Ceramic whiskers reinforced composites are widely used in electrical, medical, and constructional applications due to their desirable strengths, hardness, and wear characteristics. In this study, to examine the wear and friction characteristics, the pressureless infiltrated Cu–SiC composites with different content of SiC whiskers were roll bonded to Al layer. According to SEM images, the SiC whiskers were distributed across the microstructure although they were aligned along rolling direction. Incorporation of SiC whiskers to Cu matrix led to rise of composites’ strengths, young moduli, and hardness values. The measured values of Al and Cu–SiC layers increased from 50 HV to 135 HV in Al/Cu–SiC (5 wt%) to 57 HV and 159 HV in Al/Cu–SiC (15 wt%). Ductile type of fracture along with dimples, delamination, and debonding of whiskers appeared on fracture surfaces. However, more debonding of SiC whiskers was observed as SiC content increased. Accordingly, mass loss decreased and less adhesive wear mechanism was observed. The mass loss decreased from 6.3 mg in Al/Cu–SiC (5 wt%) to 5.2 mg in Al/Cu–SiC (15 wt%).