Study of bonding parameters with Al and Au wires on Pd and Ag coatings

Abstract

The process of electrical connection with gold and aluminium wires to palladium and silver electrodes is studied. Parameters of the wire bonding, such as bond force, ultrasonic power, bond time and temperature of the layers, controlled by heating the substrate are varied to explore the reliability of the bonds in terms of mechanical strength, electrical conductivity and interdiffusion of particles between the electrode and functional material at different bonding conditions. The importance of this study is due to the need of electrical connectivity at the stage of wiring and packaging of gas sensors with a novel organic nanomaterial (carbyne), requiring different types of electrodes – Ohmic or Schottky - according to the measurement principle and sensor architecture. Pd and Ag are identified as the most suitable for Ohmic and Schottky contacts, respectively, because of their favourable energy level alignment at the organic/metal interface. The chosen method for bonds testing is measurement of the pull force causing bond failure. The results show that Pd coating was bondable by Au wire, and Ag coating by Al wire, as well as Au on Pd bonds have 4 times higher strength. It is found that the bonding procedure doesn’t affect negatively on the Au/Pd/carbyne interface in terms of diffusion and redistribution of metal particles, but Al/Ag/carbyne is characterized by poor adhesion and the bonds are peeled-off. The results give new knowledge for the fabrication of advanced gas sensors and for the interaction of the carbyne with different metals, which will serve as a base for further optimization of the manufacturing technology toward their commercialization.