Abstract
The aim of research consisted in the study of wettability of Sn-based solders on ceramic Al2O3 material by heating with electron beam, without flux application. The Sn-based solders alloyed with active elements such as Ti, La, Ce and Ga were applied for soldering. The active elements contained in solder oxidise in air during soldering. This problem can be eliminated by the application of an electron beam in a vacuum. Soldering consisted of 15 minutes heating to desired temperature, followed by dwelling on this temperature for 5 minutes and slowly cooling in a vacuum. The desired soldering temperature was 950 °C. The best wettability on Al2O3 substrate was achieved with SnAg3, 5Ti4 (Ce, Ga) solder, with a wetting angle of 62°. The interactions between the solder and substrate were identified in the joint interface, ensuring the creation of a stable bond.
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