Abstract
This paper provides an overview of current and future deployment of recyclable direct materials and sustainable materials through recycling of interconnect metals used in semiconductor assembly and packaging. Also, with the aim to study the key technical barriers, challenges of deployment and its reliability performance of impacts of sustainable materials used in semiconductor device packaging, this paper lays out the importance of noble metals and polymeric materials in terms of its materials sustainability for the next decade. This article briefly reviews key aspects of recycled materials reliability concerns, deployment of recycled gold (Au) wire, recycled copper (Cu), and other noble metals in semiconductor packaging and assembly. Frontend chip fabrication sustainability issues and their corresponding countermeasures are covered in this review article as well.
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