Abstract
As the trend of integrated circuit is lashing towards miniaturized facet, wire bonding interconnection is still vastly being utilized in the first level of electronic packaging. The bond strength of the bonded wires is scrutinized by wire bond shear test. Hence in this paper, the effects of bond pad surface on the stress response of gold ball bond during wire bond shear test were investigated through simulation. Three types of bond pad surface, flat surface, hemisphere surface and sharp groove surface are utilized for comparison purpose in this study. Ansys version 11 was used for the simulation. The simulation results showed that the gold ball bond on sharp groove surface bond pad obtained the highest stress response. The maximum stress responses for all three types of bond pad surface were obtained at the shear ram displacement distance of 35µm.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
