The effects of ultrasonic waves on the electrodeposition of copper have been investigated at 200 and 1000 kc/sec with copper sulfate-sulfuric acid plating baths of various concentrations. The ultrasonic waves produce an appreciable decrease in the potential at which the metal is deposited. X-ray diffraction studies by the glancing-beam technique indicate an increase in the tendency for preferred orientation of the crystals in the deposits from dilute solutions. These effects are explained primarily in terms of the disruption of the concentration gradients at the electrode surface by the ultrasonic waves. Schlieren photographs of these gradients support these conclusions.
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