Abstract
The aim of research consisted in the study of wettability of Sn-based solders on ceramic Al2O3 material by heating with electron beam without flux application. The Sn-based solders alloyed with active elements as Ti, La, Ce and Ga were applied for soldering. The active elements contained in solder volume oxidise during soldering in air. This problem can be eliminated by application of electron beam in vacuum. Soldering consisted of 15 minutes heating to desired temperature then dwelling on this temperature for 5 minutes and a slow cooling down in vacuum. The desired soldering temperature was 950 °C. The best wettability on Al2O3 substrate was achieved with SnAg3,5Ti4(Ce,Ga) solder, with wetting angle of 62°. The interactions between the solder and substrate were identified in the joint interface, ensuring the creation of a stable bond.
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