Abstract
Wire bonding method are utilized to facilitate the interconnection in the demanding development of integrated circuits. Wire bond shear test method is utilized in the industry to scrutinize the quality of the wire bond. This paper discusses about the simulation of wire bond shear test using aluminium wire. This study is focused on evaluating the effects of bond pad surface on the stress response of aluminium ball bond during wire bond shear test. The aluminium ball bond will bonded on three types of bond pad surface, flat surface, hemisphere surface and sharp groove surface and the stress response of each type of bond pad surface are then compared. The results obtained showed that the aluminium ball bond bonded to the sharp groove surface acquired the highest stress response of 311.55 MPa. The simulation was done using Ansys version 11.
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