100-mm Si Research Articles

Effect of precursor stoichiometry on morphology, phase purity, and texture formation of hot filament CVD diamond films grown on Si (100) substrate

The effect of precursor stoichiometry is reported on morphology, phase purity, and texture formation of polycrystalline diamond films. The diamond films were deposited on 100-mm Si (100) substrates using hot filament chemical vapor deposition at substrate temperature 720–750 °C using a mixture of methane and hydrogen. The gas mixture was varied with methane concentrations 1.5% to 4.5%. Diamond film thickness and average grain size both increase with increasing methane concentration. Diamond quality was checked using surface and cross-section by ultraviolet micro-Raman spectroscopy. The data show consistent diamond properties across the surface of the film and along the cross-section. XRD pole figure analyses of the films show that 3.0% methane results in preferential orientation of diamond in the 〈111〉 direction, whereas films deposited with 4.5% methane showed texture along the 〈220〉 direction in addition to 〈111〉 which was tilted ~ 23° with respect to the surface normal.

GaN Schottky Metal–Semiconductor–Metal UV Photodetectors on Si(111) Grown by Ammonia-MBE

For the development of GaN-based ultraviolet (UV) photodetectors, a simple epilayer structure consisting of GaN (600 nm)/AlN (200 nm) was grown on 100-mm Si substrate using ammonia-molecular beam epitaxy growth technique. The epilayers were crack-free and showed good surface and optical quality. Metal-semiconductor-metal (MSM) interdigitated Schottky-based contacts, fabricated using Ni/Au metallic layers, showed a low dark current of 0.43 nA at 15 V. The analysis of dark current as a function of applied bias revealed that the major current conduction mechanism was through thermionic emission over a Schottky barrier of 0.902 eV. Moreover, the Schottky barrier was found to reduce with the bias, which has been attributed to the image force reduction in the devices. The MSM devices exhibited a peak responsivity of 0.183 A/W at an incident wavelength of 362 nm with a UV/visible rejection ratio of 170. The peak responsivity corresponds to external quantum efficiency of ~70%. The devices also showed good linearity and almost flat responsivity with input power for the applied bias beyond 7 V.

Study on GaN buffer leakage current in AlGaN/GaN high electron mobility transistor structures grown by ammonia-molecular beam epitaxy on 100-mm Si(111)

The effect of carbon doping on the structural and electrical properties of GaN buffer layer of AlGaN/GaN high electron mobility transistor (HEMT) structures has been studied. In the undoped HEMT structures, oxygen was identified as the dominant impurity using secondary ion mass spectroscopy and photoluminescence (PL) measurements. In addition, a notable parallel conduction channel was identified in the GaN buffer at the interface. The AlGaN/GaN HEMT structures with carbon doped GaN buffer using a CBr4 beam equivalent pressure of 1.86 × 10−7 mTorr showed a reduction in the buffer leakage current by two orders of magnitude. Carbon doped GaN buffers also exhibited a slight increase in the crystalline tilt with some pits on the growth surface. PL and Raman measurements indicated only a partial compensation of donor states with carbon acceptors. However, AlGaN/GaN HEMT structures with carbon doped GaN buffer with 200 nm thick undoped GaN near the channel exhibited good 2DEG characteristics.

Growth and characterization of AlGaN/GaN/AlGaN double-heterojunction high-electron-mobility transistors on 100-mm Si(111) using ammonia-molecular beam epitaxy

To improve the confinement of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) heterostructures, AlGaN/GaN/AlGaN double heterojunction HEMT (DH-HEMT) heterostructures were grown using ammonia-MBE on 100-mm Si substrate. Prior to the growth, single heterojunction HEMT (SH-HEMT) and DH-HEMT heterostructures were simulated using Poisson-Schrödinger equations. From simulations, an AlGaN buffer with “Al” mole fraction of 10% in the DH-HEMT was identified to result in both higher 2DEG concentration (∼1013 cm−2) and improved 2DEG confinement in the channel. Hence, this composition was considered for the growth of the buffer in the DH-HEMT heterostructure. Hall measurements showed a room temperature 2DEG mobility of 1510 cm2/V.s and a sheet carrier concentration (ns) of 0.97 × 1013 cm−2 for the DH-HEMT structure, while they are 1310 cm2/V.s and 1.09 × 1013 cm−2, respectively, for the SH-HEMT. Capacitance-voltage measurements confirmed the improvement in the confinement of 2DEG in the DH-HEMT heterostructure, which helped in the enhancement of its room temperature mobility. DH-HEMT showed 3 times higher buffer break-down voltage compared to SH-HEMT, while both devices showed almost similar drain current density. Small signal RF measurements on the DH-HEMT showed a unity current-gain cut-off frequency (fT) and maximum oscillation frequency (fmax) of 22 and 25 GHz, respectively. Thus, overall, DH-HEMT heterostructure was found to be advantageous due to its higher buffer break-down voltages compared to SH-HEMT heterostructure.

High-Performance M/LWIR Dual-Band HgCdTe/Si Focal-Plane Arrays

Mercury cadmium telluride (HgCdTe) grown on large-area silicon (Si) substrates allows for larger array formats and potentially reduced focal-plane array (FPA) cost compared with smaller, more expensive cadmium zinc telluride (CdZnTe) substrates. In this work, the use of HgCdTe/Si for mid- wavelength/long-wavelength infrared (M/LWIR) dual-band FPAs is evaluated for tactical applications. A number of M/LWIR dual-band HgCdTe triple-layer n-P-n heterojunction device structures were grown by molecular-beam epitaxy (MBE) on 100-mm (211)Si substrates. Wafers exhibited low macrodefect densities (< 300 cm−2). Die from these wafers were mated to dual-band readout integrated circuits to produce FPAs. The measured 81-K cutoff wavelengths were 5.1 μm for band 1 (MWIR) and 9.6 μm for band 2 (LWIR). The FPAs exhibited high pixel operability in each band with noise-equivalent differential temperature operability of 99.98% for the MWIR band and 98.7% for the LWIR band at 81 K. The results from this series are compared with M/LWIR FPAs from 2009 to address possible methods for improvement. Results obtained in this work suggest that MBE growth defects and dislocations present in devices are not the limiting factor for detector operability, with regards to infrared detection for tactical applications.

Strain states of AlN/GaN-stress mitigating layer and their effect on GaN buffer layer grown by ammonia molecular beam epitaxy on 100-mm Si(111)

The effect of strain states of AlN/GaN-stress mitigating layer (SML) on buried crack density and its subsequent influence on the residual stresses in GaN buffer layers grown using ammonia-molecular beam epitaxy on 100-mm Si(111) substrate has been investigated. Different stages involved in the formation of buried cracks, which are crack initialization, growth of relaxed AlN layer, and subsequent lateral over growth, are identified using in-situ curvature measurements. While the increase of GaN thickness in AlN/GaN-SML enhanced its compressive strain relaxation and resulted in reduced buried crack spacing, the variation of AlN thickness did not show any effect on the crack spacing. Moreover, the decrease in the crack spacing (or increase in the buried crack density) was found to reduce the residual compression in 1st and 2nd GaN layers of AlN/GaN-SML structure. The higher buried crack density relaxed the compressive strain in 1st GaN layer, which further reduced its ability to compensate the tensile stress generated during substrate cool down, and hence resulted in lower residual compressive stress in 2nd GaN layer.

Origin of tensile strain in GaN grown on AlGaN/AlN stress mitigating layers on 100-mm Si (1 1 1) by ammonia molecular beam epitaxy

AbstractThe origin of tensile strain in GaN grown on AlGaN/AlN stress mitigating layers on 100-mm Si (111) was investigated by varying the AlGaN growth temperature. GaN grown on higher AlGaN growth temperature exhibited two dimensional growth mode while three dimensional growth mode was obtained for GaN grown on lower AlGaN growth temperature. Micro-Raman and high-resolution X-ray diffraction techniques were employed to measure the residual tensile strain in GaN. The average plastic relaxation was calculated to obtain the tensile strain in GaN due to dislocation looping. The measured and calculated residual tensile strain values were compared to determine the origin of tensile strain. The average plastic relaxation and the tensile strain generated due to the grain coalescence were found to be the major factors influencing the strain states of GaN grown on AlGaN/AlN stress mitigating layers, in addition to the tensile strain generated due to the thermal mismatch.

Uniform Wafer-Scale Chemical Vapor Deposition of Graphene on Evaporated Cu (111) Film with Quality Comparable to Exfoliated Monolayer

This article demonstrated monolayer graphene grown on annealed Cu (111) films on standard oxidized 100-mm Si wafers with higher quality than existing reports. Large area Raman mapping indicated high uniformity (>97% coverage) of monolayer graphene with immeasurable defects (>95% defect-negligible) across the entire wafer. Key to these results is the phase transition of evaporated copper films from amorphous to (111) preferred crystalline, which resulted in subsequent growth of high quality graphene, as corroborated by X-ray diffraction and electron backscatter diffraction. Noticeably, such phase transition of the copper film was observed on a technologically ubiquitous Si wafer with a standard amorphous thermal oxide. A modified two-step etching transfer process was introduced to preserve the clean surface and electrical property of transferred monolayer graphene. The fabricated graphene field effect transistor on a flexible polyimide film achieved peak mobility over 4900 cm2/(V s) at ambient condition.

Sub-1-dB Minimum-Noise-Figure Performance of GaN-on-Si Transistors Up to 40 GHz

We report on the millimeter-wave noise performance of AlN/GaN/AlGaN double heterostructure (DHFET) grown on a 100-mm Si substrate with low-noise properties up to 40 GHz. The ultrathin-barrier GaN DHFETs simultaneously exhibit high current density, high transconductance, and high frequency performance (above 100 GHz) while showing low dc-to-RF dispersion and low gate and drain leakage currents. Consequently, sub-1-dB minimum noise figure at 36 GHz with an associated gain of 7.5 dB has been achieved. To our knowledge, this is the best noise performance reported in the Ka-band for any GaN device.

Structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm Si (111) by ammonia molecular beam epitaxy

The structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm diameter Si (111) substrate by ammonia molecular beam epitaxy have been reported. High resolution X-ray diffraction, micro-Raman spectroscopy, transmission electron microscopy and secondary ion mass spectroscopy have been used to study the influence of AlN thickness and AlGaN growth temperature on the quality of GaN. GaN grown on thicker AlN showed reduced dislocation density and lesser tensile strain. Three-dimensional growth regime was observed for GaN grown at lower AlGaN growth temperature while higher AlGaN growth temperature resulted in two-dimensional growth mode. The dislocation bending and looping at the AlGaN/AlN interface was found to have significant influence on the dislocation density and strain in the GaN layer. The evolution and interaction of threading dislocations play a major role in determining the quality and the strain states of GaN.

Low-Noise Microwave Performance of AlN/GaN HEMTs Grown on Silicon Substrate

Microwave noise performance of state-of-the-art AIN/GaN high-electron-mobility transistors (HEMTs) grown on 100-mm Si substrate has been investigated. DC and RF measurements show the outstanding potential of this structure for high power millimeter-wave (mmW) applications. A maximum output current density of about 2 A/mm, together with a low gate leakage current, and a record GaN-on-Si extrinsic transconductance above 600 mS/mm are demonstrated. The current gain cutoff frequency f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> and the maximum oscillation frequency f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> were 85 and 103 GHz, respectively, with a 0.16-μm gate length. At V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DS</sub> = 4 V, the device exhibits a minimum noise figure (NF <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">min</sub> ) of 1 dB (1.8 dB) with an associated gain (G <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">A</sub> ) of 12 dB (10 dB) at 10 GHz (18 GHz) favorably comparable to the best reported GaN-on-Si HEMTs. These results show that AIN/GaN HEMTs grown on silicon substrate are promising for the integration of cost effective, low noise, and high power mmW amplifiers.

High-Performance Low-Leakage-Current AlN/GaN HEMTs Grown on Silicon Substrate

In this letter, ultrathin-barrier AlN/GaN high-electron mobility transistors (HEMTs) capped with in situ metal-organic-chemical-vapor-deposition-grown SiN have been successfully fabricated on 100-mm Si substrates. Output current density exceeding 2 A/mm has been reached, which represents, to the best of our knowledge, the highest value ever achieved for GaN-on-Si HEMTs. This results from the high 2DEG density of the optimized AlN/GaN heterostructure. Despite the ultrathin barrier of 6 nm, low gate and drain leakage currents of about 10 μA/mm are obtained without the use of a gate dielectric that generally induces reliability issues. Furthermore, the high aspect ratio (gate length <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">g</sub> /gate-to-channel distance) and low RF losses (at the buffer/Si substrate interface) are reflected in excellent RF performances. The current gain extrinsic cutoff frequency <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">f</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> and the maximum oscillation frequency <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">f</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> were 52 and 102 GHz with a 0.2- μm gate length, respectively, resulting in an <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">f</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> · <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">g</sub> product as high as the reported state-of-the-art GaN-on-Si HEMTs.

Novel E-Mode GaN-on-Si MOSHEMT Using a Selective Thermal Oxidation

A novel normally-off AIN/GaN metal-oxide-semiconductor high electron mobility transistors (MOSHEMT) on 100-mm Si substrates for high-power applications is demonstrated for the first time by means of a selective thermal oxidation of AIN. The formation of a high-quality insulating AION layer resulting from the dry thermal oxidation of AIN at 900 °C in oxygen has been identified by transmission electron microscopy and X-ray photoelectron spectroscopy. The AIN thermal oxidation appears to be highly selective toward the SiN cap layer allowing the local depletion of the 2-D electron gas (self-aligned to the gate) and thus the achievement of normally-off operation. Threshold voltage (VT) of +0.8 V and drain leakage current at VGS = 0 V well below 1 μA/mm are obtained reproducibly over the wafer. The comparison of the fabricated MOSHEMTs with the control sample (identical but nonoxidized) reveals a drastic shift of VT toward positive values and three to four orders of magnitude drain leakage current reduction.

High-Performance MWIR/LWIR Dual-Band 640 × 480 HgCdTe/Si FPAs

HgCdTe grown on large-area Si substrates allows for larger array formats and potentially reduced focal-plane array (FPA) cost compared with smaller, more expensive CdZnTe substrates. The goal of this work is to evaluate the use of HgCdTe/Si for mid-wavelength/long-wavelength infrared (MWIR/LWIR) dual-band FPAs. A series of MWIR/LWIR dual-band HgCdTe triple-layer n-P-n heterojunction (TLHJ) device structures were grown by molecular-beam epitaxy (MBE) on 100-mm (211)Si substrates. The wafers showed low macro-defect density (< 300 cm ―2 ) and was processed into 20-μm-unit-cell 640 x 480 detector arrays which were mated to dual-band readout integrated circuits (ROICs) to produce FPAs. The measured 80-K cutoff wavelengths were 5.5 μm for MWIR and 9.4 μm for LWIR, respectively. The FPAs exhibited high pixel operabilities in each band, with noise equivalent differential temperature (NEDT) operabilities of 99.98% for the MWIR band and 99.6% for the LWIR band demonstrated at 84 K.

Low On-Resistance High-Breakdown Normally Off AlN/GaN/AlGaN DHFET on Si Substrate

Ultrathin-barrier normally off AlN/GaN/AlGaN double-heterostructure field-effect transistors using an in situ SiN cap layer have been fabricated on 100-mm Si substrates for the first time. The high 2DEG density in combination with an extremely thin barrier layer leads to enhancement-mode devices with state-of-the-art combination of specific on-resistance that is as low as 1.25 m¿·cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and breakdown voltage of 580 V at <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GS</sub> = 0 V . Despite the 2-¿m gate length used, the transconductance peaks above 300 mS/mm. Furthermore, pulsed measurements show that the devices are dispersion free up to high drain voltage <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DS</sub> = 50 V. More than 200 devices have been characterized in order to confirm the reproducibility of the results.

Silicon-Supported Membranes for Improved Large-Area and High-Density Micro/Nanostencil Lithography

<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> In this paper, the fabrication and use of stencils for full-wafer scale shadow mask (stencil) lithography is described. The stencils fabricated via microelectromechanical systems are mechanically stabilized and show clearly reduced stress-induced membrane deformation, which translates into a more accurate surface pattern definition. Solid-state SiN membranes 500 nm thick and up to 1 &lt;formula formulatype="inline"&gt;&lt;tex&gt;${\hbox{mm}}^{2}$&lt;/tex&gt;&lt;/formula&gt; in size having a 20-&lt;formula formulatype="inline"&gt;&lt;tex&gt;$\mu{\hbox{m}}$&lt;/tex&gt; &lt;/formula&gt;-thick silicon support rim following the outline of the stencil apertures were fabricated in a 100-mm Si wafer. The minimum aperture size presented in this paper is 3 &lt;formula formulatype="inline"&gt;&lt;tex&gt;$\mu{\hbox{m}}$&lt;/tex&gt; &lt;/formula&gt;. The increase of membrane stability was confirmed by depositing a highly stressed 35-nm-thick chrome layer. The results demonstrate a stability increase of the Si-supported compared to nonsupported membrane with identical shape by up to 89% as measured by the reduced out-of-plane deflection of overhanging membrane sections. Comparison by scanning electron microscopy and atomic force microscopy of the resulting micropatterns obtained by Cr deposition through both unsupported and Si-rim supported stencils shows better edge sharpness and clearer spatial details for surface patterns deposited through the stabilized stencil compared to those deposited through the nonsupported stencil. The improved stabilized stencils allow for large-area high-density surface patterning while maintaining membrane stability and pattern definition during stencil lithography. &lt;papernumber&gt;2006-0003&lt;/papernumber &gt; </para>

Nondestructive metrology for nanoimprint processes

We investigated two methods for imprinting metrology according to optical reflectance and transmittance of the imprinted substrates. We utilized the reflectance of two polarization states at 780nm for ∼100-nm polymer features with depth/width ratios&amp;gt;≈1 imprinted on ten 100-mm Si wafers. We not only successfully extracted the grating width, height, and residual polymer layers of the imprint but also assessed the uniformity and defects, as well as the aging of the templates from the same data. For transparent substrates, the optical test at shorter wavelengths clearly demonstrated a process monitor with 5-nm depth resolution for gratings of periods at 150nm with direct applicability to periods less than 50nm.

Control and growth of middle wave infrared (MWIR) Hg(1−x)CdxTe on Si by molecular beam epitaxy

Middle wave infrared (MWIR) HgCdTe p-on-n double-layer heterojunctions (DLHJs) for infrared detector applications have been grown on 100-mm Si (112) substrates by molecular beam epitaxy (MBE) for large format 2,560×512 focal plane arrays (FPAs). In order to meet the performance requirements needed for these FPAs, cutoff and doping uniformity across the 100-mm wafer are crucial. Reflection high-energy electron diffraction (RHEED), secondary ion mass spectrometry (SIMS), Fourier transform infrared spectrometry (FTIR), x-ray, and etch pit density (EPD) were monitored to assess the reproducibility, uniformity, and quality of detector material grown. Material properties demonstrated include x-ray full width half maximum (FWHM) as low as 64 arc-sec, typical etch pit densities in mid-106 cm−2, cutoff uniformity below 5% across the full wafer, and typical density of macrodefects <1000 cm−2. The detector quality was established by using test structure arrays (TSAs), which include miniarray diodes with the similar pitch as the detector array for easy measurement of critical parameters such as diode I-V characteristics and detector quantum efficiency. Typical I-V curves show excellent R0A products and strong reverse breakdown characteristics. Detector quantum efficiency was measured to be in the 60–70% range without an antireflection coating.

12 W/mm AlGaN–GaN HFETs on Silicon Substrates

Al/sub 0.26/Ga/sub 0.74/N-GaN heterojunction field-effect transistors were grown by metal-organic chemical vapor deposition on high-resistivity 100-mm Si (111) substrates. Van der Pauw sheet resistance of the two-dimensional electron gas was 300 /spl Omega//square with a standard deviation of 10 /spl Omega//square. Maximum drain current density of /spl sim/1 A/mm was achieved with a three-terminal breakdown voltage of /spl sim/200 V. The cutoff frequency and maximum frequency of oscillation were 18 and 31 GHz, respectively, for 0.7-/spl mu/m gate-length devices. When biased at 50 V, a 2.14-GHz continuous wave power density of 12 W/mm was achieved with associated large-signal gain of 15.3 dB and a power-added efficiency of 52.7%. This is the highest power density ever reported from a GaN-based device grown on a silicon substrate, and is competitive with the best results obtained from conventional device designs on any substrate.

A 2-Axis Comb-driven Micromirror Array for 3D MEMS Optical Switch

We present a new architecture of a 2-axis comb-driven micromirror array that combines a large deflection angle in a stationary operation, a low drive voltage, and easy scalability for a 3D MEMS optical switch. By using an SOI wafer with 100-mm thick top and bottom Si layers and a 1-mm buried oxide layer and, bulk micromachining with DRIE, we fabricated a 2-axis comb-driven micromirror array with a V-shaped torsion bar and comb teeth. To implement a 2-axis tilt motion, we fabricated a gold bump for creating a gap under the comb teeth on the electrode substrate and mounted the mirror array substrate onto the electrode substrate by using the flip-chip-transfer technique. We fabricated an 80 x 80 switch chip and achieved a +/-5 degree rotation of the 2-axis stationary operation with a 60-V drive voltage.