Abstract
The reliability and the bond strength of wire bonding electronic packages are appraised using wire bond shear test. In this study, a three-dimensional non linear finite element model was designed to simulate the stress response of the bonded wire during wire bond shear test on a flat surface bond pad. Comparisons between three types of wire material:gold (Au), aluminium (Al) and copper (Cu) were done to scrutinize the effects of wire material on the stress response of bonded wire during wire bond shear test. The simulation results showed that copper wire bond induces higher stress compared to aluminium and gold wire bond during wire bond shear test.
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