The thermal properties of a building envelope are key indicators of the energy performance of the building. Therefore, methods are needed to determine quantities like the thermal transmittance (U-value) or heat capacitance in a fast, reliable way and with as little impact on the use of the building as possible. In this paper a technique is proposed that relies on a simplified electrical analogical model of building envelope components which can cover their dynamic thermal behavior. The parameters of this model are optimized to produce the best fit between simulated and measured outside surface temperatures. As the temperatures can be measured remotely with an infrared camera this approach requires significantly less installation effort and intrusion in the building than other methods. At the same time, a single measurement provides data for a large range of locations on a facade or a roof. The paper describes the method and a first experimental implementation of it. The experiment indicates that this method has the potential to produce results which have an accuracy that is comparable to standardized reference methods.