 ~ 10-20 atm) gave sluggish kinetics with the NPs achieving an average size of 40 nm and a Ni-rich FeNi3 composition even after more than 25 hours of treatment. This suggests stability to coarsening in highly reducing atmospheres.4 In more recent work, 5% Co-doped LCFCr (LCFCrCo) perovskites show visible Fe-Co NP formation at 800 °C upon exposure to 5H2:95N2 for at least 1 h or to 70CO:30CO2 for at least 5 h.Electrochemical characterization of Fe-Ni NP decorated LCFCrN (Fe-Ni@LCFCrN) was conducted on 2.5 cm diameter cells using ceria-buffered SSZ electrolyte. A LCFCrN ink was screen-printed onto a ~0.5 cm2 area on both sides of the cell followed by sintering at 1100 °C for 2 h. Au was painted onto each electrode, and the cell was sintered again at 825 °C for 1 h. Electrical connections were made via Au gauzes and wires. NP exsolution was induced by exposing the fuel electrode to 5H2:95N2 for 2 h at 800 °C. Various CO2:CO mixtures (100:0, 90:10, 70:30, 50:50) were supplied to the fuel electrode while air was supplied to the oxygen electrode with flow rates of 50 mL/min. Electrochemical performance was tested via cyclic voltammetry (CV), electrochemical impedance spectroscopy (EIS), and chronoamperometry. CVs showed that the NPs enhanced LCFCrN activity for CO2RR (~ 15%) and more notably for CO oxidation (~ 75%) at the same overpotential (~ 0.7 V), making the catalyst equally active for the two reactions. 15-minute potentiostatic tests indicated stable current densities of about –0.65, –0.634, and –0.618 A/cm2 in 100% CO2, 90CO2:10CO, and 70CO2:30CO respectively at a cell potential of 1.6 V. Medium-term (10 h) potentiostatic tests for CO2RR indicated excellent stability with a current density of –0.28 A/cm2 at a cell potential of 1.3 V in 70CO2:30CO (pO2 ~ 10-18 atm). The excellent electrochemical performance in both the SOFC and SOEC modes makes Fe-Ni@LCFCrN a very promising electrode material for RSOCs. Further work on LCFCrCo is underway, with comparisons being made between LCFCrN and LCFCrCo on CO2-CO electrocatalysis and NP characteristics. References Jensen, S. H.; Graves, C.; Mogensen, M.; Wendel, C.; Braun, R.; Hughes, G.; Gao, Z.; Barnett, S. A. Energy Environ. Sci. 8, 2471 (2015).Molero-Sánchez, B.; Addo, P.; Buyukaksoy, A.; Paulson, S.; Birss, V. I. Faraday Discuss. 182, 159 (2015).Molero-Sánchez, B.; Prado-Gonjal, J.; Avila-Brande, D.; Chen, M.; Moran, E.; Birss, V. I. J. Hydrog. Energy. 40, 1902 (2015).Ansari, H. M.; Bass, A. S.; Ahmad, N.; Birss, V. I. Mater. Chem. A (2022).Zhu, Y.; Dai, J.; Zhou, W.; Zhong, Y.; Wang, H.; Shao, Z. Mater. Chem. A. 6, 13582 (2018).