Wafer-bonded surface plasmon waveguide sensors with in-plane microfluidic interfaces

Abstract

Sensors exploiting long-range surface plasmon polariton (LRSPP) waveguides comprised of Au stripes embedded in Cytop with integrated and encapsulated microfluidic channels are fabricated and demonstrated. A fabrication approach was devised where the lower cladding and recessed Au stripes are fabricated on a Si supporting substrate, and the upper cladding and microfluidic channels are fabricated on a glass substrate, followed by wafer bonding to assemble the wafers into complete sealed structures. The bond is centered over the full length of the optical path, yet no evidence of optical scattering or excess loss due to the bond could be observed, and no evidence of a bonding interface could be discerned from high-magnification cross-sectional images. We also demonstrate wafer-scale fabrication of in-plane microfluidic inlets and outlets, along with a fixture for fluidic edge coupling that provides sealed interfaces to external fluidic tubing and components. In-plane microfluidic interfaces are automatically defined along chip facets upon wafer dicing, precluding the need to drill through holes in lids. The performance of the chips was assessed by measuring the attenuation of LRSPPs on fully cladded reference waveguides, on waveguides passing through microfluidic channels, and by measuring the response of sensors to changes in refractive index produced by injecting various sensing solutions. Our fabrication approach based on wafer bonding and in-plane fluidic interfacing is compelling for low-cost high-volume manufacturing.